1、 DSCC FORM 2233 APR 97 5962-E403-07 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. Editorial changes throughout. - gap 00-11-30 Raymond Monnin B Boilerplate update and part of five year review. tcr 07-06-07 Robert M. Heber THE ORIGINAL FIRST PAG
2、E OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV B SHET 15 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Kenneth Rice DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles Reusing COLUMBUS, OHIO 43218-3990
3、http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT, MEMORY, DIGITAL, CMOS 16K X 4 SRAM WITH OE AND DUAL CE, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-03-26 AMSC N/A REVISION LEVEL B SIZE
4、A CAGE CODE 67268 5962-89891 SHEET 1 OF 15 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89891 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1. SCO
5、PE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89891 01 L A Drawing number Device t
6、ype (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Access time 01 4C198AL-25 16K X 4 Static RAM with OE and Dual CE 25 ns (data retention) 02 4C198A-25 25 ns 03 4
7、C198AL-20 20 ns (data retention) 04 4C198A-20 20 ns 05 4C198AL-15 15 ns (data retention) 06 4C198A-15 15 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 dual-in-l
8、ine package X CQCC3-N28 28 leadless chip carrier package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc 1/ DC output current . 20 mA Ambient storage temperature . -65C to +150C Tempera
9、ture under bias . -55C to +125C Thermal resistance, junction-to-case (JC): Cases L and X See MIL-STD-1835 Power dissipation (PD) 1.0 W Lead temperature (soldering, 10 seconds) . +260C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc 1/ Ground voltage (VSS) (G
10、ND) . 0 V dc Input high voltage (VIH) . -2.2 V dc to VCC+0.5 V dc Input low voltage (VIL) . -0.5 V dc to 0.8 V dc 2/ Operating case temperature range (TC) . -55C to +125C _ 1/ All voltages referenced to VSS. 2/ VILnegative undershoots to a minimum of -2.0 V dc are allowed with a maximum 20 ns pulse
11、width. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89891 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government spe
12、cification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-P
13、RF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircu
14、it Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order
15、 of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Ite
16、m requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufac
17、turer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may mak
18、e modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option
19、 is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal conn
20、ections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection only. Each coated microcircuit inspection lot (see inspection lot
21、 as defined in MIL-PRF-38535) shall be subjected to and pass the internal moisture content test at 5000 ppm (see method 1018 of MIL-STD-883). The frequency of the internal water vapor testing shall not be decreased unless approved by the preparing activity. Samples may be pulled anytime after seal.
22、3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgro
23、ups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages wher
24、e marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- STANDARD MICROCIRCUIT DRAWING SIZE A 5962-8989
25、1 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C 4.5 V VCC 5.5 V VSS= 0 V Group A subgroupsDevice type Limits Unit unless otherwise specified Min Max Input l
26、eakage current ILIVCC= max, 1, 2, 3 All 10 A VIN= GND to VCCOutput leakage current ILOVCC= max, 1, 2, 3 All 10 A OUT= GND to VCC, CE VIH, WE VILOutput low voltage VOLVCC= 4.5 V, IOL= 8 mA, 1, 2, 3 All 0.4 V VIL= 0.8 V, VIH= 2.2 V Output high voltage VOHVCC= 4.5 V, IOH= -4 mA, 1, 2, 3 All 2.4 V IL= 0
27、.8 V, VIH= 2.2 V Operating supply current ICC1CE = VIL, outputs open, 1, 2, 3 01, 03 120 mA VCC= max, f = 1/tAVAV02, 04 130 05, 06 150 Standby power supply ICC2CE VIH, outputs open, 1, 2, 3 01, 03, 20 mA current (TTL) VCC= max, f = 0 MHz 05 02, 04, 06 50 Standby power supply ICC3VCC+0.2 V CE VCC-0.2
28、 V, 1, 2, 3 01, 03, 5 mA current (CMOS) outputs open, 05 VCC+0.2 V VIN VCC-0.2 V or +0.2 V VIN -0.2 V, 02, 04, 20 f = 0 MHz 06 Data retention current ICC4VCC= VDR1, 2, 3 01, 03, 600 A = 2.0 V 05 Input capacitance 1/ CINVI= 0 V 4 All 10 pF f = 1 MHz, TA= +25C, See 4.3.1c Output capacitance 1/ COUTVO=
29、 0 V 4 All 10 pF f = 1 MHz, TA= +25C, See 4.3.1c See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89891 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B
