1、 ETSI TR 103 380 V1.0.0 (2015-11) Smart Cards; Technical Report to improve test equipment integrity; (Release Independent) TECHNICAL REPORT ETSI ETSI TR 103 380 V1.0.0 (2015-11) 2(Release Independent) Reference DTR/SCP-00103380 Keywords smart card, testing ETSI 650 Route des Lucioles F-06921 Sophia
2、Antipolis Cedex - FRANCE Tel.: +33 4 92 94 42 00 Fax: +33 4 93 65 47 16 Siret N 348 623 562 00017 - NAF 742 C Association but non lucratif enregistre la Sous-Prfecture de Grasse (06) N 7803/88 Important notice The present document can be downloaded from: http:/www.etsi.org/standards-search The prese
3、nt document may be made available in electronic versions and/or in print. The content of any electronic and/or print versions of the present document shall not be modified without the prior written authorization of ETSI. In case of any existing or perceived difference in contents between such versio
4、ns and/or in print, the only prevailing document is the print of the Portable Document Format (PDF) version kept on a specific network drive within ETSI Secretariat. Users of the present document should be aware that the document may be subject to revision or change of status. Information on the cur
5、rent status of this and other ETSI documents is available at http:/portal.etsi.org/tb/status/status.asp If you find errors in the present document, please send your comment to one of the following services: https:/portal.etsi.org/People/CommiteeSupportStaff.aspx Copyright Notification No part may be
6、 reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm except as authorized by written permission of ETSI. The content of the PDF version shall not be modified without the written authorization of ETSI. The copyright and the foregoing rest
7、riction extend to reproduction in all media. European Telecommunications Standards Institute 2015. All rights reserved. DECTTM, PLUGTESTSTM, UMTSTMand the ETSI logo are Trade Marks of ETSI registered for the benefit of its Members. 3GPPTM and LTE are Trade Marks of ETSI registered for the benefit of
8、 its Members and of the 3GPP Organizational Partners. GSM and the GSM logo are Trade Marks registered and owned by the GSM Association. ETSI ETSI TR 103 380 V1.0.0 (2015-11) 3(Release Independent) Contents Intellectual Property Rights 4g3Foreword . 4g3Modal verbs terminology 4g31 Scope 5g32 Referenc
9、es 5g32.1 Normative references . 5g32.2 Informative references 5g33 Definitions, symbols and abbreviations . 6g33.1 Definitions 6g33.2 Symbols 6g33.3 Abbreviations . 7g34 Optimization of the test environment for terminal testing using the Single Wire Protocol . 7g34.1 Noise issues when using the Sin
10、gle Wire Protocol 7g34.2 Limiting the noise impacts . 9g34.3 Derived guidelines to set up a test environment . 9g34.4 Checking the integrity of the test environment. 11g34.4.1 Objective . 11g34.4.2 Example of a Test Case for Integrity check: . 11g34.4.2.1 Test execution . 11g34.4.2.2 Initial conditi
11、ons . 11g34.4.2.3 Test procedure . 11g3Annex A: Change History . 12g3Annex B: Bibliography 13g3History 14g3ETSI ETSI TR 103 380 V1.0.0 (2015-11) 4(Release Independent) Intellectual Property Rights IPRs essential or potentially essential to the present document may have been declared to ETSI. The inf
12、ormation pertaining to these essential IPRs, if any, is publicly available for ETSI members and non-members, and can be found in ETSI SR 000 314: “Intellectual Property Rights (IPRs); Essential, or potentially Essential, IPRs notified to ETSI in respect of ETSI standards“, which is available from th
13、e ETSI Secretariat. Latest updates are available on the ETSI Web server (http:/ipr.etsi.org). Pursuant to the ETSI IPR Policy, no investigation, including IPR searches, has been carried out by ETSI. No guarantee can be given as to the existence of other IPRs not referenced in ETSI SR 000 314 (or the
14、 updates on the ETSI Web server) which are, or may be, or may become, essential to the present document. Foreword This Technical Report (TR) has been produced by ETSI Technical Committee Smart Card Platform (SCP). The contents of the present document are subject to continuing work within TC SCP and
15、may change following formal TC SCP approval. If TC SCP decides to modify the contents of the present document, it will be re-released by TC SCP with an identifying change of release date and an increase in version number as follows: Version x.y.z where: x: the first digit: 1 presented to TC SCP for
16、information; 2 presented to TC SCP for approval; 3 or greater indicates TC SCP approved document under change control. y: the second digit is incremented for all changes of substance, i.e. technical enhancements, corrections, updates, etc. z: the third digit is incremented when editorial only change
