1、 , () INTERSTATE COUNCIL FOR STANDARDIZATION, METROLOGY AND CERTIFICATION (ISC) IEC61188-1-2 2013 1-2 (IEC 61188-1-2:1998, IDT) IEC 61188-1-22013 II , 1.092 . 1.22009 . , . , , , 1 ( ) , 5 , / 91 2 420 , , 3 , ( 14 2013 . 44) : ( 3166) 00497 ( 3166) 00497 BY KG RU 4 16 2014 1105- IEC 61188-1-22014 1
2、 2015 . 5 IEC 61188-1-2:1998 Printed boards and printed boards assemblies Design and use Part 1-2: Generic requirements Controlled impedance ( . . 1-2. . ) (en). IEC/ 91 (IEC). 1.5 ( 3.5). , , , , . . (IDT). 6 IEC 61188-1-22013 III , . () . , , 2014 , IEC 61188-1-22013 IV 1 .1 2 1 3 .1 4 14 5 .22 6
3、23 7 24 8 .25 9 (TDR) 31 A () , .32 () 33 IEC 61188-1-22013 V . , . . , , . . , , , , , , . , , , . , . () , . , . , , . , , , , , . 100 - 55 %. -, , 100 . , - - , (), . IEC 61188-1-22013 1 . 1-2 . Printed boards and printed board assemblies. Design and use. Part 1-2. Generic requirements. Controlle
4、d impedance 20150301 1 , , , , . ( ) . , . 2 . . ( ). IEC 61182 ( ) Printed boards Electronic data description and transfer ( . ) IEC 61182-1:1994 Printed boards Electronic data description and transfer Part 1: Printed board description in digital form ( . . 1. ) IEC 61189-3:1997 Test methods for el
5、ectrical materials, interconnection structures and assemblies Part 3: Test methods for interconnection structures (printed boards) ( , . 3. ( ) 3 3.1 , , -, - , , , , , , , , , . , , -, - . ( ) , . . , . , , , . , IEC 61188-1-22013 2 , . , , , , . , , . . , , . , , . , . . , , . , . , . . , , . DIP- , . , , - . . , SOIC, PLCC, PFQP, TSOP, BGA. , , . -, -. , . 3.2 3.2.1 , . () , . . , : a) , . ( ). , . . , , . , 3:1 (. . ), ; b) , . , . , , , . 3.2.2 , IEC 61188-1-22013 3 . , : - ; - ; - ; - .
