1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Updated boilerplate for 5 Year Review. lhl 12-02-01 Charles F. Saffle THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARE
2、D BY Kenneth Rice DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY William J. Johnson APPROVED BY Michael A. Frye MICROCIRCUIT, MEM
3、ORY, DIGITAL, BIPOLAR, ECL, PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON DRAWING APPROVAL DATE 91-08-23 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-90573 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E120-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license f
4、rom IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90573 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with
5、MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-90573 01 L A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as fol
6、lows: Device type Generic number Circuit function Propagation delay 01 10E301 16-input 8-output combinatorial PLD 5 ns 02 10E302 16-input 4-output combinatorial PLD 4 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator
7、 Terminals Package style L GDIP3-T24 or CDIP4-T24 24 dual-in-line package X See figure 1 28 J-leaded chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range VEEto VCC. -7.0 V dc to +0.5 V dc DC Input voltage ran
8、ge . VEEto +0.5 V dc Output current . -50 mA Maximum power dissipation . 1.31 W Lead temperature (soldering, 10 seconds) . +260C Thermal resistance, junction-to-case (JC): Case outline L . See MIL-STD-1835 Case outline X . 20C/W 1/ Junction temperature (TJ) +175C Storage temperature range -65C to +1
9、50C Temperature under bias . -55C to +125C _ 1/ When the thermal resistance for this case is specified in MIL-STD-1835, that value shall supersede the value indicated herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWI
10、NG SIZE A 5962-90573 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage (VEE) -5.46 V dc to -4.94 V dc Minimum high level input voltage (VIH): TA = +25C -0.810 V TC= +125C . -0.700 V TC= -55C -0.920 V Ma
11、ximum low-level input voltage (VIL): TA = +25C . -1.950 V TC = +125C . -1.950 V TC = -55C . . -1.950 V Case operating temperature range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
12、 of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDAR
13、DS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available on
14、line at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawi
15、ng takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B de
16、vices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manuf
17、acturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifi
18、cations shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specifie
19、d in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth tables. The truth table shall be as specified on figure 3.
20、Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90573 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3.2.3.1 Unprogrammed devices. The truth table for unprogram
21、med devices for contracts involving no altered item drawing shall be as specified on figure 3. When required in screening (see 4.2 herein) or qualification conformance inspection, groups A, B, or C (see 4.3), the devices shall be programmed by the manufacturer prior to test. A minimum of 50 percent
22、of the total number of cells shall be programmed or at least 25 percent of the total number of cells to any altered item drawing. 3.2.3.2 Programmed devices. The truth table for programmed devices shall be as specified by an attached altered item drawing. 3.3 Electrical performance characteristics.
23、Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical te
24、sts for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is no
25、t feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall b
26、e replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
27、 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificat
28、e of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and revie
29、w. DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Processing options. Since the de
30、vice is capable of being programmed by either the manufacturer or the user to result in a wide variety of configuring; two process options are provided for selection in the contract, using an altered item drawing. 3.10.1 Unprogrammed device delivered to the user. All testing shall be verified throug