17、s have been incorporated in the document. The aim was to develop a technical report (TR) that defines how to optimally set up the test environment to execute test case implementations based on ETSI TC SCP test specifications. Modal verbs terminology In the present document “shall“, “shall not“, “sho
18、uld“, “should not“, “may“, “need not“, “will“, “will not“, “can“ and “cannot“ are to be interpreted as described in clause 3.2 of the ETSI Drafting Rules (Verbal forms for the expression of provisions). “must“ and “must not“ are NOT allowed in ETSI deliverables except when used in direct citation. E
19、TSI ETSI TR 103 380 V1.0.0 (2015-11) 5(Release Independent) 1 Scope The present document provides how to optimally set up the test environment to execute test case implementations based on ETSI TC SCP test specifications. This includes (but is not limited to): Derived guidelines to set up a test env
20、ironment; Test equipment behaviour in case of additional activity triggered by test sequences; Optimization of the test environment; - Noise issues when using the Single Wire Protocol; - Limiting the noise impacts; Checking the integrity of the test environment; Example of a Test Case for Integrity
21、check. The targeted audience for the present document is users of test case implementations based on ETSI TC SCP test specifications as well as test equipment manufacture. 2 References 2.1 Normative references References are either specific (identified by date of publication and/or edition number or
22、 version number) or non-specific. For specific references, only the cited version applies. For non-specific references, the latest version of the reference document (including any amendments) applies. Referenced documents which are not found to be publicly available in the expected location might be
23、 found at http:/docbox.etsi.org/Reference. In the case of a reference to a TC SCP document, a non-specific reference implicitly refers to the latest version of that document in the same Release as the present document. NOTE: While any hyperlinks included in this clause were valid at the time of publ
24、ication, ETSI cannot guarantee their long term validity. The following referenced documents are necessary for the application of the present document. Not applicable. 2.2 Informative references References are either specific (identified by date of publication and/or edition number or version number)
25、 or non-specific. For specific references, only the cited version applies. For non-specific references, the latest version of the reference document (including any amendments) applies. NOTE: While any hyperlinks included in this clause were valid at the time of publication, ETSI cannot guarantee the
26、ir long term validity. The following referenced documents are not necessary for the application of the present document but they assist the user with regard to a particular subject area. i.1 ETSI TS 102 613: “Smart Cards; UICC - Contactless Front-end (CLF) Interface; Part 1: Physical and data link l
27、ayer characteristics“. i.2 ETSI TS 102 694-1: “Smart Cards; Test specification for the Single Wire Protocol (SWP) interface; Part 1: Terminal features“. ETSI ETSI TR 103 380 V1.0.0 (2015-11) 6(Release Independent) i.3 ETSI TS 102 221: “Smart Cards; UICC-Terminal interface; Physical and logical chara
28、cteristics“. i.4 ISO/IEC 14443-4: “Identification cards - Contactless integrated circuit(s) cards - Proximity cards - Part 4: Transmission protocol“. 3 Definitions, symbols and abbreviations 3.1 Definitions For the purposes of the present document, the following terms and definitions apply: card emu
29、lation mode: mode where the UICC emulates a contactless card through the CLF class A operating conditions: terminal or a smart card operating at 5 V 10 % class B operating conditions: terminal or a smart card operating at 3 V 10 % class C operating conditions: terminal or a smart card operating at 1
30、,8 V 10 % contactless frontend: circuitry in the terminal which: handles the analogue part of the contactless communication; handles communication protocol layers of the contactless transmission link; exchanges data with the UICC. full duplex: simultaneous bidirectional data flow half duplex: sequen
31、tial bidirectional data flow idle bit: bit with logical value 0 sent outside a frame master: entity which provides the S1 signal reader mode: mode where the UICC act as a contactless reader through the CLF state H: high electrical level of a signal (voltage or current) state L: low electrical level
