GOST IEC 61188-5-8-2013 Printed boards and printed board assemblies Design and use Part 5-8 Attachment (land joint) considerations Area array components (BGA FBGA CGA LGA)《印制板和印制板组.pdf

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1、 , () INTERSTATE COUNCIL FOR STANDARDIZATION, METROLOGY AND CERTIFICATION (ISC) IEC 61188-5-82013 5-8 ( ) (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007, IDT) IEC 61188-5-82013 II , 1.092 . 1.22009 . , . , , , 1 ( ) , 5 , / 91 2 420 , , 3 , ( 14 2013 . 44) : ( 3166) 00497 ( 3166) 00497 BY KG RU 4 16 2014

2、 1113- IEC 61188-5-82013 1 2015 . 5 IEC 61188-5-8:2007 Printed boards and printed board assemblies Design and use Part 5-8: Attachment (land/joint) considerations Area array components (BGA, FBGA, CGA, LGA) ( 61188-5-8:2007 . . 5-8. ( /). (BGA, FBGA, CGA, LGA). (en). IEC/ 91 (IEC). , , , , . . (IDT)

3、 6 IEC 61188-5-82013 III , . () . , , 2014 , IEC 61188-5-82013 IV IEC 61188-5 : 5-1 ; 5-2 ; 5-3 ; 5-4 J- ; 5-5 ; 5-6 J- ; 5-8 (BGA, FBGA, CGA, LGA). , BGA ( , ); FBGA ( ); CGA ( ) LGA ( ). , . (. IEC 61188-5-1 ). , . , , , , . , IEC 61188-5 , . ( 2) BGA; ( 3) BGA, . . , . , . , IEC 61188-5-1, , . (

4、SMD), , . , ( ) . , , . . IEC 61188-5-82013 1 5-8 ( ) (BGA, FBGA, CGA, LGA) Printed boards and printed board assemblies. Design and use. Part 5-8: Attachment (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA) 20150301 1 , . , , , , . , , , . , . , (, - . .) . , , . . , 1. , , ,

5、 . 1 IEC 61188-5-82013 2 2 . ( ). IEC 60068-2-58 Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) ( . 2-58. . Td. , (SMD)_ IEC 60191-2 ( ) Mechanical standardization of s

6、emiconductor devices Part 2: Dimensions ( . 2. ) IEC 61188-5-1 Printed boards and printed board assemblies Design and use Part 5-1: Attachment (land/joint) considerations Generic requirements ( . . 5-1. ( ). ) IEC 62090 Product package labels for electronic components using bar code and twodimension

7、al symbologies ( , ) 3 3.1 , ( ) -. BGA . . , . PBGA ( ), CBGA ( ), FBGA ( ), TBGA ( ) , . , , () . 1,50 0,25 , 1. ( 0,40 ) , . IEC 61188-5-82013 3 1 1,50; 1,27 0,75 0,65 0,90 1,00 0,60 0,50 0,70 1,00; 0,80 0,50 0,45 0,55 1,00; 0,80; 0,75 0,45 0,40 0,50 0,80; 0,75; 0,65 0,40 0,35 0,45 0,80; 0,75; 0,65; 0,50 0,30 0,25 0,35 0,40 0,25 0,22 0,28 0,30 20 0,18 0,22 0,25 0,15 0,13 0,17 3.2 , , , , , 1. 1 . / . , - IEC 62090. 3.3 . . , , , . - , . 3.4 , , . , ( 3 ), ( 2), . , . . , . , FBGA. 4 BGA () 4.1 BGA . BGA. , . 4.2 BGA , . 4.2.1 , . BGA , 2. : -

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