1、BRITISH STANDARD BS EN 62025-2:2005 High frequency inductive components Non-electrical characteristics and measuring methods Part 2: Test methods for non-electrical characteristics The European Standard EN 62025-2:2005 has the status of a British Standard ICS 29.100.10 BS EN 62025-2:2005 This Britis
2、h Standard was published under the authority of the Standards Policy and Strategy Committee on 5 April 2005 BSI 5 April 2005 ISBN 0 580 45700 1 National foreword This British Standard is the official English language version of EN 62025-2:2005. It is identical with IEC 62025-2:2005. The UK participa
3、tion in its preparation was entrusted to Technical Committee EPL/51, Transformers, inductors, magnetic components and ferrite materials, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British St
4、andards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. T
5、his publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible in
6、ternational/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the E
7、N title page, pages 2 to 25 and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date CommentsEUROPEAN STANDARD EN 62025-2 NORME EUROPENNE EUROPISCHE NORM February 2005 CENELEC European Committ
8、ee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2005 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC me
9、mbers. Ref. No. EN 62025-2:2005 E ICS 29.100.10 English version High frequency inductive components Non-electrical characteristics and measuring methods Part 2: Test methods for non-electrical characteristics (IEC 62025-2:2005) Composants inductifs haute frquence - Caractristiques non lectriques et
10、mthodes de mesure Partie 2: Mthodes dssai pour caractristiques non lectriques (CEI 62025-2:2005) Induktive Hochfrequenzbauelemente - Nichtelektrische Eigenschaften und Messmethoden Teil 2: Messverfahren fr nichtelektrische Eigenschaften (IEC 62025-2:2005) This European Standard was approved by CENEL
11、EC on 2005-02-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standard
12、s may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notifie
13、d to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Ma
14、lta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, Switzerland and United Kingdom. EN 62025-2:2005 - 2 - Foreword The text of document 51/797/FDIS, future edition 1 of IEC 62025-2, prepared by IEC TC 51, Magnetic components and ferrite materials, was submitted to the IEC-
15、CENELEC parallel vote and was approved by CENELEC as EN 62025-2 on 2005-02-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2005-11-01 latest date by which the national sta
16、ndards conflicting with the EN have to be withdrawn (dow) 2008-02-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 62025-2:2005 was approved by CENELEC as a European Standard without any modification. _ Page2 EN620252:200562022-5 CEI:2500 3 CONTE
17、NTS EROF.DROW5 1 Scope 4 2 Normative references .4 3 Terms and definitions .5 4 Test conditions.5 4.1 Standard atmospheric conditions for test5 4.2 Referee conditions.5 5 Mechanical characteristics test .6 5.1 Body strength test .6 5.2 Robustness of termination (electrode)7 5.3 Solderability 13 5.4
18、Resistance to soldering heat16 5.5 Resistance to dissolution of metallization .18 5.6 Vibration19 5.7 Resistance to shock.20 Annex A (normative) Mounting of surface mounting inductor to test printed-circuit board 22 Figure 1 Method for pressurizing body6 2 erugiF Prgij gnizirusse 7 3 erugiF Exfo elp
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20、 edoc ez rotcudnis9 elbaT idnoC 3tsnoi fo remmisredlos otni noi .41 elbaT wolfeR 4 erutarepmet .41 5 elbaT Setirevy.61 elbaT wolfeR 6 erutarepmet .71 elbaT idnoC 7tsnoi arbiv fotoin.02 Page3 EN620252:2005 62025-2 IEC:2005 3 STNETNOC FOREWORD.5 1 epocS 4 2 itamroNvsecnerefer e .4 3 smreT snoitinifed
21、dna .5 4 eTsnoitidnoc ts.5 1.4 adnatSrehpsomta drci snoitidnoc rof etst5 2.4 noitidnoc eerefeRs.5 5 arahc lacinahceMciretsscit test .6 1.5 ydoB sgnertth etst .6 2.5 uboRstnsse fo animrettele( noictedor)7 ytilibaredloS 3.5 31 4.5 eRsistecna to soaeh gniredlt61 5.5 eRsistecna to sidsulotem fo noitanoi
