1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Page 8: Delete Tri-state tests. Page 12: 4.4.3b, delete test condition A. Page 13: Remove vendor. 80-01-28 N. A. Hauck B Case “E“ inactive for new design. Complete document update. 85-06-13 N. A. Hauck C Convert to approved source format. Add cas
2、e outline 2. Change IILand TPLH5maximum limits. Change VOHtest conditions. Delete minimum limits from IILand propagation delays. Remove vendor FSCM 34335. Editoral changes throughout. 86-05-06 N. A. Hauck D Update to reflect latest changes in format and requirements. Editorial changes throughout. -l
3、es 04-07-26 Raymond Monnin CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY A. J. Foley DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING C
4、HECKED BY C. R. Jackson COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Darrell Hill MICROCIRCUIT, DIGITAL, LOW POWER SCHOTTKY TTL, ENCODERS, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 79-01-22 MONOLITHIC SILICON AMSC
5、N/A REVISION LEVEL D SIZE A CAGE CODE 14933 78027 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E349-04 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78027 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVI
6、SION LEVEL D SHEET 2 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 78027 01 E A D
7、rawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device types. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 54LS148 8-line-to-3-line priority encoder 1.2.2 Case outlines. The case outlines are as de
8、signated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual-in-line F GDFP2-F16 or CDFP3-F16 16 flat 2 CQCC1-N20 20 square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Abs
9、olute maximum ratings. Supply voltage range . -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at 18 mA to +5.5 V dc Storage temperature -65C to +150C Maximum power dissipation (PD) . 110 mW 1/ Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) +175C Thermal resistance,
10、 junction-to-case (JC): Cases E, F, and 2 See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH): 2.0 V dc Maximum low lever input voltage (VIL): . 0.7 V dc Normalized fanout (each output) 10 maxim
11、um Case operating temperature range (TC) -55C to +125C _ 1/ Maximum power dissipation is defined as VCCX ICC, and must withstand the added PDdue to short circuit test e.g., IOS. DSCC FORM 2234 APR 97 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-STAN
12、DARD MICROCIRCUIT DRAWING SIZE A 78027 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent spe
13、cified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Stand
14、ard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/
15、quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes pre
16、cedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as
17、 specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers app
18、roved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shal
19、l not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF
20、-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.3 Electrical performance cha
21、racteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The
22、 electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. DSCC FORM 2234 APR 97 Provided by IHSNot for Re
23、saleNo reproduction or networking permitted without license from IHS-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78027 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 3.5.1 Certification/compliance mark. A compliance indicator C shall be marked on all non-JAN devices bui
24、lt in compliance to MIL-PRF-38535, appendix A. The compliance indicator C shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufa
25、cturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the r
26、equirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that af
27、fects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. DSCC FORM 2234 APR 97 Pro
28、vided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78027 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +1
29、25C unless otherwise specified Group A subgroupsDevice type Limits UnitMin MaxHigh level output voltage, VOHVCC= 4.5 V, IOH= -0.4 mA, VIN= 0.7 V or 2.0 V 1, 2, 3 All 2.5 V Low level output voltage VOLVCC= 4.5 V, IOL= 4.0 mA, VIN= 0.7 V or 2.0 V 1, 2, 3 All 0.4 V Input clamp voltage VIC VCC= 4.5 V, I
