GOST 17594-1981 Dry bay-leaves Specifications《干月桂树叶 规范》.pdf

相关资源

GSFC-STD-7000 REV A-2013 GENERAL ENVIRONMENTAL VERIFICATION STANDARD (GEVS).pdf

GSFC-S-311-P-822 REV A-2008 Connectors PWB 2 mm cPCI Style High Reliability.pdf

GSFC-S-311-M-70 REV B-2009 SPECIFICATION FOR DESTRUCTIVE PHYSICAL ANALYSIS (DPA)《物理破坏性分析(DPA)规范》.pdf

GSFC NASA GPR 8830 1-2008 Facility Operations Managers [Cancelled GSFC NASA GMI 7234 2]《设备操作管理员[GSFC NASA GMI 7234 2作废]》.pdf

GSFC NASA GPR 7123 1-2008 Systems Engineering [Cancelled GSFC NASA GPR 7120 5 REV A GSFC NASA GPR 7120 5]《系统工程[GSFC NASA GPR 7120 5修订本A和GSFC NASA GPR 7120 5作废]》.pdf

GSFC NASA GPR 1860 1 REV B-2008 Ionizing Radiation Protection《电离性辐射保护》.pdf

GSFC NASA GPR 1800 1 REV B-2008 Goddard Space Flight Center (GSFC) Smoking Guidelines《戈达德宇航中心(GSFC)的吸烟指南》.pdf

GSA ZZ-I-550 F-1992 INNER TUBE PNEUMATIC TIRE《气轮胎内胎》.pdf

GSA W-C-1684-1977 CASSETTES MAGNETIC TAPE AUDIO RECORDING (TWIN-HUB COPLANAR)《音频记录盒式磁带(同面双中枢)》.pdf

GSA TT-W-572 B-1969 WOOD PRESERVATIVE WATER-REPELLENT《木料防腐剂 憎水剂》.pdf

猜你喜欢

EN 60749-14-2003 en Semiconductor devices - Mechanical and climatic test methods Part 14 Robustness of terminations (lead integrity)《半导体器件 机械和气候试验方法 第14部分 终端装置的坚固性(引线牢固性)IEC 60749-.pdf

EN 60749-15-2010 en Semiconductor devices - Mechanical and climatic test methods - Part 15 Resistance to soldering temperature for through-hole mounted devices (Incorporating corri.pdf

EN 60749-16-2003 en Semiconductor devices Mechanical and climatic test methods Part 16 Particle impact noise detection (PIND)《半导体器件 机械和气候试验方法 第16部分 粒子碰撞噪声探测(PIND)IEC 60749-16-2003》.pdf

EN 60749-17-2003 en Semiconductor devices Mechanical and climatic test methods Part 17 Neutron irradiation《半导体器件 机械和气候试验方法 第17部分 中子辐照 IEC 60749-17-2003》.pdf

EN 60749-18-2003 en Semiconductor devices - Mechanical and climatic test methods Part 18 Ionizing radiation (total dose)《半导体器件 机械和气候试验方法 第18部分 电离辐射(总剂量) IEC 60749-18-2002》.pdf

EN 60749-19-2003 en Semiconductor devices C Mechanical and climatic test methods Part 19 Die shear strength (Incorporating Corrigendum June 2003 Incorporates Amendment A1 2010)《半导体.pdf

EN 60749-2-2002 en Semiconductor Devices Mechanical and Climatic Test Methods Part 2 Low Air Pressure《半导体器件 机械和气候试验方法 第2部分 低气压 IEC 60749-2-2002 部分替代 EN 60749 1999+A1-2000+A2-2001》.pdf

EN 60749-20-1-2009 en Semiconductor devices - Mechanical and climatic test methods - Part 20-1 Handling packing labelling and shipping of surface-mount devices sensitive to the com.pdf

EN 60749-20-2009 en Semiconductor devices - Mechanical and climatic test methods - Part 20 Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering .pdf