1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. - ro 02-12-04 R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY JOSEPH
2、A. KERBY DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY CHARLES E. BESORE COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, HIGH-VOLTAGE, HIGH CURRENT, DARLINGTON TRANSISTOR AND
3、AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-12-27 ARRAYS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-89686 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E105-03 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHS
4、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89686 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements fo
5、r MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89686 01 V X Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1
6、.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 2824 Eight-gate Darlington transistor array 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive
7、designator Terminals Package style V GDIP1-T18 or CDIP2-T18 18 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Output voltage (VCE) - 95 V dc Input voltage - 30 V dc Continuous col
8、lector current (IC) - 500 mA maximum Continuous base current (IB) - 25 mA maximum Power dissipation (PD) - 1.0 W 1/ Storage temperature range - -65C to +150C Junction temperature (TJ) - +175C Maximum package power dissipation (PD), (TA= +125C) - 330 mW Thermal resistance, junction-to-case (JC) - See
9、 MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case V - 75C/W Case 2 - 130C/W 1.4 Recommended operating conditions. Ambient operating temperature range (TA) -55C to +125C _ 1/ Absolute maximum rating for power dissipation is for one Darlington pair only. Provided by IHSNot for ResaleNo
10、reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89686 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. Th
11、e following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto,
12、cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBO
13、OKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building
14、4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption
15、 has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certif
16、ied and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented
17、in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is re
18、quired to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.
19、2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Switching test circuit and waveforms. The switching test circuit and waveforms shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical
20、performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89686 DEFENSE SUPPLY CENTER COLUMBUS
21、COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Output leakage current ICEXVCE= 95 V 1,2,3 01 100.0 A VCE= 95 V,
22、 VIN= 1 v 1 500.0 VCE= 95 V, VIN= 0.5 V 2 500.0 Collector-emitter saturation voltage VCE(sat)IC= 350 mA, IB= 500 A 1 01 1.6 V IC= 200 mA, IB= 350 A 1.3 IC= 100 mA, IB= 250 A 1.1 IC= 350 mA, IB= 500 A 2 1.8 IC= 200 mA, IB= 350 A 1.5 IC= 100 mA, IB= 250 A 1.3 IC= 350 mA, IB= 850 A 3 1.8 IC= 200 mA, IB
23、= 550 A 1.5 IC= 100 mA, IB= 350 A 1.3 Input voltage VIN(ON)VCE 2 V, IC= 125 mA 2 01 5.0 V VCE 2 V, IC= 200 mA 6.0 VCE 2 V, IC= 275 mA 7.0 VCE 2 V, IC= 350 mA 8.0 VCE 2 V, IC= 125 mA 1,3 6.0 VCE 2 V, IC= 200 mA 8.0 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or network
24、ing permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89686 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TA +125C unless ot
25、herwise specified Group A subgroups Device type Limits Unit Min Max Input voltage VIN(ON)VCE 2 V, IC= 275 mA 3 01 10 V VCE 2 V, IC= 350 mA 12 Input current IIN(ON)VIN= 5.0 V 1,2,3 01 240 500 A VIN= 12 V 650 1450 Input current IIN(OFF)IC= 500 A, TA= +125C 2 01 20 A DC forward current transfer ratio h
26、FEVCE= 2 V, IC= 350 mA 1,2 01 1000 3 500 Clamp diode leakage current IRVR= 95 V 1,2,3 01 50 A Clamp diode forward voltage VFIF= 350 mA 1,2,3 01 2.0 V Input capacitance CINSee 4.3.1c 4 01 25 pF Turn-on delay time tPLHSee figure 2 9,10,11 01 1000 ns Turn-off delay time tPHLSee figure 2 9,10,11 01 1000
27、 ns 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN list
28、ed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certif
29、ication/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is
30、used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall aff
31、irm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89686 DEFENSE SUPPLY CENTER COLUMBUS COLUMBU
32、S, OHIO 43216-5000 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines V 2 Terminal number Terminal symbol 1 INPUT 1 NC 2 INPUT 2 INPUT 1 3 INPUT 3 INPUT 2 4 INPUT 4 INPUT 3 5 INPUT 5 INPUT 4 6 INPUT 6 INPUT 5 7 INPUT 7 INPUT 6 8 INPUT 8 INPUT 7 9 GND INPUT 810 COM GND 11 OUT
33、PUT 8 NC 12 OUTPUT 7 COM 13 OUTPUT 6 OUTPUT 8 14 OUTPUT 5 OUTPUT 7 15 OUTPUT 4 OUTPUT 6 16 OUTPUT 3 OUTPUT 5 17 OUTPUT 2 OUTPUT 4 18 OUTPUT 1 OUTPUT 3 19 - OUTPUT 2 20 - OUTPUT 1 NC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted w
34、ithout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89686 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 FIGURE 2. Switching test circuit and waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted wit
35、hout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89686 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided wi
36、th each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix A. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacture
37、rs facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screenin
38、g. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be
39、maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test meth
40、od 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conform
41、ance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5, 6, 7, and 8 in table I, method 5005 of MIL-S
42、TD-883 shall be omitted. c. Subgroup 4 (CINmeasurement) shall be measured only for the initial test and after process or design changes which may affect input capacitance. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state l
43、ife test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs
44、, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking p
45、ermitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89686 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-88
46、3, method 5005, table I) Interim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004) 1*,2,3,9 Group A test requirements (method 5005) 1,2,3,4,9,10*,11* Groups C and D end-point electrical parameters (method 5005) 1 * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use
