1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Replace reference to MIL-STD-973 with reference to MIL-PRF-38535. -rrp 08-05-13 R. HEBER REV SHET REV SHET REV STATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMB
2、US STANDARD MICROCIRCUIT DRAWING CHECKED BY RAJESH PITHADIA COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL FRYE MICROCIRCUIT, LINEAR, WIDEBAND, FOUR QUADRANT ANALOG MULTIPLIER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMEN
3、T OF DEFENSE DRAWING APPROVAL DATE 95-07-20 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-94729 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E194-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94729 D
4、EFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlin
5、es and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 94729 01 Q E X Federal stock class designator RH
6、A designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA d
7、esignator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic numbe
8、r Circuit function 01 HA-2556 Wideband, four quadrant analog multiplier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for
9、 MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminal
10、s Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S
11、TANDARD MICROCIRCUIT DRAWING SIZE A 5962-94729 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Voltage between +VSand -VS. 35 V Differential input voltage (VID). 6 V Output current (IOUT) . 40 mA Power dissipati
12、on (PD) . 1.22 W 2/ Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) . +175C Storage temperature range. -65C to +150C Thermal resistance, junction-to-ambient (JA): 82C/W Thermal resistance, junction-to-case (JC) See MIL-STD-1835 1.4 Recommended operating conditions. Supply
13、voltage range (VS) 15 V Operating ambient temperature range (TA). -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified
14、, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interfa
15、ce Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil
16、 or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document,
17、however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Derating factor above
18、 TA= +75C for case E is 12 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94729 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3
19、.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as
20、described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as spec
21、ified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electric
22、al performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test r
23、equirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages wher
24、e marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-P
25、RF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required i
26、n MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall
27、be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device
28、 classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535,
29、 appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects
30、this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the re
31、viewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 49 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCU
32、IT DRAWING SIZE A 5962-94729 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Ma
33、xInput offset voltage VIOXVY= 5 V 1 01 -15 +15 mV 2, 3 -25 +25 VIOYVX= 5 V 1 -15 +15 2, 3 -25 +25 IOZVX= 0 V, VY= 0 V 1 -15 +15 2, 3 -25 +25 Input bias current IIBXVX= 0 V, VY= 0 V 1 01 -15 +15 A 2, 3 -25 +25 IIBYVY= 0 V, VX= 5 V 1 -15 +15 2, 3 -25 +25 IBZVY= 0 V, VX= 0 V 1 -15 +15 2, 3 -25 +25 Inpu
34、t offset current IIOXVX= 0 V, VY= 5 V 1 01 -2 +2 A 2, 3 -3 +3IIOYVY= 0 V, VX= 5 V 1 -2 +2 2, 3 -3 +3IOZVY= 0 V, VX= 0 V 1 -2 +2 2, 3 -3 +3Common mode rejection ratio CMRRXVCMX= 10 V, VY= 5 V 1, 2, 3 01 65 dB CMRRYVCMY= +9 V, -10 V, VX= 5 V 65 CMRRZVCMZ= 10 V, VX= 0 V, VY= 0 V 65 Power supply rejecti
35、on ratio +PSRRX+VS= +12 V to +17 V, VY= 5 V 1, 2, 3 01 65 dB -PSRRX-VS= -12 V to -17 V, VY= 5 V 45 +PSRRY+VS= +12 V to +17 V, VX= 5 V 65 -PSRRY-VS= -12 V to -17 V, VX= 5 V 45 +PSRRZ+VS= +12 V to +17 V, VX= 0 V, VY= 0 V 65 -PSRRZ-VS= -12 V to -17 V, VX= 0 V, VY= 0 V 45 Output current +IOUTVOUT= +5 V,
36、 RL= 250 1, 2, 3 01 20 mA -IOUTVOUT= -5 V, RL= 250 -20 Output voltage swing +VOUTRL= 250 1, 2, 3 01 5 V -VOUTRL= 250 -5 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94729 DEF
37、ENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min MaxSupply current ICCVX
38、= VY = 0 V 1, 2, 3 01 22 mA Bandwidth BWX-3 dB, VY= 5 V, 3/ VX 200 mVPP, TA= +25C 4 01 30 MHz BWY-3 dB, VX= 5 V, 3/ 4/ VY 200 mVPP, TA= +25C 30 Gain flatness GFX0.1 dB, VY= 5 V, 3/ VX 200 mVPP, TA= +25C 4 01 2 MHz GFY0.1 dB, VX= 5 V, 3/ 4/ VY 200 mVPP, TA= +25C 4 AC feedthrough ACFTXfO= 5 MHz, 3/ 5/
39、 VX= 200 mVPP, VY= nulled, TA= +25C 4 01 -45 dB ACFTYfO= 5 MHz, 3/ 4/ 5/ VY= 200 mVPP, VX= nulled, TA= +25C -45 Output resistance ROUTVY= 5 V, VX= 5 V, 3/ RL= 1 k to 250 , TA= +25C 4 01 1 Overshoot OSXVX = 200 mV step, 3/ VY= 5 V 4 01 35 % 5, 6 50 OSYVY = 200 mV step, 3/ 4/ VX= 5 V 4 35 5, 6 50 Slew
40、 rate SRXVX = 10 mV step, 3/ VY= 5 V 4 01 410 V/s 5, 6 360 SRYVY = 10 mV step, 3/ 4/ VX= 5 V 4 410 5, 6 360 Differential input resistance RINXVX= 5 V, VY= 0 V, 3/ TA= +25C 4 01 650 k RINYVY= 5 V, VX= 0 V, 3/ TA= +25C 650 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or
41、networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94729 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA +125C
42、 unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min MaxMultiplication error ME VX, VY= 5 V 4 01 -3 3 %FS 5, 6 -6 6 Linearity error LE4V VX, VY = 4 V, TA= +25C 4 01 -0.5 0.5 %FS LE5V VY, VX = 5 V, TA= +25C -1 1 Rise and fall time tRX, tFXVX= 200 mVPP step, 3/ VY= 5 V, measure
43、d at 10% to 90% points 9 01 9.5 ns 10, 11 10 tRY, tFYVY= 200 mVPP step, 3/ VX= 5 V, measured at 10% to 90% points 9 9.5 10, 11 10 1/ Unless otherwise specified, VS= 15 V, feedback resistance (RF) = 50 , load resistance (RL) = 1 k, and capacitance load (CL) = 20 pF. 2/ The limiting terms “min“ (minim
44、um) and “max“ (maximum) shall be considered to apply to magnitudes only. Negative current shall be defined as conventional current flow out of a device terminal. 3/ If not tested, shall be guaranteed to the limits specified under table I herein. 4/ VZac characteristic may be implied from VYdue to th
45、e use of VZas feedback in test circuit. 5/ Offset voltage applied to minimize feedback signal. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94729 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 RE
46、VISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 Device type 01 Case outline E Terminal number Terminal symbol 1 GND 2 VREF3 VYIOB4 VYIOA5 +VY6 -VY7 -VS8 VOUT9 +VZ10 -VZ11 +VS12 -VX13 +VX14 NC 15 VXIOB16 VXIOANC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction
47、 or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94729 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspecti
48、on procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q
