1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add maximum junction temperature limit as specified in 1.3. - ro 02-03-27 R. MONNIN REV SHET REV SHET REV STATUS REV A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY DAN WONNELL DEFENSE SUPPLY CENTER COLUMBUS STANDARD
2、 MICROCIRCUIT DRAWING CHECKED BY SANDRA ROONEY COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, DUAL DPST ANALOG SWITCH, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DAT
3、E 96-07-09 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-96788 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E256-02 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S
4、TANDARD MICROCIRCUIT DRAWING SIZE A 5962-96788 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space appli
5、cation (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 -
6、96788 01 Q E X Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2) Device class designator Caseoutline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA
7、levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circui
8、t function as follows: Device type Generic number Circuit function 01 DG384AA Dual DPST analog switch 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certifi
9、cation to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter D
10、escriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted
11、without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96788 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ V+ to V- . 44 V dc GND to V- . 25 V dc Digital inputs to V- 2/ . -2 V to (V+ + 2 V) or
12、 30 mA, whichever occurs first VS, VDto V- 2/ . -2 V to (V+ + 2 V) or 30 mA, whichever occurs first Current continuous (any terminal) 30 mA Current (S or D) pulsed 1 ms 10% duty 100 mA Storage temperature range -65C to +150C Power dissipation (PD) . 825 mW 3/ Junction temperature (TJ) . +175C Therma
13、l resistance, junction-to-case (JC) See MIL-STD-1835 1.4 Recommended operating conditions. V+ . +15 V dc V- -15 V dc Operating ambient temperature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and hand
14、books form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPAR
15、TMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List
16、of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Stresse
17、s above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Signals on SX, DXor Inx exceeding V+ or V- will be clamped by internal diodes. Limit forward diode current to maximum current rati
18、ngs. 3/ Device mounted with all leads soldered or welded to PC board. Derating above +75C at 11 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96788 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-
19、5000 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
20、specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the
21、QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design,
22、 construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal conn
23、ections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post irradiation parame
24、ter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The p
25、art shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the
26、device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification
27、mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38
28、535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compli
29、ance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7
30、 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device c
31、lass M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retai
32、n the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircui
33、t group number 82 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96788 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97
34、 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C V+ = +15 V, V- = -15 V Group A subgroups Device type Limits Unit GND = 0 V unless otherwise specified Min Max Drain-source ON resistance RDS(ON)IS= 10 mA, VD= + 10 V, 1,3 01 50.0 VIN= 4 V 2 75.0 Source OFF leakage
35、 current IS(OFF)VD= 14 V, VS= + 14 V, 1 01 -1.0 1.0 nA VIN= 0.8 V 2 -100 100 Drain OFF leakage current ID(OFF)VD= 14 V, VS= + 14 V, 1 01 -1.0 1.0 nA VIN= 0.8 V 2 -100 100 Channel ON leakage current ID(ON)+ VS= VD= 14 V, 1 01 -1.0 1.0 nA IS(ON)VIN= 4 V 2 -100 100 VS= VD= -14 V, 1 -2.0 2.0 VIN= 4 V 2
36、-200 200 Input current with VINlow IILVINunder test = 0 V, all other = 5 V 1,2,3 01 -1.0 1.0 A Input current with VINhigh IIHVINunder test = 5 V 1,2,3 01 -1.0 1.0 A VINunder test = 15 V -1.0 1.0 Turn-ON time tON9 01 300 ns Turn-OFF time tOFF01 250 ns Positive supply current I+ VIN= 0.8 V, both input
37、s 1,3 01 10.0 A 2 100 VIN= 4.0 V, one input 3 1.0 mA 1,2 0.5 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96788 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 6 DSCC FORM 2
38、234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TA +125C V+ = +15 V, V- = -15 V Group A subgroups Device type Limits Unit GND = 0 V unless otherwise specified Min Max Negative supply current I- VIN= 0.8 V, both inputs 1,3 01 -10.0 A 2 -100 VIN= 4.0 V
39、, one input 1,3 -10.0 2 -100 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan
40、shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all
41、 devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, m
42、ethod 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and
43、 power dissipation, as applicable, in accordance with the intent specified in test method 1015. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from
44、IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96788 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outline E Terminal number Terminal symbol 1 D12 NC 3 D34 S35 S46 D47 NC 8 D29 S210 IN211 V+ 12 NC 13 GND 14 V- 15 IN116
45、S1NC = No connection FIGURE 1. Terminal connections. LOGIC SWITCH 0 OFF 1 ON Logic “0” 0.8 V Logic “1” 4.0 V FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96788 DEFENSE SUPPLY CENTER
46、COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. Test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Subgroups (in accordance with MIL-PRF-38535, table III) Device class M Device class Q Device cl
47、ass V Interim electrical parameters (see 4.2) 1 1 1 Final electrical parameters (see 4.2) 1,2,3,9 1/ 1,2,3,9 1/ 1,2,3,9 1/ Group A test requirements (see 4.4) 1,2,3,9 1,2,3,9 1,2,3,9 Group C end-point electrical parameters (see 4.4) 1 1 1 Group D end-point electrical parameters (see 4.4) 1 1 1 Group
48、 E end-point electrical parameters (see 4.4) - - - 1/ PDA applies to subgroup 1. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturers QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturers Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The
