1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add notes to figure 4, switching waveforms and test circuit. Update the boilerplate to current requirements as specified in MIL-PRF-38535. Editorial changes throughout. jak 06-04-27 Thomas M. Hess B Update boilerplate paragraphs to the current MI
2、L-PRF-38535 requirements. - LTG 12-05-17 Thomas M. Hess REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Marcia B. Kelleher DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING
3、THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY Thomas J. Ricciuti APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, 14-STAGE BINARY COUNTER WITH OSCILLATOR, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON DRAWING APPROVA
4、L DATE 90-10-02 REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89771 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E303-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89771 DLA LAND AND MARITIME COLUMBUS, OHIO 4
5、3218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in t
6、he following example: 5962-89771 01 E A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54HCT4060 14- stage binary counter with os
7、cillator and TTL compatible inputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535,
8、appendix A. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc DC input voltage range (VIN) . -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) -0.5 V dc to VCC+ 0.5 V dc DC input diode current (IIK) . 20 mA DC output diode current (per pin) (IOK) 20
9、mA DC drain current (per pin) (IOUT) 25 mA DC VCCor GND current (ICC, IGND) 50 mA Storage temperature range (TSTG) -65C to +150C Maximum power dissipation (PD) 500 mW 4/ Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (
10、TJ) . +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc Case operating temperature range (TC) -55C to +125C Input rise or fall time (tr, tf): VCC= 4.5 V 0 to 500 ns Maximum input pulse frequency (fMAX): TC= +25C, VCC= 4.5 V . 30 MHz TC= -55C to +125C, VC
11、C= 4.5 V . 20 MHz Minimum input pulse width (tW1): TC= +25C, VCC= 4.5 V . 16 ns TC= -55C to +125C, VCC= 4.5 V . 24 ns Minimum reset pulse width (tW2): TC= +25C, VCC= 4.5 V . 25 ns TC= -55C to +125C, VCC= 4.5 V . 38 ns Minimum reset removal time (tREM): TC= +25C, VCC= 4.5 V . 26 ns TC= -55C to +125C,
12、 VCC= 4.5 V . 39 ns _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise specified, all voltages are referenced to ground. 3/ The limits for the parameter
13、s specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ For TA= +100C to +125C, derate linearly at 8 mW/C Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 596
14、2-89771 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unl
15、ess otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits.
16、 MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or f
17、rom the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the s
18、olicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEDEC Standard No. 7 - Standard for Description of 54/74HCXXXXX and 54/74HCTXXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology As
19、sociation, 3103 North 10thStreet, Suite 240-S Arlington, VA 22201). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regul
20、ations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified
21、 Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-3
22、8535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in a
23、ccordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall
24、be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Test circuit and switching
25、 waveforms. The test circuit and switching waveforms shall be as specified on figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89771 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B S
26、HEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test req
27、uirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also
28、 be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in comp
29、liance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer i
30、n order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A
31、 and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be req
32、uired for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available on
33、shore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89771 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical pe
34、rformance characteristics. Test Symbol Test conditions 1/ -55C TC +125C unless otherwise specified VCCGroup A subgroups Limits Unit Min Max High level output voltage VOHVIN= VIH= 2.0 V or VIL= 0.8 V IOH= -20 A 4.5 V 1, 2, 3 4.4 V IOH= -4.0 mA 2/ 3.7 Low level output voltage VOLVIN= VIH= 2.0 V or VIL
35、= 0.8 V IOL= +20 A 4.5 V 1, 2, 3 0.1 IOL= +4 mA 2/ 0.4 High level input voltage VIH3/ 4.5 V 1, 2, 3 2.0 Low level input voltage VIL3/ 4.5 V 0.8 Input capacitance CINSee 4.3.1c 4 10 pF Quiescent supply current ICCVIN= VCCor GND, IOUT= 0.0 A 5.5 V 1, 2, 3 160 A Input leakage current IINVIN= VCCor GND
36、5.5 V 1, 2, 3 1.0 A Additional quiescent supply current, TTL input levels ICC4/ Any one input, VIN= 2.4 V Other inputs, VIN= VCCor GND IOUT= 0.0 A 5.5 V 1, 2, 3 3.0 mA Functional tests See 4.3.1d 7, 8 Propagation delay time, to Q4 tPLH1, tPHL1CL= 50 pF See figure 4 4.5 V 9 66 ns 10, 11 100 Propagati
37、on delay time, Qn to Qn +1 tPLH2, tPHL24.5 V 9 16 ns 10, 11 24 Propagation delay time, MR to Qn tPHL34.5 V 9 44 ns 10, 11 66 Output transition time tTLH, tTHL5/ 4.5 V 9 15 ns 10, 11 22 1/ For a power supply of 5 V 10 percent, the worst case output voltages (VOHand VOL) occur for HCT at 4.5 V. Thus,
38、the 4.5 V values should be used when designing with this supply. Worst cases VIHand VILoccur at VCC= 5.5 V and 4.5 V, respectively. 2/ For pin 9 (O), IO = 3.2 mA and for pin 10 (O), IO = 2.6 mA. 3/ The VIHand VILtests are not required and shall be applied as forcing functions for VOHor VOLtests. For
39、 pin 11 (), VIH= 3.15 V and VIL= 0.9 V. 4/ Guaranteed, if not test, to the limits specified in table I. 5/ Transition times (tTLH, tTHL), if not tested, shall be guaranteed to the specified limits in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from I
40、HS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89771 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outline E Terminal number Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Q12 Q13 Q14 Q6 Q5 Q7 Q4 GND O O MR Q9 Q8 Q10 VCCF
41、IGURE 1. Terminal connections. Inputs Output state MR L No change L Advance to next state X H All outputs are low L = Low voltage level H = High voltage level = Low-to-high transition of the clock = High-to-low transition of the clock X = Irrelevant FIGURE 2. Truth table. Provided by IHSNot for Resa
42、leNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89771 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking pe
43、rmitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89771 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. CL= 50 pF or equivalent (includes test jig and probe capacitance). 2. Input signal from pulse generator: VIN=
44、0.0 V to 3.0 V; PRR 1 MHz; ZO= 50; tr= 6.0 ns; tf= 6.0 ns; trand tfshall be measured from 0.3 V to 2.7 V and from 2.7 V to 0.3 V, respectively; duty cycle = 50 percent. 3. The outputs are measured one at a time with one transition per measurement. FIGURE 4. Switching waveforms and test circuit. Prov
45、ided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89771 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspe
46、ction procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, meth
47、od 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and po
48、wer dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (met
