DLA MIL-PRF-1 1427 G VALID NOTICE 1-2011 Electron Tube Power Type 8170W.pdf

上传人:livefirmly316 文档编号:691970 上传时间:2018-12-30 格式:PDF 页数:1 大小:9.65KB
下载 相关 举报
DLA MIL-PRF-1 1427 G VALID NOTICE 1-2011 Electron Tube Power Type 8170W.pdf_第1页
第1页 / 共1页
亲,该文档总共1页,全部预览完了,如果喜欢就下载吧!
资源描述

1、PERFORMANCE SPECIFICATIONElectron Tube, Power Type 8170WMIL-PRF-1/1427G, dated 16 July 2004, has been reviewed anddetermined to be valid for use in acquisition.Reviewer Activities: Navy - AS, CG, MC, OSAir Force - 99NOTICE OFVALIDATIONINCH-POUNDMIL-PRF-1/1427GNOTICE 120 July 2011NOTE: The activities

2、 above were interested in this document asof the date of this document. Since organizations andresponsibilities can change, you should verify the currency ofthe information above using the ASSIST Online database athttps:/assist.daps.dla.mil.AMSC N/A FSC 5960Custodians:Army - CRNavy - ECAir Force - 85DLA - CCPreparing Activity:DLA - CCProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-

展开阅读全文
相关资源
猜你喜欢
  • DIN EN 61191-1-2014 Printed board assemblies - Part 1 Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembl.pdf DIN EN 61191-1-2014 Printed board assemblies - Part 1 Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembl.pdf
  • DIN EN 61191-6-2011 Printed board assemblies - Part 6 Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (IEC 61191-6 2010) German version EN 61.pdf DIN EN 61191-6-2011 Printed board assemblies - Part 6 Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (IEC 61191-6 2010) German version EN 61.pdf
  • DIN EN 61192-1-2003 Workmanship requirements for soldered electronic assemblies - Part 1 General (IEC 61192-1 2003) German version EN 61192-1 2003《钎焊电子组件的工艺要求 第1部分 总则》.pdf DIN EN 61192-1-2003 Workmanship requirements for soldered electronic assemblies - Part 1 General (IEC 61192-1 2003) German version EN 61192-1 2003《钎焊电子组件的工艺要求 第1部分 总则》.pdf
  • DIN EN 61192-2-2003 Workmanship requirements for soldered electronic assemblies - Part 2 Surface-mount assemblies (IEC 61192-2 2003) German version EN 61192-2 2003《钎焊电子组件的工艺要求 第2部分.pdf DIN EN 61192-2-2003 Workmanship requirements for soldered electronic assemblies - Part 2 Surface-mount assemblies (IEC 61192-2 2003) German version EN 61192-2 2003《钎焊电子组件的工艺要求 第2部分.pdf
  • DIN EN 61192-3-2003 Workmanship requirements for soldered electric assemblies - Part 3 Through-hole mount assemblies (IEC 61192-3 2002) German version EN 61192-3 2003《钎焊电子组件的工艺要求 第.pdf DIN EN 61192-3-2003 Workmanship requirements for soldered electric assemblies - Part 3 Through-hole mount assemblies (IEC 61192-3 2002) German version EN 61192-3 2003《钎焊电子组件的工艺要求 第.pdf
  • DIN EN 61192-4-2003 Workmanship requirements for soldered electronic assemblies - Part 4 Terminal assemblies (IEC 61192-4 2002) German version EN 61192-4 2003《钎焊电子组件的工艺要求 第4部分 终端组件.pdf DIN EN 61192-4-2003 Workmanship requirements for soldered electronic assemblies - Part 4 Terminal assemblies (IEC 61192-4 2002) German version EN 61192-4 2003《钎焊电子组件的工艺要求 第4部分 终端组件.pdf
  • DIN EN 61192-5-2007 Workmanship requirements for soldered electronic assemblies - Part 5 Rework modification and repair of soldered electronic assemblies (IEC 61192-5 2007) German .pdf DIN EN 61192-5-2007 Workmanship requirements for soldered electronic assemblies - Part 5 Rework modification and repair of soldered electronic assemblies (IEC 61192-5 2007) German .pdf
  • DIN EN 61193-1-2002 Quality assessment systems - Part 1 Registration and analysis of defects on printed board assemblies (IEC 61193-1 2001) German version EN 61193-1 2002《质量评定体系 第1.pdf DIN EN 61193-1-2002 Quality assessment systems - Part 1 Registration and analysis of defects on printed board assemblies (IEC 61193-1 2001) German version EN 61193-1 2002《质量评定体系 第1.pdf
  • DIN EN 61193-2-2008 Quality assessment systems - Part 2 Selection and use of sampling plans for inspection of electronic components and packages (IEC 61193-2 2007) German version E.pdf DIN EN 61193-2-2008 Quality assessment systems - Part 2 Selection and use of sampling plans for inspection of electronic components and packages (IEC 61193-2 2007) German version E.pdf
  • 相关搜索

    当前位置:首页 > 标准规范 > 国际标准 > 其他

    copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
    备案/许可证编号:苏ICP备17064731号-1