1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. - lgt 01-07-06 Raymond Monnin B Redrawn. Drawing updated to current requirements. - drw 12-05-01 Charles F. Saffle THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET RE
2、V STATUS REV B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Rick C. Officer DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEP
3、ARTMENT OF DEFENSE CHECKED BY Charles E. Besore APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, 12-BIT DIGITAL-TO-ANALOG CONVERTER, MONOLITHIC SILICON DRAWING APPROVAL DATE 90-01-23 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89617 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E333-12 Provide
4、d by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89617 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for
5、 MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89617 01 L A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.
6、2.3) 1.2.1 Device type. The device type identifies the circuit function as follows: Device type Generic number Circuit function 01 AD767 12-bit digital-to-analog converter 1.2.2 Case outline. The case outline is as designated in MIL-STD-1835 as follows: Outline letter Descriptive designator Terminal
7、s Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. VCCto power ground . 0 V dc to +18 V dc VEEto power ground 0 V dc to -18 V dc Digital inputs to power ground . -1.0 V dc to +7.0 V d
8、c Reference input to reference ground . 12 V dc Bipolar offset to reference ground . 12 V dc 10 V span R to reference ground 12 V dc 20 V span R to reference ground 24 V dc Ref out or VOUTshort circuit duration . 1/ Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) +
9、300C Power dissipation 1.0 W Thermal resistance, junction to case (JC). See MIL-STD-1835 Thermal resistance, junction to ambient (JA) . 80C/W Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Positive supply voltage range (VCC) +12 V dc to +15 V dc Negative supply voltage range (
10、VEE) . -12 V dc to -15 V dc Ambient operating temperature range (TA) . -55C to +125C _ 1/ Indefinite short to power ground; momentary short to VCC. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89617 DLA LA
11、ND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise
12、specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835
13、- Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standa
14、rdization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes
15、 applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that
16、is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in
17、 accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QM
18、L“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The
19、 case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Functional block diagram. The Functional block diagram shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise
20、 specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each
21、subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89617 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical perf
22、ormance characteristics. Test Symbol Conditions -55C TA+125C 1/ unless otherwise specified Group A subgroups Device type Limits Unit Min Max Relative accuracy RA All bits with positive errors on and all bits with negative errors on 1, 2, 3 01 1.0 LSB Differential nonlinearity DNL Major carry errors
23、1, 2, 3 01 1.0 LSB Gain error 2/ AEAll bits on, TA= +25C 1 01 0.2 %FSR Gain temperature coefficient TAEAll bits on 2, 3 01 30 ppm/C Unipolar offset error VOSAll bits off, TA= +25C 1 01 2.0 LSB Unipolar offset temperature coefficient TVOSAll bits off 2, 3 01 3.0 ppm/C Bipolar zero error 2/ BPZEMSB on
24、, all other bits off, bipolar mode, TA= +25C 1 01 0.1 %FSR Bipolar zero temperature coefficient TBPZEMSB on, all other bits off, bipolar mode 2, 3 01 10 ppm/C Reference input 3/ resistance RINTA= +25C 4 01 15 25 k Reference output voltage VREFUnipolar mode, 1.1 mA external load 1, 2, 3 01 9.9 10.1 V
25、 Output current 3/ IOUT1, 2, 3 01 5.0 mA Output short circuit 3/ current ISC1, 2, 3 01 40 mA Power supply rejection ratio PSRR +11.4 V VCC +16.5 V 1 01 10 ppm of FSR/% 2, 3 20 -11.4 V VEE -16.5 V 1 10 2, 3 20 Power supply current ICCVCC= +16.5 V, TA= +25C, all bits on 1, 2, 3 01 +13 mA IEEVEE= -16.5
26、 V, TA= +25C, all bits off -23 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89617 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR
27、97 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions -55C TA+125C 1/ unless otherwise specified Group A subgroups Device type Limits Unit Min Max Digital input high voltage VIH1, 2, 3 01 2.0 V Digital input low voltage VIL1 01 0.8 V 2, 3 0.7 Digital input high curre
28、nt IIHVIH= 5.5 V, TA= +25C 1 01 10 A Digital input low current IILVIL= 0.0 V, TA= +25C 1 01 5 A Data setup time tDSSee figure 3 4/ 9, 10, 11 01 90 ns Data hold time tDH9, 10, 11 01 20 ns CS pulse width tCP9, 10, 11 01 90 ns Output voltage settling time tSLRL= 2.0 k, CL= 500 pF, See figure 3 4/ RFB=
29、10 k 9, 10, 11 01 4.0 s RFB= 5 k 3.0 1/ VCC= +15 V, VEE= -15 V, 50 resistor between pin 6 and pin 7, CS = logic 0, VIH= 2.0 V, VIL= 0.8 V and unipolar 10 V configuration, unless otherwise specified. 2/ Adjustable to 0 V. 3/ If not tested, shall be guaranteed to the limits specified in table I. 4/ VC
30、C= +12 V or +15 V and VEE= -12 V or -15 V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89617 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 Device type 01 C
31、ase outline L Terminal Number Terminal symbol 1 20 V SPAN 2 10 V SPAN 3 SUM JCT 4 BIP OFF 5 AGND 6 REF OUT 7 REF IN 8 VCC 9 VOUT 10 VEE 11 CS 12 DGND 13 DB0 (LSB) 14 DB1 15 DB2 16 DB3 17 DB4 18 DB5 19 DB6 20 DB7 21 DB8 22 DB9 23 DB10 24 DB11 (MSB) FIGURE 1. Terminal connections. Provided by IHSNot f
32、or ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89617 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Output range Digital input codes Connect pin 9 to Connect pin 1 to Connect pin
33、2 to Connect pin 4 to 10 V Offset binary 1 9 NC 6 (through 50 fixed or 100 trim resistor) 5 V Offset binary 1 and 2 2 and 9 1 and 9 6 (through 50 fixed or 100 trim resistor) 2.5 V Offset binary 2 3 9 6 (through 50 fixed or 100 trim resistor) 0 to +10 V Straight binary 1 and 2 2 and 9 1 and 9 5 (or o
34、ptional trim see figure 2) 0 to +5 V Straight binary 2 3 9 5 (or optional trim see figure 2) Output voltage range connections FIGURE 2. Functional block diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 596
35、2-89617 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Timing diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89617 DLA LAND AND MARITIME COL
36、UMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entir
37、e SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance
38、 indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of suppl
39、y in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of co
40、nformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9
41、 Verification and review. DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATIO
42、N 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following addit
43、ional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit s
44、hall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
45、 tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89617 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 10 DSCC
46、 FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004) 1*, 2, 3 Group A test requirements (method 5005) 1, 2,
47、 3, 4*, 9*, 10*, 11* Groups C and D end-point electrical parameters (method 5005) 1 * PDA applies to subgroup 1. * Subgroups 4, 9, 10, and 11, if not tested shall be guaranteed to the limits specified in table I herein. 4.3 Quality conformance inspection. Quality conformance inspection shall be in a
48、ccordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5, 6, 7, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life te
