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5、 2. - (IEC 61189-2:1997, Test methods for electrical materials, interconnection structures andassemblies Part 2: Test methods for materials for interconnection structures) 61249-5-1:1995 . 5-1. - . ( , ) IEC 61249-5-1:1995, Materials for interconnection structures Part 5: Sectional specification se
6、t forconductive foils and films with or without coatings Section 1: Copper foils (for the manufacture ofcopper-clad base materials) 9000:2000 . (ISO 9000:2000, Quality management systems Fundamentals and vocabulary) 11014-1:1994 . . 1. (NF ISO 11014-1-1994, Safety data sheet for chemicalproducts. Pa
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8、), , 2E04 5000 ; , , 2E04 10000 , 2E10 5,4 , 2E10 0,035 ( 0,5 ), /, 2E11 30, , 2E14 60 ( 0,5 ), , 2E15 40 125 C, , 2E07 1000 125 C, , 2E07 10002 61249-2-720126 6.1 , . 2M18 61189-2.6.1.1 ( ) ( ) :- 0,13 0,25 1 ;- 0,26 0,50 2 ;- 0,51 0,75 4 ;- 0,76 1,00 7 ;- 1,00 30 . 300c180 300 :- A 29;- B 17;- C 5
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10、 ). , , 0,10 0,15 . c1770,03 c1770,02 c1770,01. 0,05 0,10 c1770,04 c1770,03 c1770,02 0,15 0,30 c1770,05 c1770,04 c1770,03 0,30 0,50 c1770,08 c1770,05 c1770,04 0,50 0,80 c1770,09 c1770,06 c1770,05 0,80 1,00 0,80 1,00 . c1770,13 c1770,09 c1770,07 1,00 1,30 . 1,00 1,30 c1770,17 c1770,11 c1770,08 1,30 1,70 c1770,20 c1770,13 c1770,10 1,70 2,10 c1770,23 c1770,15 c1770,12 2,10 2,60 c1770,25 c1770,18 c1770,15 2,60 3,20 c1770,30 c1770,20 c1770,156.4 ( ) 2M01 61189-2 - , 3. 3 61189-2,
