1、 EIA/ECA STANDARD SURFACE MOUNT ALUMINUM ELECTROLYTIC CHIP CAPACITOR WITH POLYMER CATHODE (QUALIFICATION SPECIFICATION) EIA/ECA-955 OCTOBER 2007 ELECTRONIC COMPONENTS, ASSEMBLIES & MATERIALS ASSOCIATION THE ELECTRONIC COMPONENTS SECTOR OF THE ELECTRONIC INDUSTRIES ALLIANCE NOTICE EIA Engineering Sta
2、ndards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for
3、his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of EIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their volun
4、tary use by those other than EIA members, whether the standard is to be used either domestically or internationally. Standards and Publications are adopted by EIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, EIA does not assume any liability to a
5、ny patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This EIA Standard is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid com
6、parison between the EIA Standard and the IEC document can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practic
7、es and to determine the applicability of regulatory limitations before its use. Published by ELECTRONIC INDUSTRIES ALLIANCE 2007 Technology Strategy & Standards Department 2500 Wilson Boulevard Arlington, VA 22201 PRICE: Please refer to the current Catalog of EIA Electronic Industries Alliance Stand
8、ards and Engineering Publications or call Global Engineering Documents, USA and Canada (1-800-854-7179) International (303-397-7956) All rights reserved Printed in U.S.A. PLEASE ! DONT VIOLATE THE LAW! This document is copyrighted by the EIA and may not be reproduced without permission. Organization
9、s may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact: Global Engineering Documents 15 Inverness Way East Englewood, CO 80112-5704 or call USA and Canada (1-800-854-7179), International (303-397-7956) Foreword This specifi
10、cation was prepared by the P-2.4 Subcommittee on Aluminum Electrolytic Capacitors of the Electronic Industries Alliances sector Electronic Components, Assemblies, Equipment & Supplies Association (EIA/ECA). - iv - CONTENTS Paragraph PageForewordii Clause 1.0 Scope 1 1.1 Description .1 1.2 Preconditi
11、oning 1 1.3 Referenced Document 1 2.0 Objective .1 2.1 Generic Data .,1 2.1.1 Qualification families .2 2.1.2 Manufacturing site2 2.2 Test Samples.2 2.2.1 Lot Requirements2 2.3 Definition of Electrical test failure after stressing2 2.4 Criteria for passing qualification2 3.0 Qualification and Re-qua
12、lification2 3.1 Qualification of a new device 2 3.2 Changes requiring re-qualification 2 3.3 Criteria for passing re-qualification .2 4.0 Qualification Tests3 4.1 General Tests3 4.2 Electrical Characteristics3 4.3 Visual and Mechanical Examination3 4.4 Standard Life Test.4 4.5 High Temperature Life
13、Test4 4.6 Load Humidity Test4 4.7 Storage Life Test.5 4.8 Thermal Shock5 4.9 Solderability6 4.10 Surge Voltage Test6 4.11 Frequency Response Curves.6 4.12 Mechanical Shock and Vibration Test7 4.13 Terminal Strength.7 4.14 Flammability.7 5.0 Data Reporting Requirements.8 - v - 1.0 Scope 1.1 Descripti
14、on This document details the qualification requirements for surface mount aluminum chip capacitors with polymer cathode. The qualification program is defined in Table 1. Specification sheets can be added, as required, to define specific products or to cover unique/specific requirements. This documen
15、t does not relieve the supplier of their responsibility to their own companys internal qualification program. 1.2 Preconditioning This process is intended to simulate exposure to the moisture, thermal and cleaning environments of the assembly process before qualification testing. The component assem
16、bly process simulation requirements for different types of processes are described in IPC-9504. It is required that a flux with a pH of less than 2 be used for this preconditioning requirement. 1.3 Referenced Documents The current revision of the referenced documents will be in effect at the date of
17、 agreement to the qualification plan. Subsequent qualification plans will automatically use the latest revisions of these referenced documents. MIL-STD-202 Test Methods for Electronic and Electrical Component Parts UL-94 Tests for Flammability of Plastic Materials ANSI/J-STD-002 Solderability EIA/IS
18、-757 Visual and Mechanical Inspection for Molded SMT Solid Tantalum Capacitors IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components 2.0 Objective The objective of this qualification document is to ensure that components meet a minimum quality and/or reliability level. 2.1 Generic
