1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Technical and editorial changes throughout. Add RHA requirements. CS 97-11-05 Monica L. Poelking B Add case outline Z. Add radiation features for device type 01. Update the boilerplate to MIL-PRF-38535 requirements. Editorial changes throughout.
2、- TVN 02-08-09 Thomas M. Hess C Update boilerplate to MIL-PRF-38535 requirements. - LTG 08-06-26 Thomas M. Hess REV SHET REV C C C C C C C SHEET 15 16 17 18 19 20 21 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Larry T. Gauder DEFEN
3、SE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Thomas J Ricciuti COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-06-03 MICROCIRC
4、UIT, DIGITAL, ADVANCED CMOS, HEX INVERTER WITH OPEN DRAIN OUTPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-90590 SHEET 1 OF 21 DSCC FORM 2233 APR 97 5962-E393-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDAR
5、D MICROCIRCUIT DRAWING SIZE A 5962-90590 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes B, S, Q and M) and space appli
6、cation (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 9
7、0590 01 M C A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA l
8、evels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit
9、 function as follows: Device type Generic number Circuit function 01 54AC05 Hex inverter with open drain outputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor s
10、elf-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A B, S, Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
11、 Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack Z GDFP1-G14 14 Flat pack with gullwing 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for dev
12、ice classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90590 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSC
13、C FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +6.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc Input clamp diode current (IIK) 20 mA Output clamp diode current (IOK) 20 m
14、A DC output current (IOUT) per output pin 50 mA DC VCCor GND current (ICC, IGND) per pin 300 mA Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 500 mW Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Juncti
15、on temperature (TJ) +175C 1.4 Recommended operating conditions. 2/ 3/ 4/ 5/ Supply voltage range (VCC) +3.0 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT) +0.0 V dc to VCC Maximum low level input voltage (VIL) . 0.90 V at VCC= 3.0 V dc 1.35 V at VCC= 4.5 V dc
16、 1.65 V at VCC= 5.5 V dc Maximum high level input voltage (VIH) . 2.10 V at VCC= 3.0 V dc 3.15 V at VCC= 4.5 V dc 3.85 V at VCC= 5.5 V dc Case operating temperature range (TC) -55C to +125C Input edge rate (V/t) minimum (VINfrom 30% to 70% of VCC) 125 mV/ns Maximum low level output current (IOL) 24
17、mA at VCC= 3.0 V and 3.6 V dc 24 mA at VCC= 4.5 V and 5.5 V dc 1.5 Radiation features. Maximum total dose available (dose rate = 50 300 rads (Si)/s): Device type 01 . 100 Krads (Si) Single Event Latch-up (SEL) . 100 MeV-cm2/mg 1/ Stresses above the absolute maximum rating may cause permanent damage
18、to the device. Extended operation at the maximum levels may degrade performance and affect reliability. The maximum junction temperature may be exceeded for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 2/ Unless otherwise noted, all voltages ar
19、e referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ Operation from 2.0 V dc to 3.0 V dc is provided for compatibility with data retention and battery backup systems. Data retention implies
20、 no input transitions and no stored data loss with the following conditions: VIH 70 percent of VCC, VIL 30 percent of VCC, VOH 70 percent of VCCat -20 A, VOL 30 percent of VCCat 20 A. 5/ The minimum value for the output pull-up resistors are 229 at VCC= 5.5 V, and 300 at VCC= 3.6 V. The minimum valu
21、es shall apply over the ambient temperature range of -55C to +125C and shall include the negative tolerance values of the pull-up resistors used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90590 DEFENSE
22、SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless oth
23、erwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-ST
24、D-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/ass
25、ist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these doc
26、uments cited in the solicitation or contract. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No. 20 - Standard for Description of 54/74ACXXXXX and 54/74ACTXXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from Electronic Industries
27、 Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations
28、unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modificatio
29、n in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. Th
30、e design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The te
31、rminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce load circuit and waveforms shall be
32、as specified on figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90590 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 3.2.6 Switching waveform
33、s and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.2.7 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring ac
34、tivity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperatur
35、e range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may als
36、o be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V sha
37、ll be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class
38、M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a ce
39、rtificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufactu
40、rers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for de
41、vice class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is require
42、d for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available o
43、nshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 36 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license fr
44、om IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90590 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits 5/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ 3/ -55C TC +125C
45、 3.0 V VCC 5.5 V unless otherwise specified Device type and device class 4/ VCCGroup A subgroups Min Max Unit VOL16/ For all inputs affecting output under test VIN= VIHor VILVIH= 2.10 V VIL= 0.90 V For all other inputs VIN= VCCor GND IOL= 50 A All All 3.0 V 1, 2, 3 0.1 VOL2 6/ For all inputs affecti
46、ng output under test VIN= VIHor VILVIH= 3.15 V VIL= 1.35 V For all other inputs VIN= VCCor GND IOL= 50 A All All 4.5 V 1, 2, 3 0.1 For all inputs affecting output under test VIN= VIHor VILVIH= 3.85 V VIL= 1.65 V For all other inputs VIN= VCCor GND IOL= 50 A All All 1, 2, 3 0.1 VOL3M, D, P, L, R 01 B
47、, S, Q, V 5.5 V 1 0.1 1, 3 0.4 All B, S, Q, V 2 0.5 1 0.4 VOL46/ For all inputs affecting output under test VIN= VIHor VILVIH= 2.10 V VIL= 0.90 V For all other inputs VIN= VCCor GND IOL= 12 mA All M 3.0 V 2, 3 0.5 1, 3 0.4 All B, S, Q, V 2 0.5 1 0.4 For all inputs affecting output under test VIN= VI
48、Hor VILVIH= 3.15 V VIL= 1.35 V For all other inputs VIN= VCCor GND IOL= 24 mA All M 2, 3 0.5 Low level output voltage 3007 VOL5M, D, P, L, R 01 B, S, Q, V 4.5 V 1 0.4 V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90590 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits 5/ Test and MIL-STD-883 test method 1/ Symbol Test condi
