1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. - ro 02-07-12 R. MONNIN B Make change to VOHand IOStest limits as specified under Table I. - ro 08-06-19 R. HEBER C Make correction to the internal power dissipation limit and change footnote 1/ as
2、 specified under paragraph 1.3. - ro 08-10-07 R. HEBER THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY DONALD R. OSBORNE CHECKED BY D. A. DiCENZO DEFENSE SUPPLY CENTER COLUMBUS
3、COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY N. A. HAUCK STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-08-31 MICROCIRCUIT, LINEAR, HIGH SPEED, DUAL, DIFFERENTIAL LINE DRIVER, MONOL
4、ITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-87546 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E507-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87546 DEFENSE SUPPLY CENTER COLUMBUS
5、COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN
6、is as shown in the following example: 5962-87546 01 P A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 9638 High speed dual differen
7、tial line driver 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absol
8、ute maximum ratings. Supply voltage -0.5 V dc to +7.0 V dc Input voltage . -0.5 V dc to +7.0 V dc Internal power dissipation (PD) cavity package . 1300 mW 1/ Junction temperature (TJ) . +175C Storage temperature range . -65C to +175C Lead temperature (soldering, 10 seconds) . +300C Thermal resistanc
9、e, junction-to-case (JC) . 50C/W 1.4 Recommended operating conditions. Ambient operating temperature range (TA) . -55C to +125C _ 1/ Derate cavity package 8.7 mW/C above 25C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWI
10、NG SIZE A 5962-87546 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent
11、 specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method S
12、tandard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.
13、mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in
14、 this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.
15、Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan
16、and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PI
17、N as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A
18、and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics
19、 are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall
20、 be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN is not feasible due to space limitations, the manufacturer has the option of not marki
21、ng the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-3853
22、5 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87546 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 TA
23、BLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C 4.5 V VCC 5.5 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Input voltage HIGH 1/ VIH1,2,3 01 2.0 V Input voltage LOW 1/ VIL1,2,3 01 0.5 Clamped input voltage VICII= -18 mA 1,2,3 01 -
24、1.2 V Output voltage HIGH VOHVCC= 4.5 V, VIH= 2.0 V, 1 01 2.5 V IOH= -10 mA, VIL= 0.5 V 2,3 2.0 VCC= 4.5 V, VIH= 2.0 V, 1 2.0 IOH= -40 mA, VIL= 0.5 V 2,3 1.0 Output voltage LOW VOLVIH= 2.0 V, VIL= 0.5 V, IOL= 30 mA 1,2,3 01 0.5 V Input current at maximum input voltage IIVCC= 5.5 V, VIN= 5.5 V 1,2,3
25、01 50 A Input current HIGH IIHVCC= 5.5 V, VIH= 2.7 V 1,2,3 01 25 A Input current LOW IILVCC= 5.5 V, VIL= 0.5 V 1,2,3 01 -200 A IOSVCC= 5.5 V, VO= 0 V 1 01 -150 -50 mA Output short circuit current 2,3 -150 -40 Terminated output voltage VT, VTSee figure 2 1,2,3 01 2.0 V Output balance VT- VTSee figure
26、 2 1,2,3 01 0.4 V Output offset voltage 2/ VOS, VOSSee figure 2 1,2,3 01 3.0 V Output offset balance 3/ VOS- VOSSee figure 2, TA= +25C 1 01 0.4 V Output leakage current ICEXVCC= 0 V, -0.25 V VCEX 5.5 V 1,2,3 01 -150 150 A Supply current (total) ICCVCC= 5.5 V, no load, all inputs at 0 V 1,2,3 01 75 m
27、A See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87546 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electric
28、al performance characteristics Continued. Test Symbol Conditions -55C TA +125C 4.5 V VCC 5.5 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Propagation delay time, low to high level tPLHVCC= 5.0 V, CL= 15 pF, RL= 100 , TA= +25C, see figure 3 9 01 20 ns Propagation del
29、ay time, high to low level tPHLVCC= 5.0 V, CL= 15 pF, RL= 100 , TA= +25C, see figure 3 9 01 20 ns Fall time (90 % to 10 %) tfVCC= 5.0 V, CL= 15 pF, RL= 100 , TA= +25C, see figure 3 9 01 20 ns Rise time (10 % to 90 %) trVCC= 5.0 V, CL= 15 pF, RL= 100 , TA= +25C, see figure 3 9 01 20 ns 1/ Guaranteed
30、by VOLand VOHtests. 2/ Guaranteed by maximum VCC. 3/ Guaranteed by VT- VToutput balance. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of complia
31、nce submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A
32、 shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to revie
33、w the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87546
34、DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outline P Terminal number Terminal symbol 1 VCC2 INPUT A 3 INPUT B 4 GND 5 OUTPUT B 6 OUTPUT B 7 OUTPUT A 8 OUTPUT A FIGURE 1. Terminal connections. Provided by IHSNot for Resa
35、leNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87546 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 FIGURE 2. Terminated output voltage and output balance circuit. Provided by I
36、HSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87546 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. The pulse generator has the following characteristics
37、; ZO= 50 , PRR = 500 kHz. 2. CLincludes probe and jig capacitance. FIGURE 3. Switching times test circuit and waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87546 DEFENSE SUPPLY CENTER COLUMBUS CO
38、LUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be
39、conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be
40、made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test pa
41、rameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups
42、 A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, 8, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. End-point elec
43、trical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing
44、or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of M
45、IL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87546 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 10 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirement
46、s. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 9 Groups C and D end-point electrical parameters
47、 (method 5005) 1 * PDA applies to subgroup 1. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applicatio
48、ns (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and i
