1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. Editorial changes throughout. - les. 00-10-03 Raymond Monnin B Update drawing to current requirements. Editorial changes throughout. - gap 08-05-28 Robert M. Heber REV SHET REV SHET REV STATUS REV
2、B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Thomas M. Hess DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Thomas M. Hess COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY M
3、onica L. Poelking MICROCIRCUIT, DIGITAL, BIPOLAR, TTL, DUAL 2-LINE TO 4-LINE AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 95-01-31 DECODERS/DEMULTIPLEXERS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-95582 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E050-
4、08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two
5、product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance
6、 (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 95582 01 Q E X Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2)Deviceclass designatorCaseoutline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.
7、2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator.
8、A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54155 Dual 2-line to 4-line decoders/demultiplexers 1.2.3 Device class designator. The device class designator is a single letter i
9、dentifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-
10、PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual in line package F GDFP-F16 or CDFP3-F16 16 flat package 1.2.5 Lead finish. The lead finish is as speci
11、fied in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
12、 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range -0.5 V dc minimum to +7.0 V dc maximum Input voltage . 5.5 V dc Storage temperature . -65C to +150C Maximum power dissipation (PD) 193 mW 2/ Lead temperature (soldering, 10 seconds) . +300C Thermal
13、resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V Maximum low level input voltage (VIL) . 0.8 V dc 2/ High level ou
14、tput current (IOH) . -0.8 mA Low level output current (IOL) 16 mA Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent s
15、pecified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Sta
16、ndard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mi
17、l/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in t
18、his document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Maxim
19、um power dissipation is defined as VCCx ICC, and must withstand the added PDdue to short circuit test, e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS,
20、 OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan
21、. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physic
22、al dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal conn
23、ections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless
24、 otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specif
25、ied in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitat
26、ions, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38
27、535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device clas
28、ses Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source
29、 of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for devic
30、e class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to t
31、his drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device cl
32、ass M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class
33、 M devices covered by this drawing shall be in microcircuit group number 001 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHI
34、O 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA+125C Group A subgroups Limits Unit unless otherwise specified Min Max High level output voltage VOHVCC= 4.5 V, VINL= 0 V, VIH= 2.0 V, VINH= 4.5 V, IOH= -0.8 mA
35、1, 2, 3 2.4 V Low level output voltage VOLVCC= 4.5 V, VIH= 2.0 V, VIL= 0.8 V, IOL= 16 mA 1, 2, 3 0.4 V Input clamp voltage VIKVCC= 4.5 V, IIN= -8 mA 1, 2, 3 -1.5 V High level input current IIH1 VCC= 5.5 V, VIN= 5.5 V 1, 2, 3 1mA Low level input current IIL VCC= 5.5 V, VIN= 0.4 V 1, 2, 3 -1.6mA High
36、level input current IIH2 VCC= 5.5 V, VIN= 2.4 V 1, 2, 3 40A Short circuit input current IOSVCC= 5.5 V 1/ 1, 2, 3 -20 -55 mA High level supply current ICCVCC= 5.5 V 2/ 1, 2, 3 35 mA Functional test VCC= 4.5 V, 5.5 V See 4.4.1b 7, 8 tPLH 9 20 Propagation delay time, A, B, 2 C , 1 G or 2 G , to Y (two
37、levels of logic) tPHL VCC= 5.0 V, RL= 400 , CL= 15 pF 9 27 ns tPLH 9 32 Propagation delay time, A or B to Y (three levels of logic) tPHL 9 32 ns tPLH 9 24 Propagation delay time, 1C to Y (three levels of logic) tPHL 9 30 ns 1/ Not more than 1 output should be shorted at a time. 2/ ICCis measured wit
38、h outputs open, A, B, and 1C inputs at 4.5 V, and 2 C , 1 G and 2 G inputs grounded. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEV
39、EL B SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines E and F Terminal number Terminal symbol 1 1C 2 1 G 3 B 4 1Y3 5 1Y2 61Y17 1Y0 8 GND 9 2Y0 10 2Y1 11 2Y2 12 2Y3 13 A 14 2 G 15 2 C 16 VCCFIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted
40、without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Inputs Outputs Inputs Outputs Select SelectB A Strobe 1 G Data 1C 1Y0 1Y1 1Y2 1Y3 B A Strobe 2 G Data 2 C 2Y0 2Y1 2Y2 2
41、Y3 X X H X H H H H X X H X H H H H L L L H L H H H L L L L L H H H L H L H H L H H L H L L H L H H H L L H H H L H H L L L H H L H H H L H H H H L H H L L H H H L X X X L H H H H X X X H H H H H 3-line to 8-line decoder or 1-line to 8-line demultiplexer Inputs Outputs Select 1/ (0) (1) (2) (3) (4) (
42、5) (6) (7) C B A Strobe OR Data G 2/ 2Y0 2Y1 2Y2 2Y3 1Y0 1Y1 1Y2 1Y3 X X X H H H H H H H H H L L L L L H H H H H H H L L H L H L H H H H H H L H L L H H L H H H H H L H H L H H H L H H H H H L L L H H H H L H H H H L H L H H H H H L H H H H L L H H H H H H L H H H H L H H H H H H H L Notes: 1/ C = i
43、nputs 1C and 2 C connected together. 2/ G = inputs 1 G and 2 G connected together. H = high level, L = low level, X = irrelevant FIGURE 2. Truth tables. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95582 D
44、EFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. FIGURE 4. Test circuit and switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAW
45、ING SIZE A 5962-95582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the de
46、vice manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, s
47、creening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conform
48、ance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A or B. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA= +125C, minimum. b. Interim and final electrical test parame