32、of a signal (voltage or current) S1: signal from the master to a slave S2: signal from the slave to the master slave: entity which is connected to the master and provides the S2 signal transition sequence: signal sent by the master during RESUME, consisting of the falling edge, the state L period an
33、d the rising edge of an idle bit ETSI TS 102 221 i.3 interface: asynchronous serial UICC-Terminal interface defined in ETSI TS 102 221 i.3, using RST on contact C2, CLK on contact C3 and I/O on contact C7 UICC powering modes: full power mode: The UICC is powered according to ETSI TS 102 221 i.3 limi
34、tations in operating state. low power mode: The UICC is running in a reduced power mode as defined in the present specification. 3.2 Symbols For the purposes of the present document, the following symbols apply: Gnd Ground IHCurrent signalling state H of S2 ETSI ETSI TR 103 380 V1.0.0 (2015-11) 7(Re
35、lease Independent) ILCurrent signalling state L of S2 T Bit duration TH1Duration of the state H for coding a logical 1 of S1 TH0Duration of the state H for coding a logical 0 of S1 TCLFProcessing time of the CLF for a packet of data TRFnTransfer time of contactless command or response over the RF in
36、terface TSWPTransfer time a single SWP packet of date TUICCProcessing time of the UICC for a contactless command tFFall time tRRise timeVcc Supply Voltage VIHInput Voltage (high) VILInput Voltage (low) VOHOutput Voltage (high) VOLOutput Voltage (low) 3.3 Abbreviations For the purposes of the present
37、 document, the following abbreviations apply: ACT ACTivation protocol CLF ContactLess FrontendCLK CLocK DUT Device Under Test FSC Frame Size for proximity Card HDLC High level Data Link Control I/O Input/Output ISO International Organization for Standardization NFCIP-1 Near Field Communication - Int
38、erface and Protocol PCD Proximity Coupling Device RF Radio Frequency RST ReSeT SHDLC Simplified High Level Data Link Control SWIO Single Wire protocol Input/Output SWP Single Wire Protocol USB Universal Serial Bus 4 Optimization of the test environment for terminal testing using the Single Wire Prot
39、ocol 4.1 Noise issues when using the Single Wire Protocol As a reminder, here is the description of the principle of the Single Wire Protocol. ETSI ETSI TR 103 380 V1.0.0 (2015-11) 8(Release Independent) Figure 4.1: SWP data transmission The principle of the Single Wire Protocol is based on the tran
40、smission of digital information in full duplex mode: The signal S1 is transmitted by a digital modulation (L or H) in the voltage domain. The signal S2 is transmitted by a digital modulation (L or H) in the current domain. Since S2 is in the current domain, the immunity to noise is unfortunately qui
41、te low. There are indeed several contributors to the current carried over SWIO (called ITOT): 1) Obviously S2 signal, intentionally generated by the UICC; 2) ICAP-GND, which is the current necessary to charge (discharge) the SWIO line parasitic capacitance to ground (CPAR_GNDas drawn on figure 4.1):
42、 indeed, CPAR-GNDhas to be charged (discharged) each time S1 presents a rising (falling) edge. This noise is therefore synchronous with S1 and can then be removed from ITOTby the CLF which knows when these edges take place; 3) ICAP-ADJ, which is the current necessary to charge (discharge) the SWIO l
43、ine parasitic capacitance to a signal adjacent to SWIO (CPAR_ADJas drawn on figure 4.1): unlike ICAP-GND, ICAP-ADJis only partially synchronous with S1 transitions: in addition to the current required to charge ICAP-ADJwhen there is an edge on S1, there are additional parasitic current pulses on ICA
44、P-ADJcreated by the transition which occur on the adjacent signal and which are very likely asynchronous with S1 transitions. These asynchronous pulses are more difficult to filter for the CLF; 4) IIND-COUPL, which can occur when there is an inductive coupling between the SWIO line and a magnetic fi
45、eld, such as the 13,56 MHz RF field used in contactless applications. Since SWP is always used in conjunction with a contactless interface, special attention has to be paid on this parasitic coupling; 5) IEMI, which represents any other current noise due to EMIs (Electro-Magnetic Interferences). So
46、the current seen by the CLF is the sum of all these currents: ITOT= S2 + ICAP-GND+ ICAP-ADJ+ IIND-COUPL+ IEMIThe 4 last contributors (ICAP-GND, ICAP-ADJ, IIND-COUPLUICC-Terminal interface; Characteristics of the USB interface“. ISO/IEC 18092: “Information technology - Telecommunications and information exchange between systems - Near Field Communication - Interface and Protocol (NFCIP-1)“. ETSI ETSI TR 103 380 V1.0.0 (2015-11) 14(Release Independent) History Document history V1.0.0 November 2015 Publication
