1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Make change to footnote 2/ as specified under Table I. Update boilerplate paragraphs to current MIL-PRF-38535 requirements. - ro 10-11-15 C. SAFFLE REV SHET REV SHET REV STATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMI
2、C N/A PREPARED BY RICK OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY RAJESH PITHADIA APPROVED BY RAYMOND MONNIN MICROCIRCUIT, LINEA
3、R, RADIATION HARDENED, DUAL, WIDEBAND VIDEO OPERATIONAL AMPLIFIER, MONOLITHIC SILICON DRAWING APPROVAL DATE 03-05-08 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-02547 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E317-09 Provided by IHSNot for ResaleNo reproduction or networking permitted witho
4、ut license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-02547 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
5、 and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following e
6、xample: 5962 - 02547 01 V P A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535
7、specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) ident
8、ify the circuit function as follows: Device type Generic number Circuit function 01 LMH6715 Radiation hardened, dual wideband video operational amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Dev
9、ice requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designa
10、ted in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual in line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot f
11、or ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-02547 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage (VS) 6.75 V dc Common mode inpu
12、t voltage (VCM) +VS- -VSDifferential input voltage +VS- -VSPower dissipation (PD) . 1.0 W 2/ Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) +175C Storage temperature range -65C TA +150C Thermal resistance, junction-to-case (JC) 32C/W Thermal resistance, junction-to-ambien
13、t (JA) . 140C/W (still air) 80C/W (500 linear feet per minute air flow) 1.4 Recommended operating conditions. Supply voltage range (VS) . 5 V dc to 6 V dc Ambient operating temperature range (TA) -55C to +125C 1.5 Radiation features. Maximum total dose available (dose rate = 50 300 rads (Si)/s) 300
14、krad (Si) 3/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation
15、 or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFEN
16、SE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia
17、, PA 19111-5094.) _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX(the
18、maximum junction temperature), JA(package junction to ambient thermal resistance), and TA(ambient temperature). The maximum allowable power dissipation at any temperature is PDMAX= (TJMAX- TA) / JAor the number given in the absolute maximum ratings, whichever is lower. 3/ These parts may be dose rat
19、e sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. Provided by IHSNot for ResaleNo reproduction or networking permitted w
20、ithout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-02547 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
21、 this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 an
22、d as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A fo
23、r non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1
24、 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level con
25、trol and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified
26、in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with th
27、e PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designato
28、r shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as r
29、equired in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requiremen
30、ts of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing
31、as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate
32、of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Mariti
33、me -VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the
34、 option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit gro
35、up number 49 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-02547 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Elec
36、trical performance characteristics. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Static and dc tests section Input bias current noninverting IBN1,2 01 -12 +12 A 3 -20 +20 M,D,P,L,R,F 2/ 3/ 1 -12 +12 Input bias current inverting I
37、BI1 01 -21 +21 A 2 -25 +25 3 -35 +35 M,D,P,L,R,F 2/ 3/ 1 -21 +21 Input offset voltage VIO1 01 -6 +6 mV 2 -12 +12 3 -10 +10 M,D,P,L,R,F 2/ 3/ 1 -6 +6 Supply current ICCRL= infinity 1,2 01 14 mA 3 16M,D,P,L,R,F 2/ 3/ 1 14 Power supply rejection 4/ ratio PSRR +VS= +4.5 V to +5.0 V, 1 01 46 dB -VS= -4.5
38、 V to 5.0 V 2,3 44 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-02547 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I.
39、Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Frequency domain response section Small signal bandwidth 4/ SSBW -3 dB bandwidth, 5/ VOUT 0.5 VPP4 01 175 MHz Gain flatness peaking 4/
40、 GFP 0.1 MHz to 30 MHz, 5/ VOUT 0.5 VPP4 01 0.1 dB Gain flatness rolloff 4/ GFR 0.1 MHz to 30 MHz, 5/ VOUT 0.5 VPP4 01 0.3 dB Distortion and noise tests section Second harmonic 4/ distortion HD2 2 VPPat 20 MHz 5/ 4 01 -42 dBc Third harmonic 4/ distortion HD3 2 VPPat 20 MHz 5/ 4 01 -46 dBc 1/ Unless
41、otherwise specified, VCC= 5 V dc, gain (AV) = +2, load resistance (RL) = 100 , and feedback resistance (RF) = 634 , and gain resistance (RG) = 634 . 2/ RHA devices supplied to this drawing have been characterized through all levels M, D, P, L, R, F of irradiation. The devices supplied to this drawin
42、g are tested to levels R and F. Those parameters listed in Table I with radiation level limits are tested Post irradiation. When performing post irradiation electrical measurements for any RHA level, TA= +25C. 3/ These parts may be dose rate sensitive in a space environment and may demonstrate enhan
43、ced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. 4/ This test is not post irradiation. 5/ Group A testing only. Provided by IHSNot for ResaleNo reproduction or networking permitte
44、d without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-02547 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outline P Terminal number Terminal symbol 1 VOUT12 VIN13 VNON-INV14 -VCC5 VNON-INV26 VINV27 VOUT28 +VCCFIG
45、URE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-02547 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling a
46、nd inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device
47、 class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For
48、device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and
