1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change to one part-one part number format. Added table III. 91-12-11 M. A. FRYE B Changes in accordance with NOR 5962-R036-97. 96-11-26 R. MONNIN C Change slew rate value in table I. Remove table III, figures 2, 3, 4, and 5. Update boilerplate. R
2、edrawn. -rrp 00-10-18 R. MONNIN D Replaced reference to MIL-STD-973 with reference to MIL-PRF-38535. -rrp 03-05-01 R. MONNIN E Make change to the AVS, +VOP, and -VOP test subgroups from 4, 5, and 6 to 1, 2, and 3 as specified under table I. Make change to the Enand SR test subgroups from 7 to 4 as s
3、pecified under table I. Make change to TCVIOtest subgroups from 8 to 2 and 3 under table I. Make change to paragraph 4.4.1 and table IIA. Update drawing to current requirements. -rrp 11-05-10 C. SAFFLE THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV E E
4、 E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY GARY ZAHN DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY RAY MONN
5、IN APPROVED BY D. A. DiCENZO MICROCIRCUIT, LINEAR, LOW OFFSET, LOW POWER DUAL OPERATIONAL AMPLIFIER, MONOLITHIC SILICON DRAWING APPROVAL DATE 88-07-25 AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 5962-88593 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E334-11 Provided by IHSNot for ResaleNo reproduc
6、tion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88593 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high re
7、liability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The
8、PIN is as shown in the following example: 5962 - 88593 01 V P A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA m
9、arked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Dev
10、ice type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 OP200A Dual, low offset, low power operational amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as f
11、ollows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case o
12、utline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF
13、-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88593 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum
14、 ratings. 1/ Supply voltage range . 20 V dc Input voltage Supply voltage Output short-circuit duration Indefinite Differential input voltage 30 V dc Storage temperature range -65C to +150C Lead temperature range (soldering, 60 seconds) +300C Junction temperature (TJ) +150C Thermal resistance, juncti
15、on-to-case (JC) . See MIL-STD-1835 Thermal resistance (JA): Case P . 119C/W Case 2 120C/W 1.4 Recommended operating conditions. Supply voltage (VCC) 15 V dc Source resistance from ground to input terminals (RS) 50 Ambient operating temperature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Gov
16、ernment specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFIC
17、ATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard
18、 Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. I
19、n the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum
20、 rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88593 DLA LAND AND MA
21、RITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Mana
22、gement (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construc
23、tion, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3
24、.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified
25、in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with th
26、e PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA de
27、signator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “
28、Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the req
29、uirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to l
30、isting as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certi
31、ficate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and
32、 Maritime -VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity ret
33、ain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcirc
34、uit group number 49 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88593 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 TABLE
35、I. Electrical performance characteristics. Test Symbol Conditions -55C TA+125C VCC= 15 V, RS= 50 unless otherwise specified Group A subgroups Device type Limits Unit Min Max Input offset voltage VIO1 01 -75 +75 V 2, 3 -125 +125 Input offset current IIOVCM= 0 V 1 01 -1.0 +1.0 nA 2, 3 -2.5 +2.5 Input
36、bias current IIBVCM = 0 V 1 01 -2.0 +2.0 nA 2, 3 -5.0 +5.0 Common mode rejection ratio 1/ CMRR VCM= IVR= 11 V 1 01 120 dB 2, 3 115 Power supply rejection ratio PSRR VCC= 3 V to 18 V 1 01 1.8 V/V 2, 3 3.2 Supply current no load 2/ ISY1 01 1.45 mA 2, 3 1.55 Large signal voltage gain AVSVOUT= 10 V, RL=
37、 2 k 1 01 2000 V/mV 2, 3 1000 VOUT= 10 V, RL= 10 k 1 5000 2, 3 3000 Output voltage swing +VOPRL= 2 k 1, 2, 3 01 +11 V RL= 10 k +12 -VOPRL= 2 k 1, 2, 3 -11 RL= 10 k -12 Input noise voltage En fO= 1 Hz to 100 Hz, TA= +25C 4 01 250 nVrmsSlew rate SR TA= +25C, AV= +1 4 01 0.05 V/s Input offset voltage t
38、emperature coefficient TCVIOTA= +125C, -55C 2, 3 01 0.5 V/C 1/ IVRis defined as the VCMrange used for the CMRR test. 2/ ISYlimit = total of all two amplifiers. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-
39、88593 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines P 2 Terminal number Terminal symbol 1 OUT A NC 2 -IN A OUT A 3 +IN A NC 4 -VCCNC 5 +IN B -IN A 6 -IN B NC 7 OUT B +IN A 8 +VCCNC 9 - NC 10 - -VCC11 - NC 12 - +IN B 13 - N
40、C 14 - NC 15 - -IN B 16 - NC 17 - OUT B 18 - NC 19 - NC 20 - +VCCNC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88593 DLA LAND AND MARITIME COLUMBUS, OHIO 4
41、3218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in
42、the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be cond
43、ucted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Bur
44、n-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs,
45、 biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table IIA herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-i
46、n test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturers QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturers Technology Review
47、Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. In
48、terim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for g