22、tazill .81 6.5 .noitarbiV.91 7.5 eRsistecna to scohk.02 A xennA on(ritamve) gnitnuoM fo suafrcudni gnitnuom ecrot ot etst prric-detnicaob tiurd 22 Figure 1 Method for pressurizing body6 Figure 2 Pressurizing jig 7 Figure 3 Example of printed-circuit board .8 Figure 4 Layout10 Figure 5 Pressurizing j
23、ig 10 Figure 6 Pressurizing.10 Figure 7 Pressurizing and shape of jig12 Figure 8 Reflow temperature profile15 Table 1 Size of soldering lands by the code of multi-layer chip inductors.8 Table 2 Thickness of solder paste by the size code of inductors9 Table 3 Conditions of immersion into solder .14 T
24、able 4 Reflow temperature .14 Table 5 Severity.16 Table 6 Reflow temperature .17 Table 7 Conditions of vibration.20 3egaP 5002:252026NE Annex ZA (normative) Normative references to international publications with their corresponding European publications . 2462022-5 CEI:2500 9 HIGH FREQUENCY INDUCTI
25、VE COMPONENTS NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS Part 2: Test methods for non-electrical characteristics 1 Scope This part of IEC 62025 specifies a test method for the non-electrical characteristics of the Surface Mounted Device (SMD) inductors to be used for electronic and telecom
26、munication equipment. The object of this part of IEC 62025 is to define methods for measuring mechanical performance only. As the reliability performances and specifications relative to non-electrical performances are defined in IEC 62211, detailed measuring methods for mechanical performance of rel
27、iability testing are defined in this part of IEC 62025. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (inclu
28、ding any amendments) applies. IEC 60068-1:1988, Environmental testing Part 1: General and guidance IEC 60068-2-6:1995, Environmental testing Part 2: Tests Test Fc : Vibration (sinusoidal) IEC 60068-2-20:1979, Environmental testing Part 2: Tests Test T: Soldering IEC 60068-2-21:1999, Environmental te
29、sting Part 2-21: Tests Test U: Robustness of terminations and integral mounting devices IEC 60068-2-27:1987, Environmental testing Part 2: Tests Test Ea and guidance: Shock IEC 60068-2-45:1980, Environmental testing Part 2: Tests Test XA and guidance: Immersion in cleaning solvents IEC 60068-2-58:20
30、04, Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) IEC 60068-2-69, Environmental testing Part 2: Tests Test Te: Solderability testing of electronic components for surfa
31、ce mount technology by the wetting balance method IEC 60068-2-77:1999, Environmental testing Part 2-77: Tests Test 77: Body strength and impact shock Page4 EN620252:200562022-5 CEI:2500 11 IEC 61188-5-2:2003, Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint
32、) considerations Discrete components IEC 61190-1-2:2002, Attachment materials for electronic assembly Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly IEC 61190-1-3:2002, Attachment materials for electronic assembly Part 1-3: Requirements for electro
33、nic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications IEC 62211:2003, Inductive components Reliability management 3 Terms and definitions For the purpose of this part of IEC 62025, the terms and definitions given in the normative references apply. 4 Te
34、st conditions 4.1 Standard atmospheric conditions for test Unless otherwise specified in the detail specification, the tests and measurements shall be carried out under standard atmospheric conditions for test as given in 5.3.1 of IEC 60068-1: temperature: 15 C to 35 C; relative humidity: 25 % to 75
35、 %; air pressure: 86 kPa to 106 kPa. In the event of dispute or where required, the measurements shall be repeated using the referee temperatures (as given in 4.2) and such other conditions as are prescribed in this standard. In addition, when it is difficult to make measurements in standard atmosph
