1、 AMSC N/A FSC 59GP DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. MIL-STD-l580B w/CHANGE 3 DRAFTSUPERSEDING MIL-STD-l580B CHANGE 2 15 November 2013 DEPARTMENT OF DEFENSE TEST METHOD STANDARD DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTRO
2、MECHANICAL PARTS METRIC Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1580B w/CHANGE 3 ii FOREWORD 1. This standard is approved for use by all Departments and Agencies of the Department of Defense. 2. To ensure the required high quality of
3、parts used in the designs of space and launch vehicles, stringent in-process controls are imposed and a comprehensive test program is conducted on the completed parts. A key ingredient of the test program is the assessment of part lot quality based on the destructive examination of samples randomly
4、selected from each production lot. The destructive physical analysis (DPA) is used to inspect and verify the internal design, materials, construction, and workmanship of the part. It can also be used to monitor processes, for failure analysis, or to suggest corrective actions. The information derive
5、d from the DPA may be used: a. To preclude installation of parts having patent or latent defects; b. To aid in dispositioning parts that exhibit anomalies; c. To aid in defining improvement changes in design, materials, or processes; d. To evaluate supplier production trends. 3. Beneficial comments
6、(recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: DLA Land And Maritime ATTN: DLA Land and Maritime-VAT P.O. Box 3990 Columbus, Ohio 43218-3990 Since contact information can change, you may want to verify the currenc
7、y of this address information using the ASSIST Online database at https:/assist.dla.mil. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1580B w/CHANGE 3 iii SUMMARY OF CHANGE 3 MODIFICATIONS 1. Changed http:/assist.daps.dla.mil to https:/ass
8、ist.dla.mil. 2 Changed http:/assist.daps.dla.mil/quicksearch to http:/quicksearch.dla.mil. 3 Changed paragraph 18.5 to include Thick and Thin Film 4 Changed paragraph 18.5.1.1 to include defects called out in paragraph 18.5.3. 5 Add new paragraph 18.5.1.2, Sample Preparation. 6 Modified paragraph 18
9、.5.3 to be in accordance with MIL-PRF-55342. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1580B w/CHANGE 3 iv CONTENTS PARAGRAPH PAGE 1. SCOPE. 1 1.1 Purpose 1 1.2 Application of the standard. 1 2. APPLICABLE DOCUMENTS 1 2.1 General . 1 2.
10、2 Government documents 1 2.2.1 Specifications, standards, and handbooks. 1 2.2.2 Government documents, drawings, and publications. 3 2.3 Non-Government publications. 4 2.4 Order of precedence 4 3. DEFINITIONS 4 3.1 Contracting officer 4 3.2 Defect. 4 3.3 Destructive physical analysis. 4 3.4 Lot-rela
11、ted defect 4 3.5 Production lot (electronic parts). 4 3.6 Screenable defect . 4 3.7 Calibration 4 3.8 Acronyms. 5 3.9 Recycled, recovered, or environmentally preferable materials 5 4. GENERAL REQUIREMENTS 5 4.1 Sample size 5 4.1.1 DPA for a lot conformance test. 5 4.1.1.1 DPA sample criteria. 5 4.1.
12、1.2 Parallel tests 5 4.1.1.3 Combined samples 5 4.1.1.4 Utilization of rejects 5 4.1.2 Resampling . 5 4.2 DPA procedures. 6 4.2.1 Baseline sketch. 6 4.2.2 DPA data records 6 4.2.3 Test and inspection methods 6 4.2.3.1 External visual 6 4.2.4 Evaluation criteria 6 4.3 Radiography. 8 4.4 Disassembly a
13、nd sample preparation 8 4.4.1 Delidding. 8 4.4.2 Sectioned samples 8 4.4.3 Scanning Electron Microscopy samples. 8 4.5 Photographs/imagery 8 4.6 DPA residues/samples. 8 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1580B w/CHANGE 3 v PARAGR
14、APH PAGE 5. DETAILED REQUIREMENTS. 10 5.1 Detailed requirements 10 6. NOTES 10 6.1 Intended use 10 6.2 Tailored application 10 6.3 Documentation. 10 6.4 Subject term (key word) listing. 10 6.5 Changes from the previous issue. 10 FIGURE PAGE 4-1 Sample DPA summary sheet. 7 4-2 Example of flat pack de
15、lidding vise 9 REQUIREMENT 9 Detail requirements for prohibited materials analysis and incoming inspection of external package plating materials using X-ray fluorescence spectrometry or scanning electron microscopy with energy dispersive spectroscopy. 10 Detailed requirements for capacitors. 11 Deta
16、iled requirements for connectors. 12 Detailed requirements for quartz crystals. 13 Detailed requirements for diodes. 14 Detailed requirements for feed-through filters. 15 Detailed requirements for magnetic devices (inductors, transformers, and coils). 16 Detailed requirements for microcircuits (mono
