1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add vendor CAGE F8859. Add device class V criteria. Correct data limits in paragraph 1.3. Add case outline X. Add table III, delta limits. Update boilerplate to MIL-PRF-38535 requirements jak. 01-07-27 Thomas M. Hess B Update boilerplate paragrap
2、hs to the current MIL-PRF-38535 requirements. - LTG 09-05-01 Thomas M. Hess REV SHET REV B B SHET 15 16 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Marcia B. Kelleher CHECKED BY Ray Monnin DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, O
3、HIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY Michael A. Frye STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-02-06 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, DUAL J-K POSITIVE EDGE-TRIGGERED FLIP- F
4、LOP, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89551 SHEET 1 OF 16 DSCC FORM 2233 APR 97 5962-E288-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89551 DEFENSE SUPPLY CENTER
5、 COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes
6、 are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 - 89551 01 E A Federal stock class designa
7、tor RHA designator (see 1.2.1) Device type (see 1.2.2)Case outline (see 1.2.4)Lead finish (see 1.2.5) / / Drawing number For device class V: 5962 - 89551 01 V X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead fin
8、ish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and
9、 are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54AC109 Dual J-K positive edge-triggered flip-flop 1.2.3 Device class designator.
10、The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the devic
11、e. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outlin
12、e(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack X CDFP4-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish
13、is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89551 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO
14、 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+0.5 V dc Input clamp current (IIK) (VINVCC). 20
15、 mA Output clamp current (IOK) (VOUTVCC) . 20 mA Continuous output current (IOUT) (VOUT= 0.0 to VCC) 25 mA Continuous current through VCCor GND 50 mA Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD): 500 mW Lead temperature (soldering, 10 seconds). +260C Thermal resist
16、ance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. 2/ Supply voltage range (VCC) +3.0 V dc to +6.0 V dc 4/ Case operating temperature range (TC) -55C to +125C Input voltage range (VIN) 0.0 V dc to VCCOutput voltage range (VOUT). 0.0 V
17、 dc to VCCInput rise or fall time (tr, tf): VCC= 3.6 V to 5.5 V . 0 to 8.0 ns/V Minimum setup time, Jn, Kn, to CPn (ts): TC= +25C, VCC= 3.0 V 6.5 ns TC= +25C, VCC= 4.5 V 4.5 ns TC= -55C to +125C, VCC= 3.0 V 8.0 ns TC= -55C to +125C, VCC= 4.5 V 5.5 ns Minimum hold time, Jn or Kn to CPn (th): TC= +25C
18、, VCC= 3.0 V 0.0 ns TC= +25C, VCC= 4.5 V 0.5 ns TC= -55C to +125C, VCC= 3.0 V 0.0 ns TC= -55C to +125C, VCC= 4.5 V 0.5 ns Minimum pulse width CPn, (tW): TC= +25C, VCC= 3.0 V 5.0 ns TC= +25C, VCC= 4.5 V 5.0 ns TC= -55C to +125C, VCC= 3.0 V 5.5 ns TC= -55C to +125C, VCC= 4.5 V 5.0 ns Minimum pulse wid
19、th CDn or SDn, (tW): TC= +25C, VCC= 3.0 V 6.0 ns TC= +25C, VCC= 4.5 V 5.0 ns TC= -55C to +125C, VCC= 3.0 V 8.0 ns TC= -55C to +125C, VCC= 4.5 V 5.5 ns Minimum recovery time CDn, SDn to CPn (trec): TC= +25C, VCC= 3.0 V 0.5 ns TC= +25C, VCC= 4.5 V 0.5 ns TC= -55C to +125C, VCC= 3.0 V 0.5 ns TC= -55C t
20、o +125C, VCC= 4.5 V 0.5 ns Maximum frequency CPn, (fMAX): TC= +25C, VCC= 3.0 V 85 MHz TC= +25C, VCC= 4.5 V 95 MHz TC= -55C to +125C, VCC= 3.0 V 65 MHz TC= -55C to +125C, VCC= 4.5 V 95 MHz 1/ Unless otherwise noted, all voltages are referenced to GND. 2/ The limits for the parameters specified herein
21、 shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 3/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 4/ Operation from 2.0 V dc to 3.0 V dc is p
22、rovided for compatibility with data retention and battery backup systems. Data retention implied no input transitions and no stored data loss with the following condition: VIH 70 percent VCC, VIL 30 percent VCC, VOH 70 percent VCCat 20 A, VOL 30 percent VCCat 20 A.Provided by IHSNot for ResaleNo rep
23、roduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89551 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The f
24、ollowing specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturi
25、ng, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microc
26、ircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this do
27、cument to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No. 20 - Standard for Description of 54/74ACXXXXX and 54/74ACTXXXXX Advanced High-Speed CMOS Devices. (Copies of
28、 these documents are available online at http:/www.jedec.org or from Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes
29、precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herei
30、n or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class leve
31、l B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The
32、case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switch
33、ing waveforms and test circuit. The switching waveforms and test circuit shall be as specified in figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89551 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO
34、43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply ov
35、er the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In ad
36、dition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. M
37、arking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535.
38、The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.
39、6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this dr
40、awing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device class
41、es Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving device
42、s acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore do
43、cumentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 38 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or n
44、etworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89551 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol VCCGrou
45、p A subgroups Limits 3/ Unit Test conditions 2/ -55C TC +125C +3.0 V VCC +5.5 V unless otherwise specified Device type and device class Min Max Positive input clamp voltage 3022 VIC+For input under test IIN= 1.0 mA V All 0.0 V 1 0.4 1.5 V Negative input clamp voltage 3022 VIC-For input under test II
46、N= -1.0 mA V All Open 1 -0.4 -1.5 V 3.0 V 1, 2, 3 2.9 4.5 V 1, 2, 3 4.4 VIN= VIHminimum or VILmaximum IOH= -50 A All All 5.5 V 1, 2, 3 5.4 VIN= VIHminimum or VILmaximum, IOH= -12 mA All All 3.0 V 1, 2, 3 2.40 4.5 V 1, 2, 3 3.70 VIN= VIHminimum or VILmaximum, IOH= -24 mA All All 5.5 V 1, 2, 3 4.70 Hi
47、gh level output voltage 3006 VOH 4/ VIN= VIHminimum or VILmaximum, IOH= -50 mA All All 5.5 V 1, 2, 3 3.85 V 3.0 V 1, 2, 3 0.1 4.5 V 1, 2, 3 0.1 VIN= VIHminimum or VILmaximum IOL= 50 A All All 5.5 V 1, 2, 3 0.1 VIN= VIHminimum or VILmaximum, IOL= 12 mA All All 3.0 V 1, 2, 3 0.50 4.5 V 1, 2, 3 0.50 VI
48、N= VIHminimum or VILmaximum, IOL= 24 mA All All 5.5 V 1, 2, 3 0.50 Low level output voltage 3007 VOL 4/ VIN= VIHminimum or VILmaximum, IOL= 50 mA All All 5.5 V 1, 2, 3 1.65 V 3.0 V 1, 2, 3 2.1 4.5 V 1, 2, 3 3.15 High level input voltage VIH5/ All All 5.5 V 1, 2, 3 3.85 V 3.0 V 1, 2, 3 0.9 4.5 V 1, 2, 3 1.35 Low level input voltage VIL5/ All All 5.5 V 1, 2, 3 1.65 V Input leakage current low 3010 IILVIN= 0.0 V All All 5.5 V 1, 2, 3 -1.0 A Input leakage current high 3009 IIHVIN= 5.5 V All All 5.5 V 1, 2, 3 1.0 A Quiescent supply current, output high 30
