1、EINJEDEC Standard for Failure Analysis Report STANDARD I Format EINJESD38 DECEMBER 1995 ELECTRONIC INDUSTRIES ASSOCIATION ENGIieERING DEPARTMENT NOTICE EWJEDEC Standards and Publications contain material that has been prepared, progressively reviewed, and approved through the JEDEC Council level and
2、 subsequently reviewed and approved by the ELA General Counsel. EINJEDEC Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchases, facilitating interchangeability and improvement of products, and assisting the purc
3、haser is selecting and obtaining with minimum delay the proper product for his particular need. Existence of such standards shall not in any respect preclude any member or nonmember of JEDEC fiom manufacturing or selling products not conforming to such standards, nor shall the existence of such stan
4、dards preclude their voluntmy use by those other than EL4 members, whether the standard is to be used either domestically or internationally. EIA/JEDEC Standards and Publications are adopted without regard to whether their adoption may involve patents or articles, materials, or processes. By such ac
5、tion, EWJEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the EWJEDEC Standards or Publications. The information included in EWJEDEC Standards and Publications represents a sound approach to product specification and application,
6、principaiiy from the solid state device manufacturer viewpoint. Within the EIMJEDEC organization there are procedures whereby an EWJEDEC Standard or Publication may be further processed and uitimately becomes an ANSEIA Standard. t, Inquiries, comments, and suggestions relative to the content of this
7、 EWJEDEC Standard or Publication should be addressed to the JEDEC Executive Secreaq at EIA Headquarters, 2500 Wilson Boulevard, Arlington, VA 2220 1. Published by OELECTRONIC INDUSTRIES ASSOCIATION 1995 Engtneering Department 2500 Wilson Boulevard Arlington, VA 2220 1 “Copyright“ does not apply to J
8、EDEC member companies as they are free to duplicate this document in accordance with the latest revision of the JEDEC Publication 2 1 “Manual of Organization and Procedure“. PRICE: Please refer to the current Catalog of EIA, JEDEC, and TIA STANDARDS and ENGINEERING PUBLICATIONS or call Global Engine
9、ering Documents, USA and Canada (1-800-854-71 79) International (303-397-79s) Printed in U.S.A. All rights reserved EIA JESD3B 95 I 3234600 0563344 TIL W This documer permission. is copyrigk PLEASE! DONT VIOLATE THE LAW! id by the EIA and may Organizations may obtain permission to reproduce a limite
10、d number of copies through entering into a license agreement. For information, contact: 1, Global Engineering Documents 15 Inverness Way East Englewood, CO 80 1 12-5 704 or call U.S.A. and Canada 1-800-854-71 79, International (303) 397-7956 EIA JESD3B 95 m 3234600 0567345 978 m JEDEC STANDARD No. 3
11、8 Page 1 -l STANDARD FOR FAILURE ANALYSIS REPORT FORMAT (From JEDEC Council Ballot JCB-94-04A, formulated under the cognizance of JC-14.6 Committee on Failure Analysis) 1 Introduction 1.1 Purpose The purpose of this standard is to promote unification of content and format of semiconductor device fai
12、lure-analysis reports so that reports from diverse laboratories may be easily read, compared, and understood by customers. Additional objectives are to ensure that reports can be easily read by users, satisfactorily reproduced on copying machines, adequately transmitted by telefax, and conveniently
13、stored in standard fding cabinets. 1.2. Scope This document specifies content and format of reports describing failure analyses of semiconductor devices. For purposes of this document, destructive physical analyses (DPAs), construction analyses, and single analytical service requests are not regarde
14、d as failure analysis. 1.3 Application When specifid in a contract between a customer and failure analysis laboratory, this standard shall be used in preparation of ali semiconductor-device failure-analysis reports generated under said contract. Of course, in the interest of promoting community-wide
15、 uniformity in failure-analysis reporting, this standard may be voluntarily adopted and used even when not specifically required by a contract. 1.4 Definitions For purposes of this standard, the following terms have the following meanings: a) analyst: The specific person who performs the failure ana
16、lysis; if more than one analyst is associated with a particular analysis, then one such person is designated as the principal analyst. b) laboratory: The organization or specific physical facility in which the failure analysis is performed. - EIA JESD38 95 3234600 0567346 804 m Y JEDEC STANDARD No.
