1、 ENGINEERING MATERIAL SPECIFICATIONMaterial Name Specification NumberDate Para No. Revisions1980 06 18 Revised, Retyped CF4K-RD576983-71978 10 31 Released (Was XF-M99GX27) F4H-70WP 3948-a Page 1 of 2ENCAPSULANT- SILICONE DIELECTRIC GEL ESF-M99G128-A1. SCOPEThe material defined by this specification
2、is a very soft, 2 part,silicone gel.2. APPLICATIONThis specification was released originally for a compound used in sealingand potting diodes in the alternator rectifier circuit.3. REQUIREMENTS3.1 To be run on each lot of material.3.1.1 Viscosity - Brookfield Viscometer, mm 2 /s(ASTM D 1084 Method “
3、B“, model LVT, 30 rpm, #3 spindle)3.1.1.1 Part A 200 - 7003.1.1.2 Part B 200 - 7003.1.1.3 Mixed 200 - 7003.1.2 Gel Time at 135 C 5 - 15 minutes(ASTM D 2471, mix components at R.T.)3.1.3 Hardness 3 - 8(FLTM BJ 23-3, cured 1 h at 150 C)3.2 To be run for Initial Approval and as required by quality cont
4、rol.Samples cured 1 h at 150 C.3.2.1 Dielectric Strength, min 375 vpm (15 kV/mm)(FLTM BJ 23-2, 0.060 in (1.5mm) thick)3.2.2 Specific Gravity 0.94 - 0.973.2.3 Volatility, loss, m x 3.0%(2 g for 2 h at 150 C)3.3 SUPPLIERS RESPONSIBILITYMaterial supplied to this specification must be equivalent to that
5、originally approved. Changes in formulation or processing shallnot be made without prior approval as described in SupplierProcedure I-A.ENGINEERING MATERIAL SPECIFICATION ESF-M99G128-AWP 3948-b Page 2 of 24. APPROVAL OF SUPPLIERSSuppliers to this specification must be approved by the affected productengineering office. Procedure for gaining approval of a specificmaterial to a new/existing ES-M specification is contained in SupplierProcedure I-A. Approved new suppliers will be added to the EngineeringMaterials Approved Source List.
