1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED D Change max frequency CL= 15 pF subgroups 10 and 11. Change max frequency CL= 50 pF subgroups 10 and 11. Change code ident. no. to 67268. Change to military drawing format. Add CAGE 01295 for case outline S and 2. 87-11-06 R.P. Evans E Drawing upd
2、ated to reflect current requirements . Replaced reference to MIL-STD-973 with reference to MIL-PRF-38535. Added class V requirements. Updated table II. - gt 03-12-15 R. Monnin F Update drawing to current requirements. Editorial changes throughout. - gap 09-08-20 Charles F. Saffle CURRENT CAGE CODE 6
3、7268 The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Joseph A. Counsil DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAW
4、ING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY C. R. Jackson APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, LOW POWER SCHOTTKY TTL, OCTAL D-TYPE FLIP FLOP WITH CLEAR, MONOLITHIC SILICON DRAWING APPROVAL DATE 78-12-7 AMSC N/A REVISION LEV
5、EL F SIZE A CAGE CODE 14933 78010 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E244-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SH
6、EET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identif
7、ying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 78010 01 R X Drawing number Device type (see 1.2.2) Case outline (see 1.2.4)Lead finish (see 1.2.5)For
8、 device class V: 5962 - 78010 01 V R X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-
9、PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device typ
10、e(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS273 Octal D-type, flip flop with clear 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class desig
11、nator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN
12、 class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78010 DEFENSE SUPPLY CENTER COLUMBU
13、S COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line package S GDFP2-F20 or CDFP3-
14、F20 20 Flat package 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage range -0.5 V dc to +7.0 V dc Input voltage r
15、ange . -1.5 V dc at -18 mA to 5.5 V dc Storage temperature . -65C to +150C Maximum power dissipation (PD) 1/ 84.8 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Suppl
16、y voltage range (VCC) . 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.7 V dc Case operating temperature range (TC) -55C to +125C Clock frequency (F clock) 0 to 30 MHz High level output current (IOH) . -400 A maximum Low
17、 level output current (IOL) 4 mA maximum Width of clock or clear pulse (TW) . 30 ns minimum Set-up time (tsu) Data input 20 ns minimum Clear to inactive state 25 ns minimum Data hold time (th) . 5 ns minimum 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The followin
18、g specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, Gen
19、eral Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit
20、Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Must withstand the added PDdue to short circuit test (e.g., IOS). Provided by IHSNo
21、t for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of
22、this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device cla
23、sses Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M
24、 shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-P
25、RF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Log
26、ic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall a
27、pply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein
28、. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be ma
29、rked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-
30、38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing
31、(see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for
32、this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for devic
33、e classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving
34、 devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offs
35、hore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 10 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproducti
36、on or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C Group A sub
37、groups Limits Unit unless otherwise specified Min Max High level output voltage VOHVCC= 4.5 V, IOH= -400 A, VIN= 0.7 V or 2.0 V 1, 2, 3 2.5 V Low -level output voltage VOLVCC= 4.5 V, IOL= 4 mA, VIN= 0.7 V or 2.0 V 1, 2, 3 0.4 V Input clamp voltage VICVCC= 4.5 V, IIN= -18 mA, TC= +25C 1 -1.5 V High l
38、evel input current IIH1VCC= 5.5 V, VIN= 5.5 V 1, 2, 3 0.1 mA IIH2VCC= 5.5 V, VIN= 2.7 V 20 A Low-level input current IILVCC= 5.5 V, VIN= 0.4 V 1, 2, 3 -0.4 mA Short-circuit output current IOSVCC= 5.5 V 1/ 1, 2, 3 -15 -130 mA Supply current ICCVCC= 5.5 V 2/ 1, 2, 3 27 mA Functional tests See 4.4.1c 7
39、, 8 Maximum clock frequency 3/ FMAXVCC= 5.0 V RL= 2 k 5% CL= 15 pF 10% 9 30 Mhz 10, 11 18 RL= 2 k 5% CL= 50 pF 10% 9 24 10, 11 17 Propagation delay time, high to low, clear to output 3/ tPHL1VCC= 5.0 V RL= 2 k 5% CL= 15 pF 10% 9 27 ns 10, 11 38 RL= 2 k 5% CL= 50 pF 10% 9 32 10, 11 42 Propagation del
40、ay time, low to high, clock to output 3/ tPLHVCC= 5.0 V RL= 2 k 5% CL= 15 pF 10% 9 27 ns 10, 11 38 RL= 2 k 5% CL= 50 pF 10% 9 32 10, 11 42 Propagation delay time, high to low, clock to output 3/ tPHL2VCC= 5.0 V RL= 2 k 5% CL= 15 pF 10% 9 27 ns 10, 11 38 RL= 2 k 5% CL= 50 pF 10% 9 32 10, 11 42 1/ Not
41、 more than one output should be shorted at a time, and the duration of the short circuit condition should not exceed one second. 2/ With all outputs open and 4.5 V applied to all data and clear inputs, ICCis measured after a momentary ground, then 4.5 V is applied to clock. 3/ Propagation delay time
42、 and maximum clock frequency testing may be performed using either CL= 15 pF, or CL= 50 pF. However, the manufacturer must certify and guarantee that the microcircuits meet the test limits specified for a 50 pF load. Provided by IHSNot for ResaleNo reproduction or networking permitted without licens
43、e from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines R, S, and 2 Terminal number Terminal symbol 1 CLEAR 2 1Q 3 1D 4 2D 5 2Q 6 3Q 7 3D 8 4D 9 4Q 10 GND 11 CLOCK 1
44、2 5Q 13 5D 14 6D 15 6Q 16 7Q 17 7D 18 8D 19 8Q 20 VCCFIGURE 1. Terminal connections. (Each flip flop) Inputs Output Clear Clock D Q L X X L H H H H L L H X X QOH = High level (steady state) L = Low level (steady state) X = Irrelevant = Low to high transition QO= The level of Q before the indicated s
45、teady state input conditions were established FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 7 DSCC FOR
46、M 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION
47、4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described here
48、in. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria
