1、JEDEC STANDARD Mechanical Shock Component and Subassembly JESD22-B110B (Revision of JESD22-B110A, November 2004, Reaffirmed: June 2009) JULY 2013 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through t
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5、cations represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard. No
6、 claims to be in conformance with this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or refer to www.jedec.org under St
7、andards and Documents for alternative contact information. Published by JEDEC Solid State Technology Association 2013 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading t
8、his file the individual agrees not to charge for or resell the resulting material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. For information, contact: JEDEC Solid St
9、ate Technology Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Standard No. 22-B110B Page 1 Test Method B110B (Revision of Test Method B110A) TEST METHOD B110B MECHANICAL SHOCK COMPONENT AND
10、SUBASSEMBLY (From JEDEC Board Ballot JCB-13-27, formulated under the cognizance of the JC-14.1 Subcommittee on Reliability Test Methods for Packaged Devices.) 1 Scope Component and Subassembly Mechanical Shock Test Method is intended to evaluate components in the free state and assembled to printed
11、wiring boards for use in electrical equipment. The method is intended to determine the compatibility of components and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test components in usage conditions as assembled to printed wiring boards. Mechanical Sho
12、ck due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for component qualification. 2 Apparatus The shock-testing
13、 apparatus shall be capable of providing shock pulses with a peak acceleration of up to 2900 multiples of gravity (g), a velocity change of 100 to 544 centimeters per second (39 to 214 inches per second), and a pulse duration between 0.3 and 8.0 milliseconds to the body of the component. For free-st
14、ate testing, a velocity change of 125 to 544 centimeters per second (49 to 214 inches per second) and a pulse duration between 0.3 and 2.0 milliseconds is sufficient. Conversely, for mounted-state testing, apparatus capable of a velocity change of 100 to 544 centimeters per second (39 to 214 inches
15、per second) and a pulse duration between 5.0 and 8.0 milliseconds to the body of the component is sufficient. The acceleration pulse shall be a half-sine waveform with an allowable deviation from specified peak acceleration not greater than 10%. The test velocity change shall be 10% of the specified
16、 level. The pulse duration shall be measured between the points at 10% of the peak acceleration during rise time and 10% of the peak acceleration during decay time. Absolute tolerances of the pulse duration shall be 15% of the specified duration. The test equipment transducer shall have a natural fr
17、equency greater than 5 times the frequency of the shock pulse being established, and measured through a low-pass filter having a bandwidth greater than 5 times the frequency of the shock pulse being established. Filtering should not be used in lieu of good measurement setup and procedure practices.
18、Appropriate equipment calibration should be considered prior to any testing to ensure conformance to the specified targets and acceptable tolerances. Reserving a set of known good units is recommended for pre-test calibration exercise whenever new samples are to be tested. If calibration tests are c
19、onducted regularly, then following periodical preventive maintenance should suffice for the equipment to meet the target and tolerance limits. JEDEC Standard No. 22-B110B Page 2 Test Method B110B (Revision of Test Method B110A) 3 Terms and definitions component: A constituent part. NOTE 1 Examples i
20、nclude integrated circuits as attached components and surface-mounted-subassembly components of printed circuit boards. NOTE 2 The classification of an item as a device or a component depends upon the intention of the owner at the time of classification. dead-bug (orientation): The orientation of a
21、package with the terminals facing up. deviation from specified acceleration velocity change pulse duration level: The maximum difference between the measured value and the target value. equivalent drop height: The free-fall drop height from which an object at rest must fall, in vacuum, under standar
22、d gravity, to attain a velocity equal to the velocity change stated in the test specification. NOTE This is the theoretical height that will impart the specified velocity change if impact with zero rebound occurs. This height is provided for reference only in the various service conditions. free sta
23、te (of a component): The state in which a component or subassembly is rigidly attached to the test apparatus so that the full specified shock level is transmitted to the component or subassembly body. live-bug (orientation): The orientation of a package with the terminals facing down , e.g., resting
24、 on its terminals. mounted state: The state in which a subassembly is supported by a test fixture that allows flexure to simulate usage conditions and in a manner such that the full specified shock level is transmitted to the subassembly body. peak acceleration: The maximum acceleration during the d
25、ynamic motion of the sample under test. pulse duration: The time interval between the instant when the acceleration first reaches 10% of its specified peak level and the instant when the acceleration first returns to 10% of the specified peak level after having reached that peak level. NOTE The basi
26、c frequency of the pulse is 1/ (2 x duration). service condition: The designation for the severity of stress. subassembly: A printed circuit board and the components assembled thereon that form a unit or segment of electrical equipment. NOTE The components are preferably located near the center of t
27、he printed circuit board. velocity change: The integral of the acceleration interval over the duration of the entire shock event including at least the pulse duration interval. vertical direction: The direction that is parallel with gravity, i.e., normal to the normalized surface of the earth. 4 PTh
28、e shockbefore usapparatusto a total duration sdirectionssubassembacceleratiin each of2 define thThere are a componComponeIn the freefull specifis performcomponena process such procrocedure -testing appae. Means sha. In the free sof 30 shockspecified in tof three orthly shall be on, velocity cthe pos
29、itive e componenFiguFigure 2two types ofent or subassnts or subasstate, the coied shock leved, the methnt or subassemor processes esses in the teratus shall bll be providetate unless o, which are fhe selected sogonal axessubjected tohange and pand negativet orientation, re 1 Live facing d Dead bfaci
30、ng utests that canembly in the semblies submponent or el is transmiod of mounbly rework,should be apst hardware e attached tod to preventtherwise speive shock puervice condi(X, Y and Za total of ulse durationdirections ofpositive and bug orientatownward in ug orientatpward in eibe performefree state
31、, andjected to the subassemblytted to the coting to the treuse, remouplied to the cpreparation sa sturdy labthe shock fcified, the colses of the ption (see Tab). If shock t12 shocks, specified in three orthognegative direion with soldeither free oion with solther free ord, based on tanother is tetes
32、t shall be rshall be rigidmponent or est apparatusnting, burn iomponent orhall be documA1 A1 oratory tablerom being remponent or eak acceleratle 1) in eacesting is reqwhich are tthe selected onal axes (Xctions for theer spheres or mounted slder spheremounted she test informesting of a suandomly sell
33、y attached tsubassemblyshall be typin, or other strsubassemblyented. RoliveJEDEC Stan(Revision of Te or equivalenpeated due tsubassembly ion, velocityh of the posuired in the wo shock pservice cond, Y and Z). Fthree orthogf componenstate. s of compontate. ation neededbassembly inected and typo the t
34、est appbody. If the ical of the uessful procesprior to thetate clockwise-bug to dead-dard No. 22-BPTest Method Best Method Bt base and leo “bounce” ishall be subjchange and itive and negmounted statulses of the ition (see Tabigure 1 and Fonal axes. t ent . One is testia mounted sical of produaratus,
35、 so thmounted statsage conditis is possibleshock test. Ue bug 110B age 3 110B 110A) veled n the ected pulse ative e, the peak le 2) igure ng of tate. ction. at the e test on. If , such se of JEDEC Standard No. 22-B110B Page 4 Test Method B110B (Revision of Test Method B110A) 4.1 Component or subasse