36、eric conditions, unless a doubt arises about the validity of the result, the tests and measurements may be performed in non-standard atmospheric conditions. 4.2 Referee conditions For referee purposes, one of the standard atmospheric conditions for referee tests taken from 5.2 of IEC 60068-1, shall
37、be selected and shall be as follows: temperature: 20 C 2 C; relative humidity: 60 % to 70 %; air pressure: 86 kPa to 106 kPa. Page5 EN620252:200562022-5 CEI:2500 31 5 Mechanical characteristics test 5.1 Body strength test 5.1.1 Body strength test procedures The body strength test procedure, as refer
38、enced in IEC 60068-2-77, shall be as follows. a) Preconditioning If required, preconditioning shall be performed on the specimens in accordance with the detail specification. b) Initial measurement The appearance of the specimen shall be checked with a magnification of at least 10 under adequate lig
39、ht. If specified in the detail specification, the electrical performances shall be measured. c) Layout Unless otherwise specified in the detail specification, the specimen shall be placed on the supporting base, as shown in Figure 1, so that both ends of the specimen are symmetrically positioned on
40、the supporting base. The test table shall be placed on a plane, robust platform so that the test result shall not be affected when a force is applied. Magnification of part A Supporting base steel Pressurizing jig (see Figure 2) Force L A Specimen R0,1 to R0,2 R0,5 2 L IEC 073/05 NOTE The angle of t
41、he taper in part A shall be between 70 and 90. Figure 1 Method for pressurizing body d) Applied force The force shall be applied to the centre of the specimen by the pressurizing jig as shown in Figure 2, for a duration of (10 1) s. Unless otherwise specified in the detail specification, the force s
42、hall be selected from either (one of) 10 N, 20 N or 30 N. If specified in the detail specification, the electrical performances shall be measured during the application of the force. Dimensions in millimetres Page6 EN620252:200562022-5 CEI:2500 51 W R0,5 IEC 074/05 NOTE 1 Dimension W of the pressuri
43、zing jig is wider than the width of the specimen. NOTE 2 Hardness: HV 500 and more. NOTE 3 When the length of the specimen is 2 mm or less, the radius of the pressurizing jig should be 0,2 mm. Figure 2 Pressurizing jig e) Recovery If required, recovery conditioning shall be performed for the specime
44、ns in accordance with the detail specification. f) Final measurement After the test, the appearance of the specimen shall be checked with a magnification of at least 10 under adequate light. There shall be no signs of damage such as cracks or flaws. If specified in the detail specification, the elec
45、trical performances shall be measured. 5.1.2 Information to be given in the detail specification The following information shall be given in the detail specification. a) Preconditioning (if required) see 5.1.1.a); b) initial measurement items, final measurement items (if required) see 5.1.1.b) and f
46、); c) measurement during applied force (if required) see 5.1.1.d); d) recovery (if required) see 5.1.1.e). 5.2 Robustness of termination (electrode) 5.2.1 Resistance to bending of printed circuit board 5.2.1.1 General The test for resistance of terminations and electrodes mounted on a printed circui
47、t board shall be as follows. Dimensions in millimetres Page7 EN620252:200562022-5 CEI:2500 71 5.2.1.2 Specification of soldering lands The soldering lands shall be designed according to Table 1, as specified in 11.5 of IEC 61188-5-2. With regard to inductors, except for those specified in IEC 61188-
48、5-2, the size of the solder lands shall be specified in the detail specification. Table 1 Size of soldering lands by the code of multi-layer chip inductors Dimensions in millimetres Size code a b c 1005 0,65 0,55 0,50 1608 0,95 0,85 0,50 2012 1,45 1,10 0,50 3216 1,80 1,30 1,20 3225 2,70 1,05 1,80 4532 3,40 1,10 3,00 5650 5,30 1,30 3,70 NOTE Tolerance: 0,05 mm and see Figure 3. 5.2.1.3 Specification of printed circuit board The printed-circuit board shall be made of epoxide woven glass (FR4) as specified in IEC 60068-2-21, and, unless specified in the deta
