1、ENGINEERING MATERIAL SPECIFICATION Material Name Specification Number Date Action Revisions2003 01 08 Revised Para 3.0 inserted ; Para 3.1, 3.2, 3.3, 3.14, 3.15, 4 deleted 1994 01 31 NGA1E10370437001 Released R. Gordon Printed copies are uncontrolled Page 1 of 2 Copyright 2002, Ford Global Technolog
2、ies, Inc. ADHESIVE, HOT MELT, NON-CORROSIVE WSF-M2G375-A 1. SCOPEThe material defined by this specification is a thermoplastic resin based on polypropylene chemistrywhich is non-corrosive to copper.2. APPLICATIONThis specification was originally released as an adhesive strapping material to adhere a
3、nd rigidizecomponents to an audio circuit board.3. REQUIREMENTS3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.4 COLOR Of white 3.5 DENSITY, range 0.90 - 0.95 (ISO
4、 1183, Method A/ASTM D 792, Method A) 3.6 VISCOSITY, range 4,250 6,100 mPa.s (ASTM D 1084, Method B, Model RVT, Spindle #27) 3.7 HEAT STABILITY at 177 C, max 8,000 mPa.s (ASTM D 1084, Method B, Model RVT, No skinning permitted Spindle #27) Place a 0.25 liter sample of the material in an open metal c
5、ontainer and place the container in a convection oven for 150 hours at 177 +/- 3 C. After the 150 hours of thermal exposure, examine the material for a skin or gel formation. Agitate the material at 177 C just prior to measuring the viscosity of the aged sample. 3.8 SOLIDS, min 98 %(ASTM D 2834, exc
6、ept heat 4 days at 177 C) 3.9 ASH, max 1 %by weight Place crucible containing the weighed sample in a cool muffle furnace. Heat crucible 1 hour at 760 +/- 30 C. NOT TO BE USED FOR NEW DESIGN2015 02 03 N Status No replacement named L. Sinclair, NAENGINEERING MATERIAL SPECIFICATION WSF-M2G375-A Page 2
7、 of 2 Copyright 2002, Ford Global Technologies, Inc. 3.10 SOFTENING POINT, Ring and Ball, range 138 - 150 C (ASTM E 28) 3.11 ADHESION, SHEAR, min (ASTM D 1002, jaw speed 50 mm/min, length of overlap 25.4 mm, substrates Douglas fir - 25.4 x 101.6 mm - cut with the grain and finish side free of dust,
8、adhesive thickness 0.30 mm using wire spacers) 3.11.1 At 27 C 1550 kPa 3.11.2 At 70 C 100 kPa Test Procedure: Apply sufficient adhesive heated at 196 C on one substrate to provide a complete bond. With hand pressure, apply the mating substrate and allow to cool to 23 +/- 2 C. Condition for 12 h at 23 +/- 2 C. 3.12 ODOR Meets requirement The adhesive shall be free from objectionable or irritating odors, both as received and at application temperatures. 3.13 SHELF LIFE, min 2 years Store at between 0 - 45 C in original container. Must meet all specification requirements.