17、lithic, hybrid, optocoupler, and multichip module). 17 Detailed requirements for relays. 18 Detailed requirements for resistors. 19 Detailed requirements for switches. 20 Detailed requirements for thermistors. 21 Detailed requirements for transistors. 22 Detailed requirements for selected RF devices
18、. 23 Detailed requirements for fuses. 24 Detailed requirements for heaters. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1580B w/CHANGE 3 1 1. SCOPE 1.1 Scope. This standard describes the general requirements for performance of destructive
19、 physical analysis (DPA) on samples of parts. In addition to the requirements for the analysis procedures, the general criteria for interpreting results, such as for the acceptance or rejection of associated production lots, is included for typical electronic, electromagnetic, and electromechanical
20、parts. 1.2 Application of the standard. This standard; is intended to be referenced, in detailed part specifications; or in other documents where DPA requirements are imposed, to assure that the practices, procedures, and criteria contained herein are uniformly applied. The requirements are intended
21、 to provide the general framework and basis for detailed DPA procedures for specific part types. 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3, 4, and 5 of this standard. This section does not include documents cited in other sections of this s
22、tandard or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements documents cited in sections 3, 4, and 5 of this standard, whether or not they are li
23、sted. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Departmen
24、t of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATIONS DEPARTMENT OF DEFENSE MIL-PRF-20 - Capacitor, Fixed, Ceramic Dielectric (Temperature Compensating), Established Reliability and Non-Established Reliability, General
25、 Specification for. MIL-PRF-27 - Transformers and Inductors, (Audio, Power, and High-Power Pulse), General Specification for. MIL-PRF-123 - Capacitors, Fixed, Ceramic Dielectric (Temperature Stable and General Purpose), High Reliability, General Specification for. MIL-PRF-3098 - Crystals Units, Quar
26、tz, General Specification for. MIL-PRF-6106 - Relays, Electromagnetic, General Specification for. MIL-PRF-14409 - Capacitors, Variable (Piston Type, Tubular Trimmer), General Specification for. MIL-PRF-15305 - Coils, Fixed or Variable, Radio Frequency, General Specification for. MIL-PRF-15160 - Fuse
27、s, Instrument, Power, and Telephone, General Specification for. MIL-PRF-15733 - Filters and Capacitors, Radio Frequency Interference, General Specification for. MIL-PRF-19500 - Semiconductor Devices, General Specification for. MIL-PRF-19978 - Capacitors, Fixed, Plastic (or Paper-Plastic), Dielectric
28、, (Hermetically Sealed in Metal, Ceramic, or Glass Cases) Established and Non-Established Reliability, General Specification for. MIL-PRF-21038 - Transformers, Pulse, Low Power, General Specification for. MIL-PRF-23269 - Capacitor, Fixed, Glass Dielectric, Established Reliability, General Specificat
29、ion for. MIL-PRF-23648 - Resistor, Thermal (Thermistor) Insulated, General Specification for. MIL-PRF-24236 - Switches, Thermostatic, (Metallic and Bimetallic), General Specification for. MIL-H-28719 - Header, Hermetically Sealed. MIL-PRF-28861 - Filters and Capacitors, Radio Frequency/Electromagnet
30、ic Interference Suppression, General Specification for. MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. MIL-PRF-38535 - Integrated Circuits, (Microcircuits), Manufacturing, General Specification for. MIL-DTL-38999 - Connectors, Electrical, Circular, Miniature, High Density, Quick Di
31、sconnect (Bayonet, Threaded, and Breech Coupling), Environment Resistant, Removable Crimp and Hermetic Solder Contacts, General Specification for. MIL-PRF-39001 - Capacitors, Fixed, Mica Dielectric, Established Reliability and Non-Established Reliability, General Specification for. Provided by IHSNo
32、t for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1580B w/CHANGE 3 2 MIL-PRF-39003 - Capacitors, Fixed, Electrolytic (Solid Electrolyte), Tantalum, Established Reliability, General Specification for. MIL-PRF-39005 - Resistors, Fixed, Wire-Wound (Accurate), Non-
33、Established Reliability, Established Reliability, General Specification for. MIL-PRF-39006 - Capacitor, Fixed, Electrolytic (Nonsolid Electrolyte), Tantalum, Establish Reliability, General Specification for. MIL-PRF-39006/22 - Capacitors, Fixed, Electrolytic (Nonsolid Electrolyte), Tantalum, (Polari
