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4、nterconnectingstructures.Part2-2.Reinforcedbasematerials,cladandunclad . Phenoliccellulosepaperreinforcedlaminatedsheets,copper-cladandhighelectricalgrade 201307011 -,- ( ) 0,8 3,2 .-:- 61249-2-2-1:,(.7.3.2);- 61249-2-2-2: ( )(.7.3.2);- 61249-2-2-3:(-)(.7.3.3).9FV0FV1. . ,.2 .60194:1999 .,.-(IEC6019
5、4:1999,Printedboarddesign,manufactureandassembly Termsanddefinitions) 61189-2:1997 , - . 2. (IEC 61189-2:1997, Test methods for electrical materials, printed boards and other interconnection structuresandassemblies Part2:Testmethodsformaterialsforinterconnectionstructures)61249-5-1:1995 .5-1.(- ) IE
6、C 61249-5-1:1995, Materials for interconnection structures Part 5: Sectionalspecification set for conductive foils and films with and without coatings Section 1: Copper foils (for themanufactureofcopper-cladbasematerials) 9000:2000 . (ISO9000:2000,Qualitymanagementsystems Fundamentalsandvocabulary)1
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