1、 , () INTERSTATE COUNCIL FOR STANDARDIZATION, METROLOGY AND CERTIFICATION (ISC) IEC 61188-5-2 2013 5-2 ( ) (IEC 61188-5-2:2003, IDT) IEC 61188-5-22013 II , 1.092 . 1.22009 . , . , , , 1 ( ) , 5 , / 91 2 420 , , 3 , ( 14 2013 . 44) : ( 3166) 00497 ( 3166) 00497 BY KG RU 4 16 2014 1106- IEC 61188-5-20
2、14 1 2015 . 5 IEC 61188-5-2:2003 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components( . . 5-2. ( /). ). (en). IEC/TC 91 (IEC). 1.5 ( 3.5). , , , , . (IDT). 6 IEC 61188-5-22013 III , . () . , , 2014 , IEC 61188-5-22013 IV 1 1
3、 2 1 3 .2 4 .2 5 6 6 .10 7 .14 8 ( ).18 9 ( )23 10 27 11 ( ) 31 12 ( ) .35 13 SC-59/TO-236 35 14 SC-62/TO-243 35 15 SC-61/TO-253 .35 16 SC-73 35 17 SC-63/TO-252 35 18 1SC-77 .35 .36 IEC 61188-5-22013 V IEC 61188-5 . . 5. ( ) : 5-1. . 5-2. . 5-3. . 5-4. J- . 5-5. . 5-6. J- . 5-8. (BGA, FBGA, CGA, LGA
4、). , , , . (. IEC 61188-5-1, ). , . , , , , . (, , , ) (, / ). ( 1, 2 3) : (max), (mdn) (min). , . , . , , . , , , , IEC 61188-5-1, . (SMD), , . , , . . IEC 61188-5-22013 1 5-2 ( ) Printed boards and printed board assemblies. Design and use. Part 5-2. Attachment (land/joint) considerations. Discrete
5、 components 20150301 1 , . , , , , . , , , . 2 . ( ). IEC 60068-2-58 Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) ( . 2-58. . Td. , (SMD) IEC 60115-1 Fixed resistors
6、for use in electronic equipment Part 1: General specification ( . 1. ) IEC 60286-3 Packaging of components for automatic handling Part 3: Packaging of leadless components on continuous tapes ( . 3. ) IEC 60286-4 Packaging of components for automatic handling Part 4: Stick magazines for electric comp
7、onents encapsulated in packages of form E and G ( . 4. E G) IEC 60286-5 Packaging of components for automatic handling Part 5: Matrix trays ( . 5. ) IEC 60286-6 Packaging of components for automatic handling Part 6: Bulk case packaging for surface mounting compounds ( . 6. ) IEC 60384-3 Fixed capaci
8、tors for use in electronic equipment Part 3: Sectional specification: Fixed Tantalum chip capacitors ( . 3. . ) IEC 60384-18 Fixed capacitors for use in electronic equipment Part 18: Sectional specification Fixed aluminium electrolytic chip capacitors with solid and non-solid electrolyte ( . 18. . )
9、 IEC 60384-20 Fixed capacitors for use in electronic equipment Part 20: Sectional specification Fixed metallized polyphenylene sulfide film dielectric chip d.c. capacitors ( IEC 61188-5-22013 2 . 20. . ) IEC 61188-5-1 Printed boards and printed board assemblies Design and use Part 5-1: Attachment (l
10、and/joint) considerations Generic requirements ( . . 5-1. ( ). ) IEC 61605 Fixed inductors for use in electronic and telecommunication equipment Marking codes ( . ) 3 IEC: - IEC 60286-3 (. 1); - IEC 60286-4; - IEC 60286-5; - IEC 60286-6. 1 4 4.1 , . 4.2 . . 4.2.1 2. U. . , , , . IEC 61188-5-22013 3
11、2 4.2.2 , . , , , . . , . , 4.2.3 , . , , , IEC 60115-1 ( 2.4). 4.2.4 IEC 60286-3. 4.2.5 , , , , IEC 60068-2-58. 4.3 3. IEC 61188-5-22013 4 L S W T H min max min max min max min max min max1005 0,95 1,05 0,35 0,75 0,45 0,55 0,15 0,30 0,30 0,401608 1,50 1,70 0,50 1,50 0,70 0,90 0,10 0,50 0,35 0,55201
12、2 1,90 2,10 0,70 1,70 1,15 1,35 0,20 0,60 0,45 0,653216 3,00 3,40 1,50 2,90 1,45 1,75 0,25 0,75 0,45 0,653225 3,00 3,40 1,50 2,90 2,30 2,70 0,25 0,75 0,45 0,655025 4,80 5,20 3,10 4,50 2,30 2,70 0,35 0,85 0,35 0,756332 6,10 6,50 4,40 5,80 3,00 3,40 0,35 0,85 0,35 0,75 3 4.4 4. (min), (mdn) (max) JT, JH JS , . ,
