1、 , () INTERSTATE COUNCIL FOR STANDARDIZATION, METROOGY AND CERTIFICATION (ISC) IEC 61188-5-6 2013 5-6 ( ) J- (IEC 61188-5-6:2003, IDT) IEC 61188-5-62013 II , 1.092 . 1.22009 . , . , , , 1 ( ) , 5 , / 91 2 420 , , 3 , ( 14 2013 . 44) : ( 3166) 00497 ( 3166) 00497 BY KG RU 4 16 2014 1114- IEC 61188-5-
2、62013 1 2015 . 5 IEC 61188-5-6:2003 Printed boards and printed board assemblies Design and use Part 5-6: Attachment (land/joint) considerations Chip carriers with J-leads on four sides ( . . 5-6. ( /). J- ). (en). IEC/ 91 (IEC). , , , , . . (IDT). 6 IEC 61188-5-62013 III , . () . , , 2014 , IEC 6118
3、8-5-62013 IV IEC 61188-5 : 5-1 ; 5-2 ; 5-3 ; 5-4 J- ; 5-5 ; 5-6 J- ; 5-8 (BGA, FBGA, CGA, LGA). J- . . (. IEC 61188-5-1. ). , . , , , , . (. . , , ) (, / ). ( 1, 2 3) : (max), (mdn) (min). , . , . , . , , , , IEC 61188-5-1, . (SMD), , . , , . . IEC 61188-5-62013 1 5-6 ( ). J- Printed boards and prin
4、ted board assemblies. Design and use. Part 5-6. Attachment (land/joint) considerations. Chip carriers with J-leads on four sides 20150301 1 J- . , , , , . , , , . QFJ , ; PLCC , . 2 . ( ). IEC 60068-2-58 Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to di
5、ssolution of metallization and to soldering heat of surface mounting devices (SMD) ( . 2-58. . Td. , (SMD) IEC 60191-2 Mechanical standardisation of semiconductor devices Part 2: Dimensions 2. IEC 61188-5-1 Printed boards and printed board assemblies Design and use Part 5-1: Attachment (land/joint)
6、considerations Generic requirements ( . . 5-1. ( ). ) IEC 61760-1, Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs) ( 1. ) 3 3.1 J- , . . , , () , . , . IEC 61188-5-62013 2 . . 3.2 QFJ ( ), , , , , . , 1, . / . QFJ, , , , , . . / . 3.3 ,
7、 . - . 3.4 QFJ, , (. IEC 60068-2-58). , . 4 J- QFJ () 4.1 QFJ ( J- ). . 4.2 QFJ , . 4.2.1 1. 1 QFJ () QFJ ( J- ) , . ( , 0 C 70 C) . QFJ . 4.2.2 , , . . 0,1 , 0,05 . . , IEC 61188-5-62013 3 0,5 %. . . , . , . 4.2.3 . 4.2.4 , . 4.2.5 , , 235 C. 60 235 C. 260 C 10 . IEC 61760-1. 4.3 QFJ 24. L W T A B
8、J P - min max min max min max min max min max HmaxQFJ-20 9,60 10,21 0,33 0,58 1,20 1,74 8,71 9,22 8,71 9,22 7,87 4,57 1,27QFJ-28 12,1 12,75 0,33 0,58 1,20 1,74 11,25 11,76 11,25 11,76 10,41 4,57 1,27QFJ-44 17,2 17,83 0,33 0,58 1,20 1,74 16,33 16,84 16,33 16,84 15,49 4,57 1,27QFJ-52 19,7 20,37 0,33 0
9、,58 1,20 1,74 18,87 19,38 18,87 19,38 18,03 5,08 1,27QFJ-68 24,8 25,45 0,33 0,58 1,20 1,74 23,95 24,51 23,95 24,51 23,11 5,08 1,27QFJ-84 29,9 30,53 0,33 0,58 1,20 1,74 29,03 29,59 29,03 29,59 28,19 5,08 1,27QFJ-100 35,0 35,61 0,33 0,58 1,20 1,74 34,11 34,67 34,11 34,67 33,27 5,08 1,27QFJ-124 42,6 43,23 0,33 0,58 1,20 1,74 41,73 42,29 41,73 42,29 40,89 5,08 1,27 2 QFJ 4.4 3. , , , .