31、h group A testing as defined in 3.2.3.1 and table II. It is recommended that users perform subgroups 7 and 9 after programing to verify the specific program configuration. 3.10.2 Manufacturer-programmed device delivered to the user. All testing requirements and quality assurance provisions herein, i
32、ncluding the requirements of the altered item drawing, shall be satisfied by the manufacturer prior to delivery. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90573 DLA LAND AND MARITIME COLUMBUS, OHIO 4321
33、8-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions VCC= 0.0V, -55C TC +125C -5.46 V VEE -4.94 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Output high voltage 1/ VOHOutputs terminated through
34、 50 to -2.0 V VCC= 0.0 V VEE= -5.2 V VIHVIL1 2 3 V -1.130 -1.050 -1.270 -1.480 -1.440 -1.520 All -0.980 -0.900 -1.140 -0.810 -0.700 -0.920 Output low voltage 1/ VOL-1.130-1.050 -1.270 -1.480 -1.440 -1.520 1 2 3 All -1.950 -1.950 -1.950 -1.630 -1.590 -1.650 Input high voltage 1/ VIH1 2 3 All -1.130 -
35、1.050 -1.270 -0.810 -0.700 -0.920 Input low voltage 1/ VIL1 2 3 All -1.950 -1.950 -1.950 -1.480 -1.440 -1.520 Input high current IIHVIN = VIHMax. 1, 2, 3 All 220 A Input low current IIL IN = VILMin. 2/ 1, 2, 3 All 0.5 Power supply current IEEVEE= -5.46 V, Inputs and outputs open 1, 2, 3 01 -240 mA 0
36、2 -220Input capacitance CIN 3/ VEE= -5.2 V TA = 25C, f = 1MHz (see 4.3.1c) 4 All 10 pF Output capacitance COUT 3/ VEE= -5.2 V TA = 25C, f = 1MHz (see 4.3.1c) 4 All 10 Functional tests See 4.3.1d 7, 8 All Input to output propagation delay tPDSee figures 4 and 5. 9, 10, 11 01 5.0 ns 02 4.0Output rise
37、time trSee figures 4 and 5. 9, 10, 11 All 0.35 1.5 Output fall time tf1/ Subgroup 1 specified at TA= +25C. 2/ Input (I) pins only. 3/ Tested initially and after any design or process changes that affect that parameter, and therefore shall be guaranteed to the limits specified in table I. Provided by
38、 IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90573 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 Case X NOTES: 1. Dimensions are in inches. 2. Metric equivalents are g
39、iven for general information only. FIGURE 1. Case outline. Symbol Dimension (unit: in) Dimension (unit: mm) Min. Max. Min. Max. A .035 .045 0.89 1.14A1 .090 .120 2.29 3.05 A2 .155 .180 3.94 4.57 b .017 .021 0.43 0.53b1 .026 .032 0.66 0.81 c .006 .010 0.15 0.25c1 .035 .045 0.89 1.14 D/E .485 .495 12.
40、32 12.57 D1/E1 .442 .458 11.23 11.63 e .390 .430 9.91 10.92e1 .050 BSC 1.27 BSC e2 .300 REF 7.62 REF S .040 REF 1.02 REF S1 .035 REF 0.89 REF S2 .008 0.20 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90573
41、 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Device Types 01 02 Case Outlines L X L X Terminal Number Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 I I I I/O O VCC1 O I/O I I I VEEI I I I I/O O VCC2O I/O
42、I I VCC- - - - NC I I I I/O O VCC1 NC O I/O I I I VEENC I I I I I/O O NC VCC2O I/O I I VCCI I I I O VCC1 O I I I I VEEI I I I I O VCC2O I I I VCC- - - - NC I I I I O VCC1 NC O I I I I VEE NC I I I I I O NC VCC2O I I I VCCFIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or
43、 networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90573 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 Truth table Input pins I Output pins O X L NOTE: X = Dont care FIGURE 3. Truth table (unprogrammed). Switc
44、hing test loads FIGURE 4. Test circuit and test conditions. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90573 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97
45、 All input pulses NOTES: 1. VIL = VIL minimum, VIH= VIHmaximum. 2. RL= 50, C 5pF (includes fixture and stray capacitance). 3. All coaxial cables should be 50 with equal lengths. The delay of the coaxial cables should nulled out of the measurement. 4. tr= tf= 0.7 ns for input pulses. 5. Propagation d
46、elay timing measurements are made from the 50% point of the input to 50% point of the output waveform. 6. Output trand tf are measured at the 20% and 80% points of the output waveform. FIGURE 4. Test circuit and test conditions Continued. FIGURE 5. Switching waveforms. Provided by IHSNot for ResaleN
47、o reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90573 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 10 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additiona