19、 data Qualification shall be based on specific requirements associated with each characteristic of the device and manufacturing process. These requirements, listed in Table 1, are the same for both new processes and re-qualification associated with a process change. For each stress test, two or more
20、 qualification families can be combined if reasoning for this is technically sound, supported by data and periodically reviewed for soundness of original assumptions. With proper attention to these qualification guidelines, greater information applicable to other devices in the family can be accumul
21、ated and used to demonstrate their reliability so that qualification testing on new devices entering a family can be minimized. For example, this can be achieved through extensive qualification and monitoring of the most complex device in the reliability family and applied to less complex devices th
22、at subsequently joins this family. Sources of generic data shall come from supplier certified test labs, and include internal suppliers qualification, user specific qualifications and suppliers in process monitors, as long as the test conditions and endpoint test temperatures address the worst case
23、temperature extremes and other conditions defined in this document. - 1 - 2.1.1 Qualification families (A family is defined as a case size, voltage rating) In order to qualify as a family, the qualification must represent the same manufacturing process, materials and formulation. The supplier will p
24、rovide a complete description of each process and material of significance. Samples should represent 3 different manufacturing lots separated by at least one week. The highest CV product of each family size shall be tested. There must be valid and obvious links between the data and the subject of qu
25、alification. 2.1.2 Manufacturing site (fabrication and assembly) Each manufacturing site and line is to be considered independently for site qualification, meaning that the site is proven to be capable (resource and equipment) of running particular processes. A site cannot be qualified based on the
26、results from a different location. Qualification families do not apply across manufacturing sites. 2.2 Test Samples 2.2.1 Lot Requirements Test samples shall consist of representative devices from the qualification family. Multiple lot samples are specified in Table 1, and test samples are preferred
27、 from the same values from 3 non-consecutive lots, with each assembly lot composed of a different date code and separated by, at least, one week. 2.2.2 Production Requirements All qualification test samples shall be processed, tested, screened, and inspected on the same production site and with the
28、same production process as capacitors manufactured for production. 2.3 Definition of electrical test failure after stressing Electrical test failures are defined as those devices not meeting the individual device requirements called out in clause 4 of this document. 2.4 Criteria for passing qualific
29、ation Passing all appropriate qualification tests in this document qualifies the component. 3.0 Qualification and Re-qualification 3.1 Qualification of a new device The stress test requirements and corresponding test conditions for the qualification of a new device are listed in Table 1. For each qu
30、alification, the supplier must present data for all of these tests, either specific to the device to be qualified or acceptable reliability family data. 3.2 Changes requiring re-qualification Changes to a commodity, or the processes used in its fabrication, will require re-testing as agreed upon bet
31、ween the supplier and the user. The supplier and the user should agree upon the appropriate test plan prior to starting the re-qualification. - 2 - 3.3 Criteria for passing re-qualification Passing all appropriate re-qualificaton tests specified in this document, which are agreed to both user and su
32、pplier qualifies the change per this document. All re-qualification failures should be analyzed for the root cause, and provide demonstration of corrective and preventative measures. 4.0 Qualification Tests 4.1 General Tests Individual samples per test required in Table 1 are selected from one manuf
33、acturing lot. A minimum of 3 manufacturing lots separated by, at least, one week of date code shall be selected per case size and voltage rating. All parameters shall be measured at the conditions, test frequency, voltage, etcas defined in standards or this specification. Table 1 - Capacitor Qualifi