30、IN= -18 mA, TC= +25C 1 All -1.5 V Low level input current at DATA INPUTS IIL1VCC= 5.5 V, VIN= 0.4 V 1, 2, 3 All -0.8 mA Low level input current at ENABLE INPUT IIL21, 2, 3 All -0.4 mA High level input current at IIH1VCC= 5.5 V, VIN= 2.7 V 1, 2, 3 All 40 A DATA INPUTS IIH2VCC= 5.5 V, VIN= 5.5 V 1, 2,
31、 3 All 200 A High level input current at IIH3VCC= 5.5 V, VIN= 2.7 V 1, 2, 3 All 20 A ENABLE INPUT IIH4VCC= 5.5 V, VIN= 5.5 V 1, 2, 3 All 100 A Short circuit output current IOSVCC= 5.5 V, VOUT= GND 1/ 1, 2, 3 All -15 -100 mA Supply current ICC1VCC= 5.5 V 1, 2, 3 All 20 mA CC2VCC= 5.5 V 1, 2, 3 All 17
32、 mA Functional tests See 4.3.1c 7 All Propagation delay time, tPLH1VCC= 5.0 V, CL= 15 pF 10% 9 All 18 ns output from data input to RL= 2 k 5% 10, 11 25A. 2/ CL= 50 pF 10% 9 All 23 ns IN-PHASE OUTPUT 10, 11 32 tPHL1 CL = 15 pF 10% 9 All 25 ns 10, 11 35CL= 50 pF 10% 9 All 30 ns 10, 11 42Propagation de
33、lay time, tPLH2CL= 15 pF 10% 9 All 36 ns output from data A. 10, 11 50OUT-OF-PHASE CL= 50 pF 10% 9 All 41 ns 10, 11 57 tPHL2CL= 15 pF 10% 9 All 29 ns 10, 11 41CL= 50 pF 10% 9 All 34 ns 10, 11 58 See footnotes at end of table. DSCC FORM 2234 APR 97 Provided by IHSNot for ResaleNo reproduction or netw
34、orking permitted without license from IHS-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78027 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A
35、subgroupsDevice type Limits UnitMin MaxPropagation delay time, tPLH3VCC= 5.0 V, CL= 15 pF 10% 9 All 18 ns output from DATA to E0. RL= 2 k 5% 10, 11 252/ CL= 50 pF 10% 9 All 23 ns 10, 11 32tPHL3CL= 15 pF 10% 9 All 40 ns 10, 11 56CL= 50 pF 10% 9 All 45 ns 10, 11 63Propagation delay time, tPLH4CL= 15 p
36、F 10% 9 All 55 ns output from DATA to GS. 10, 11 77CL= 50 pF 10% 9 All 60 ns 10, 11 84 tPHL4CL= 15 pF 10% 9 All 21 ns 10, 11 29CL= 50 pF 10% 9 All 26 ns 10, 11 36Propagation delay time, tPLH5CL= 15 pF 10% 9 All 25 ns output from E1 to A. 10, 11 35PHL5CL= 50 pF 10% 9 All 28 ns 10, 11 39Propagation de
37、lay time, tPLH6CL= 15 pF 10% 9 All 17 ns output from E1 to GS. 10, 11 24CL= 50 pF 10% 9 All 22 ns 10, 11 31 tPHL6CL= 15 pF 10% 9 All 36 ns 10, 11 50CL= 50 pF 10% 9 All 41 ns 10, 11 57 See footnotes at end of table. DSCC FORM 2234 APR 97 Provided by IHSNot for ResaleNo reproduction or networking perm
38、itted without license from IHS-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78027 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDe
39、vice type Limits UnitMin MaxPropagation delay time, tPLH7VCC= 5.0 V, CL= 15 pF 10% 9 All 21 output from E1 to E0. RL= 2 k 5% 10, 11 292/ CL= 50 pF 10% 9 All 26 10, 11 36tPHL7CL= 15 pF 10% 9 All 35 10, 11 49CL= 50 pF 10% 9 All 40 10, 11 56 1/ Not more than one output should be shorted at a time and t
40、he duration of the short circuit condition should not exceed 1 second. 2/ Propagation delay time testing and maximum clock frequency testing may be performed using either CL= 15 pF or CL= 50 pF. However, the manufacturer must certify and guarantee that the microcircuits meet the switching test limit
41、s specified for a 50 pF load. DSCC FORM 2234 APR 97 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78027 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 Devic
42、e type 01 01 Case outlines E, F 2 Terminal number Terminal symbols 1 4 NC 2 5 4 3 6 5 4 7 6 5 E1 7 6 A2 NC 7 A1 E1 8 GND A2 9 A0 A1 10 0 GND 11 1 NC 12 2 A0 13 3 0 14 GS 1 15 E0 2 16 VCCNC 17 - - - 3 18 - - - GS 19 - - - E0 20 - - - VCCNC = No connection FIGURE 1. Terminal connections. Provided by I
43、HSNot for ResaleNo reproduction or networking permitted without license from IHS-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78027 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 INPUTS OUTPUTS E1 0 1 2 3 4 5 6 7 A2 A1 A0 GS E0 H X X X X X X X X H H
44、 H H H L H H H H H H H H H H H H L L X X X X X X X L L L L L H L X X X X X X L H L L H L H L X X X X X L H H L H L L H L X X X X L H H H L H H L H L X X X L H H H H H L L L H L X X L H H H H H H L H L H L X L H H H H H H H H L L H L L H H H H H H H H H H L H FIGURE 2. Truth table. Provided by IHSNot
45、 for ResaleNo reproduction or networking permitted without license from IHS-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78027 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 10 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in acco
46、rdance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test
47、condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, i
48、n accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electric