34、zed, Sintered Slug), 85 Deg. C (Voltage Derated to 125 Deg. C), Establish Reliability, Style CLR79. MIL-PRF-39007 - Resistors, Fixed, Wire-Wound (Power Type), Non-Established Reliability, Established Reliability, and Space Level, General Specification for. MIL-PRF-39009 - Resistors, Fixed, Wire-Woun
35、d (Power Type, Chassis Mounted), Non-Established Reliability, and Established Reliability, General Specification for. MIL-PRF-39010 - Coils, Radio Frequency, Fixed, Molded, Established Reliability, and Non-Established Reliability, General Specification for. MIL-PRF-39012 - Connectors, Coaxial, Radio
36、 Frequency, General Specification for. MIL-PRF-39014 - Capacitor, Fixed, Ceramic Dielectric (General Purpose), Established Reliability, and Non-Established Reliability, General Specification for. MIL-PRF-39015 - Resistors, Variable, Wire-Wound, (Lead Screw Actuated), Non-Established Reliability, and
37、 Established Reliability General Specification for. MIL-PRF-39016 - Relays, Electromagnetic, Established Reliability, General Specification for. MIL-PRF-39017 - Resistors, Fixed, Film (Insulated), Non-Established Reliability, and Established Reliability, General Specification for. MIL-PRF-39035 - Re
38、sistor, Variable, Nonwire-Wound, (Adjustment Type), Non-Established Reliability, and Established Reliability, General Specification for. MIL-PRF-49470 - Capacitor, Fixed, Ceramic Dielectric, Switch Mode Power Supply, Standard Reliability and High Reliability. MIL-PRF-55182 - Resistors, Fixed, Film,
39、Non-Established Reliability, Established Reliability, and Space Level, General Specification for. MIL-C-55302 - Connectors, Printed Circuit Subassembly and Accessories. MIL-PRF-55342 - Resistors, Fixed, Film, Chip, Non-Established Reliability, Established Reliability, Space Level, General Specificat
40、ion for. MIL-PRF-55365 - Capacitor, Fixed, Electrolytic (Tantalem), Chip, Non-Established Reliability, Established Reliability, General Specification for. MIL-PRF-55681 - Capacitor, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability, Non-Established Reliability, General Specifi
41、cation for. MIL-DTL-81381 - Wire, Electric, Polyimide-Insulated, Copper or Copper Alloy. MIL-PRF-83401 - Resistor, Networks, Fixed, Film, and Capacitor-Resistor Networks, Ceramic Capacitor and Fixed Film Resistors, General Specification for. MIL-PRF-83421 - Capacitor, Fixed, Metallized, Plastic Film
42、 Dielectric, (DC, AC, or DC and AC), Hermetically Sealed in Metal or Ceramic Cases, Established Reliability, General Specification for. MIL-PRF-83446 - Coils, Radio Frequency, Chip, Fixed or Variable, General Specification for. MIL-PRF-83536 - Relays, Electromagnetic, Established Reliability Provide
43、d by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1580B w/CHANGE 3 3 STANDARDS FEDERAL FED-STD-H28 - Screw-Thread Standards for Federal Services. DEPARTMENT OF DEFENSE MIL-STD-202 - Test Methods for Electronic and Electrical Component Parts. MIL-STD-7
44、50 - Semiconductor Devices. MIL-STD-883 - Microcircuits. MIL-STD-981 - Design, Manufacturing and Quality Standards for Custom Electromagnetic Devices for Space Applications. MIL-STD-1285 - Marking of Electric and Electronic Parts. (Copies of these documents are available online at http:/quicksearch.
45、dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2.2 Other Government documents, drawings, and publications. The following other Government documents, drawings, and publications form a part of this document to the extent specif
46、ied herein. Unless otherwise specified, the issues are those cited in the solicitation. DEFENSE SUPPLY CENTER COLUMBUS DRAWING 05017 - CAPACITORS, FIXED ELECTROLYTIC (NONSOLID ELECTROLYTE), TANTALUM ANODE AND CATHODE NATIONAL INSTITUTE OF STANDARDS TECHNOLOGY (NIST) NBS Special Publication 400-35 -
47、Notes on SEM Examination of Microelectronic Devices. (Application for copies should be addressed to National Institute of Standards Technology, 100 Bureau Drive, Stop 3460, Gaithersburg, MD 20899-3960.) 2.3 Non-Government publications. The following document(s) form a part of this document to the ex
48、tent specified herein. Unless otherwise specified, the issues of the documents that are DoD adopted are those listed in the issue of the DoDISS cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DoDISS are the issues of the documents cited in the solicit
49、ation (see 6.2). SOCIETY OF AUTOMOTIVE ENGINEERS, INC SAE-AMS2644 - Inspection Materials, Penetrants SAE-AS81044 - Wire, Electrical, Crosslinked Polyalkene, Crosslinked Alkane-Imide Polymer, or Polyarlyene insulated, Copper or Copper Alloy (Application for copies should be addressed to the Society of Automotive Engineer