34、cation Test Plan and Sampling Plan Test Method Test Description Total Sample Size Defects Allowed 4.2 Electrical Characteristics 360* 0 4.3 Visual and Mechanical 5 0 4.4 Standard Life: Rated Voltage, Temp=85C, 1000hrs 40* 04.5 High Temp Life: 2/3Rated Voltage, at Rated Temp, 1000hrs 20* 0 4.6 Load H
35、umidity: 85C/85%RH, Rated Voltage, 1000hrs 40* 0 4.7 Storage Life: 0V, Rated Temp, 1000hrs 40* 0 4.8 Thermal Shock 40* 0 4.9 Solderability 20 04.1 Surge Voltage 20 0 4.11 Frequency Response 5 04.12 Vibration & Shock 10* 0 4.13 Terminal Strength 5* 04.14 Flammability 5* 0 * Indicates maintenance data
36、 requirement * Minimum of 3 lots total *Use Time Zero Electrical Test Data for this requirement 4.2 Electrical Characteristics The required samples of Table 1 shall be measured initially before subsequent testing. When required, capacitance, dissipation factor (DF), direct leakage current (DCL) and
37、equilaivent series resistance (ESR) etc shall be measured at the conditions (test frequency, voltage, etc) specified. All measurements shall meet the requirements defined in the detail specifications. The sample size specified in Table 1 will be used for subsequent testing, and all initial measureme
38、nts must meet specification requirements. - 3 - 4.3 Visual and Mechanical Examination Capacitors shall be examined to verify that visual and mechanical dimensions and criteria meet the requirements defined in the Visual and Mechanical Inspection for Molded SMT Solid Tantalum Capacitors. This specifi
39、cation is used since these parts are similar molded design. 4.4 Standard Life Test Capacitors shall be tested at the following conditions: A. Preconditioning is required. B. Rated Voltage for 1000 hours. C. Test temperature shall be maximum rated temperature. D. Measurements shall be taken at 0, 0 (
40、post preconditioning), 168hrs, 500hrs, 1000hrs. E. Requirements at intermediate and post-test readouts are: Electrical Properties Post Test Limits Capacitance 10% Dissipation Factor (DF%) Initial Limit DC Leakage (DCL) Initial Limit Equilavent Series Resistance(ESR) 1.5X Initial Limit 4.5 High Tempe
41、rature Life Test Capacitors shall be tested at the following conditions: A. Preconditioning is required. B. 2/3 Rated Voltage for 1000 hours. C. Test temperature shall be 125C D. Measurements shall be taken at 0, 0 (post preconditioning), 168hrs, 500hrs, 1000hrs. E. Requirements at intermediate and
42、post test readouts are: lectrical Properties Post Test Limits Capacitance 10% Dissipation Factor (DF%) Initial Limit DC Leakage (DCL) Initial Limit Equilavent Series Resistance(ESR) 1.5X Initial Limit - 4 - 4.6 Load Humidity Test Capacitors shall be tested as follows: A. Preconditioning is required.
43、 B. Rated Voltage for 1000 hours. C. Test temperature shall be 85C. D. Relative Humidity shall be 85 to 95%. E. Measurements shall be taken at 0, 0 (post preconditioning), 168hrs, 500hrs, 1000hrs. F. Requirements at intermediate and post test readouts are: Electrical Properties Post Test Limits Capa
44、citance +30%, -10% Dissipation Factor (DF%) 2X Initial Limit DC Leakage (DCL) 5X Initial Limit Equilavent Series Resistance(ESR) 2X Initial Limit 4.7 Storage Life Test Capacitors shall be tested at the following conditions: A. Preconditioning is required. B. No Voltage or unpowered for 1000 hours. C
45、. Test temperature shall be maximum rated temperature. D. Measurements shall be taken at 0, 0 (post preconditioning), 500hrs, 1000hrs. E. Requirements at intermediate and post test readouts are: Electrical Properties Post Test Limits Capacitance 10% Dissipation Factor (DF%) Initial Limit DC Leakage
46、(DCL) Initial Limit Equivalent Series Resistance(ESR) 1.5X Initial Limit 4.8 Thermal Shock Capacitors shall be tested per MIL-STD-202, Method 107, where applicable except: A. Preconditioning is required. B. Measurements shall be taken at 0, 250 cycles, 500 cycles (air to air) - 5 - C. Subject units
47、to 500 cycles in the following sequence: Step Temperature (C) Time in minutes 1. Start -55 2 2. Hold -55 2 305 3. Transfer 5 max 4. Hold +125 2 305 5. Transfer 5 max If Liquid to Liquid is used, use similar Table above except transfer time to be 10 seconds max with holds times at 30 minutes minimum. D. Requirements at intermediate and post test readouts are: Electrical Properties Post Test Limits Capacitance 10% Dissipation Factor (DF%) Init