30、 SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TC+125C 4.5 V VCC 5.5 V VSS= 0 V Group A subgroupsDevice type Limits Unit unless otherwise specified Min Max Read cycle time tAVAV2/, 3/, 4/ 9, 10, 11 01, 02 25 ns 03, 04 20 05, 06 1
31、5 Address cycle time tAVQV9, 10, 11 01, 02 25 ns 03, 04 20 05, 06 15 Chip enable access time tELQV9, 10, 11 01, 02 25 ns 03, 04 20 05, 06 15 Output hold from address tAVQX9, 10, 11 All 0 ns change Output enable to tOLQV9, 10, 11 All 15 ns output valid Chip select to output tELQX9, 10, 11 All 3 ns in
32、 low Z 1/ 5/ Output enable to output tOLQX9, 10, 11 All 3 ns in low Z 1/ 5/ Chip select to output tEHQZ9, 10, 11 All 10 ns in high Z 1/ 5/ Output disable to output tOHQZ9, 10, 11 All 10 ns in high Z 1/ 5/ See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permi
33、tted without license from IHS-,-,- STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89891 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TC+125C 4.5 V VCC 5.5 V VS
34、S= 0 V Group A subgroupsDevice type Limits Unit unless otherwise specified Min Max Write enable to output in tWLQZ2/, 3/, 4/ 9, 10, 11 01, 02 15 ns high Z 1/, 5/ 03, 04 12 05, 06 10 Data valid to end of write tDVWH9, 10, 11 01, 02 15 ns 03, 04 12 05, 06 10 Data hold time tWHDX9, 10, 11 All 0 ns Outp
35、ut active from end of tWHQX9, 10, 11 All 3 ns write 1/, 5/ Write cycle time 1/ tAVAV9, 10, 11 01, 02 25 ns 03, 04 20 05, 06 15 Chip select to end of write tELWH9, 10, 11 01, 02 20 ns 4/ 03, 04 17 05, 06 14 Address valid to end of tAVWH9, 10, 11 01, 02 20 ns write 03, 04 17 05, 06 14 Address setup ti
36、me tAVWL9, 10, 11 All 0 ns Write pulse width tWLWH9, 10, 11 01, 02 20 ns 03, 04 17 05, 06 14 Write recovery time tEHAX9, 10, 11 01-06 0 ns Chip disable to data tCDR9, 10, 11 01, 03, 0 ns retention time 05 Data retention recovery tR9, 10, 11 01, 03, tAVAV ns time 05 1/ This parameter tested initially
37、 and after any design or process change which could affect this parameter, and is therefore guaranteed to the limits specified in table I. 2/ For timing waveforms, see figure 3. 3/ AC parameters are tested using input rise and fall times of 5 ns and input pulse levels of GND to 3.0 V. Both input and
38、 output timing reference levels are 1.5 V, and the output load is shown on figure 4. 4/ Both chip selects must be active low for the device to be selected. 5/ Transition is measured 500 mV from steady state. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IH
39、S-,-,- STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89891 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 Device types 01 through 06 Case outlines L X Terminal number Terminal symbol 1 A0NC 2 A1NC 3 A2A04 A3A15 A4A26 A5A37 A6A48 A7A59 A8A610 CE1A7
40、 11 OE A812 GND CE113 WE OE 14 I/O1GND 15 I/O2CE216 I/O3WE 17 I/O4I/O118 CE2I/O2 19 A9I/O320 A10I/O421 A11A922 A12A1023 A13A1124 VCCA1225 - A1326 - NC 27 - NC 28 - VCCNC = no connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without licen
41、se from IHS-,-,- STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89891 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 Mode CE1CE2WE OE I/O Power Standby H X X X High Z Standby Standby X H X X High Z Standby Read L L H L DOUTActive Write L L L X DINA
42、ctive Read L L H H High Z Active FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89891 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 10 DSCC FORM 2234
43、 APR 97 NOTE: tCDR= 0 ns (minimum); may not be tested, but is guaranteed. tr= tAVAXFIGURE 3. Switching time waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89891 DEFENSE SUPPLY CENTER COLUMBUS COL
44、UMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 11 DSCC FORM 2234 APR 97 FIGURE 3. Switching time waveforms - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89891 DEFENSE SUPPLY CENTER COLUMBUS COL
45、UMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 12 DSCC FORM 2234 APR 97 FIGURE 3. Switching time waveforms - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89891 DEFENSE SUPPLY CENTER COLUMBUS COL
46、UMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 13 DSCC FORM 2234 APR 97 FIGURE 3. Switching time waveforms - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89891 DEFENSE SUPPLY CENTER COLUMBUS COL
47、UMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 14 DSCC FORM 2234 APR 97 FIGURE 4. Output load circuits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89891 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 15 DSCC FORM 2234 APR 97 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A