36、mbly in free state Components or subassemblies to be tested in the free state must be subjected to at least one of the service conditions (A to H) shown in Table 1, which shall be documented. The designated shock shall be applied to the component or subassembly body in a manner to simulate expected
37、impacts during processing, packaging, and shipment. The component or subassembly shall be rigidly attached to the test apparatus in such a manner that it experiences the full-specified shock level at the component or subassembly body. At least five shocks in each of two directions of three orthogona
38、l axes shall be applied (minimum total of 30 shocks) at the severity of the designated service condition. Table 1 Component or subassembly free state test levels NOTE velocity change = 2 * (std_g * acceleration_peak_g * pulse_duration) / pi drop height = 0.5 * (velocity_change)2/ std_g 4.2 Subassemb
39、ly in mounted state If required, subassemblies shall also be tested in a mounted state, subject to at least one of the service conditions (1 to 14) shown in Table 2, which shall be documented. The designated shock shall be applied to the subassembly mounted to the test apparatus with fixtures that a
40、llow flexure to simulate the usage conditions, and in a manner such that the full specified shock level is transmitted to the subassembly body. Preferred methods to support the subassembly are a slotted/clamping picture frame, or a raised-boss bolted fixture with contact points in four regions not c
41、loser than one inch from any component. The subassembly, supporting method, test fixture mounting dimensions, and one or more of the lowest resonant frequencies of the subassembly shall be documented. At least two shocks in each of two directions of three orthogonal axes shall be applied (minimum to
42、tal of 12 shocks) at the severity of the designated service condition. The optimum test is performed when the subassembly is mounted in a manner that simulates the application configuration. If that information is unknown or unavailable, a recommended printed wiring board for testing the component(s
43、) of the subassembly is the JEDEC standard thermal card (as described in JEDEC Standards JESD51-9, JESD51-10, and JESD51-11), which should be modified to include component and connection functionality circuitry. Service condition Acceleration peak Pulse duration Velocity change Equivalent drop heigh
44、t g ms cm/s in/s cm inches H 2900 0.3 543 214 150 59 G 2000 0.4 499 197 127 50 B 1500 0.5 468 184 112 44 F 900 0.7 393 155 78.9 31 A 500 1.0 312 123 49.7 20 E 340 1.2 255 100 33.1 13 D 200 1.5 187 73.7 17.9 7 C 100 2.0 125 49.2 7.90 3 JEDEC Standard No. 22-B110B Page 5 Test Method B110B (Revision of
45、 Test Method B110A) 4.2 Subassembly in mounted state (contd) Alternately, if the size or construction of the JEDEC thermal card is not suitable for the given component(s), a printed wiring board should be used with the dimensions, materials, and construction typical for the component subassembly usa
46、ge, and should include electrical circuitry to test for functionality, continuity, and damage of the component on the subassembly. The dimensions and construction of the printed wiring board shall be documented. Test results using subassembly application hardware are most relevant and should take pr
47、ecedence over results obtained using test vehicles. Table 2 Subassembly mounted state test levels Service condition Acceleration peak Pulse duration Velocity change Equivalent drop height g ms cm/s in/s cm inches 1 109 8.0 544 214 151 60 2 108 7.5 506 199 130 51 3 107 7.0 468 184 111 44 4 105 6.5 42
48、6 168 92.6 36 5 103 6.0 386 152 75.9 30 6 95 5.8 344 135 60.3 24 7 86 5.6 301 118 46.1 18 8 72 5.4 243 95.6 30.0 12 9 67 5.3 222 87.3 25.1 10 10 61 5.2 198 78.0 20.0 8 11 54 5.1 172 67.7 15.1 6 12 45 5.0 140 55.3 10.1 4 13 39 5.0 122 47.9 7.6 3 14 32 5.0 100 39.3 5.1 2 NOTE velocity change = 2 * (st
49、d_g * acceleration_peak_g * pulse_duration) / pi drop height = 0.5 * (velocity_change)2/ std_g 4.3 Measurements Hermeticity tests, if required, visual examination and electrical measurements (consisting of parametric and functional tests) shall be performed. JEDEC Standard No. 22-B110B Page 6 Test Method B110B (Revision of Test Method B110A) 5 Failure criteria A component or subassembly shall be considered as a failure if hermeticity requirements, if any, cannot be demonstrated, if parametric limits are exceeded or if functionality cannot be demonstrated under th
