1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED D Technical changes in 1.4 and table I. Editorial changes throughout. 91-10-30 M. A. Frye E Update boilerplate to MIL-PRF-38535 requirements. - CFS 01-12-11 Thomas M. Hess F Made change to paragraph 3.5. Update boilerplate to MIL-PRF-38535 requirem
2、ents. LTG 05-03-18 Thomas M. Hess G Change boilerplate to add device class V criteria. jak 06-10-26 Thomas M. Hess H Update test condition of high and low level voltage to table I. Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 12-03-22 Thomas M. Hess Current CAGE Cod
3、e is 67268 REV SHEET REV H SHEET 15 REV STATUS REV H H H H H H H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY David W. Queenan DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILA
4、BLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY D. A. DiCenzo APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, HEX D-TYPE FLIP-FLOP WITH CLEAR, MONOLITHIC SILICON DRAWING APPROVAL DATE 84-10-17 REVISION LEVEL H SIZE A CAGE CODE 14933 84073
5、SHEET 1 OF 15 DSCC FORM 2233 APR 97 5962-E200-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84073 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Sc
6、ope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice
7、 of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 84073 01 E A Drawing number Device type (see 1.2.2) Case outline (see 1.2.4) Lead finish (see 1.2.5) For device class V: 5962 - 84073 01 V E A Fe
8、deral stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
9、marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as f
10、ollows: Device type Generic number Circuit function 01 54HC174 Hex D-type flip-flop with clear 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original is
11、suance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance
12、 with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDF
13、P3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IH
14、S-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84073 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc DC input voltage range (VIN) . -0.5 V dc to VCC + 0.5 V dc DC out
15、put voltage range (VOUT) -0.5 V dc to VCC + 0.5 V dc Clamp diode current 20 mA DC output current (per pin) . 25 mA DC VCCor GND current 50 mA Storage temperature range (TSTG) -65C to +150C Maximum power dissipation (PD) 500 mW 4/ Lead temperature (soldering, 10 seconds) . +260C Thermal resistance, j
16、unction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) . +2.0 V dc to +6.0 V dc Input voltage range (VIN) . 0.0 V to VCCOutput voltage range (VOUT) 0.0 V to VCCCase operating temperature range (TC) -55C to +125C
17、Maximum operating frequency (fMAX): TC= +25C VCC= 2.0 V dc 5.4 MHz VCC= 4.5 V dc 27 MHz VCC= 6.0 V dc 32 MHz TC= -55C, +125C VCC= 2.0 V dc 3.6 MHz VCC= 4.5 V dc 18 MHz VCC= 6.0 V dc 21 MHz Minimum removal time, clear to clock (tREM): TC= +25C VCC= 2.0 V dc 100 ns VCC= 4.5 V dc 20 ns VCC= 6.0 V dc 17
18、 ns TC= -55C, +125C VCC= 2.0 V dc 150 ns VCC= 4.5 V dc 30 ns VCC= 6.0 V dc 26 ns Minimum setup time, data to clock (ts): TC= +25C VCC= 2.0 V dc 100 ns VCC= 4.5 V dc 20 ns VCC= 6.0 V dc 17 ns TC= -55C, +125C VCC= 2.0 V dc 150 ns VCC= 4.5 V dc 30 ns VCC= 6.0 V dc 26 ns _ 1/ Stresses above the absolute
19、 maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise specified, all voltages are referenced to ground. 3/ The limits for the parameters specified herein shall apply over the full specifi
20、ed VCCrange and case temperature range of -55C to +125C. 4/ For TC= +100C to +125C, derate linearly at 12 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84073 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990
21、 REVISION LEVEL H SHEET 4 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions Continued. 2/ 3/ Minimum hold time, clock to data (th): TC= +25C VCC= 2.0 V dc 25 ns VCC= 4.5 V dc 5 ns VCC= 6.0 V dc 5 ns TC= -55C, +125C VCC= 2.0 V dc 40 ns VCC= 4.5 V dc 8 ns VCC= 6.0 V dc 7 ns Minimum pulse widt
22、h, clock (tw1): TC= +25C VCC= 2.0 V dc 90 ns VCC= 4.5 V dc 18 ns VCC= 6.0 V dc 15 ns TC= -55C, +125C VCC= 2.0 V dc 135 ns VCC= 4.5 V dc 27 ns VCC= 6.0 V dc 23 ns Minimum pulse width, clear (tw2): TC= +25C VCC= 2.0 V dc 80 ns VCC= 4.5 V dc 16 ns VCC= 6.0 V dc 14 ns TC= -55C, +125C VCC= 2.0 V dc 120 n
23、s VCC= 4.5 V dc 24 ns VCC= 6.0 V dc 20 ns Maximum input rise and fall time (tr, tf): TC= +25C VCC= 2.0 V dc 1000 ns VCC= 4.5 V dc 500 ns VCC= 6.0 V dc 400 ns TC= -55C, +125C VCC= 2.0 V dc 1000 ns VCC= 4.5 V dc 500 ns VCC= 6.0 V dc 400 ns 2/ Unless otherwise specified, all voltages are referenced to
24、ground. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84073 DLA LAND AN
25、D MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 5 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise speci
26、fied, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Int
27、erface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardiza
28、tion Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or cont
29、ract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEDEC Standard No. 7 - Standard for Description of 54/74HCXXXXX and 54/74HCTXXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 Nor
30、th 10thStreet, Suite 240-S Arlington, VA 22201). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a spe
31、cific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listi
32、ng (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow
33、 as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-
34、PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance wi
35、th 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWI
36、NG SIZE A 84073 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 6 DSCC FORM 2234 APR 97 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figur
37、e 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Ele
38、ctrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For
39、 packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accorda
40、nce with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“
41、 as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of com
42、pliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufact
43、urers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for d
44、evice class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this
45、drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentati
46、on. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 38 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo re
47、production or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84073 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Test conditions -55C TC +125C unless
48、otherwise specified 1/ Group A subgroups Limits Unit Min Max High level output voltage VOHVIN= VIHminimum or VILmaximum IOH= -20 A VCC= 2.0 V 1, 2, 3 1.9 V VCC= 4.5 V 4.4 VCC= 6.0 V 5.9 VIN= VIHminimum or VILmaximum IOH= -4.0 mA VCC= 4.5 V 3.7 VIN= VIHminimum or VILmaximum IOH= -5.2 mA VCC= 6.0 V 5.2 Low level output voltage VOLVIN= VIHminimum or VILmaximum IOL= +20 A VCC= 2.0 V 1, 2, 3 0.1 V VCC= 4.5 V 0.1 VCC= 6.0 V 0.1 VIN= VIHminimum or VILmaximum IOL= +4.0 mA VCC= 4.5 V 0.4 VIN= VIHminimum or VILmaximum IOL= +5.