17、38 Page 2 c) customer: The organization or person that originally request the failure analysis and received the failure analysis report. 1.5 Applicable documents ANSI/IEEE Std 268, American National Standard for Metric Practice. ANSUIEEE Std 260, IEEE Standard Letter Symbols for Units of Measure. Th
18、e University of Chicago Press, Chicago, IL, The Chicago Manual of Style. US Government Printing Office, Washington, DC, Government Printing Office Style Manual. Gramercy miblishing Company, New York, NY, A Manual of Style. (Identical to the Government Printing Office Style Manual.) 2 General require
19、ments 2.1 Page and text formats Paper shall be white and shali be of the standard size for the country in which the report originates (e.g., 8 1/2-inch by 11-inch in the United States, A4 210 by 297-mm in some European countries, etc.) Both sides of the paper may be used, but if this option is selec
20、ted, paper stock must be sufficiently heavy and opaque that printed, typewritten, or handwritten material on one side does not adversely affect readability or reproducibility of similar material on the other side. Black is preferred for all text and tables, but color is acceptable if routinely used
21、by the failure-analysis laboratory; however, because many failure-analysis reports are reproduced on black-and white copying machines or are transmitted by black-and-white facsimile, value of color will be lost to readers of second-generation copies. The type style is used in the report shaU be legi
22、ble and suitable for copying-machine reproduction and telefax transmission; to this end, type size shall be in the range of 10 to 14 points. J EIA JESD38 95 3234600 O567347 740 JEDEC STANDARD No. 38 Page 3 Reports shall be bound so that all pages are kept together and in correct order; staple, plast
23、ic multifinger, wire spiral, looseleaf notebook, and other binding systems that achieve this are acceptable. Binding shall be at the left with the long dimension of the paper vertical. Margin on the binding edge of each page shall be one inch (25 mm) minimum: margins on all other sides of each page
24、shall be at least 0.75 inch (19 mm). All report pages shall be numbered and shall be identified by the report serial number. Special markings (e.g., a logotype or confidentiality notice) may be included on all or selected pages. 2.2 Graphics format Photographs, radiographs, scanning-electron microgr
25、aphs, energy-dispersive x-ray spectra, illustrations, data sheets, graphs, chemical-analysis reports, printouts, and other relevant graphic items that support the conclusions shall be bound at the end of the failure-analysis report. Graphic images shall be of good quality and suitable for illustrati
26、ng the desired point. The image area shall not be cropped, but borders surrounding the image area may be removed. If an image is too wide to be mounted horizontally, it may be rotated 90“ so 8, that its bottom edge is parallel to the righthand edge of the page. Each graphic item shall be accompanied
27、 by a brief descriptive caption that includes the failed-part seria number, if applicable, and important test conditions (e.g., magnification and, for scanning-electron micrographs, tilt angle). All photographs and other images shall be mentioned in the report-body text, and they shall be presented
28、at the end of the report in the same order that they are referenced in the text. When a high-magnification micrograph is used to illustrate a failure site or other key feature of the device being analyzed, at least one lower-magnification “locator“ micrograph shaii be included. Split-image, dual mag
29、nification scanning-electron micrographs satisfy this requirement. Arrows used to point out specific features shall have good contrast with the background. Color graphics are acceptable if routinely used by the failure-analysis laboratory or if a relevant detail is more easily recognizable in color;
30、 however, because many failure-analysis reports are reproduced on black-and-white copying machines or are transmitted by black-and- white facsimile, value of color will be lost to readers of second-generation copies. Laboratory data sheets (e.g., bond-wire puil-strength data) may be on printed forms
31、 with typewritten or legible handwritten entries. EIA JESD38 95 = 3234600 0567348 687 JEDEC STANDARD No. 38 Page 4 2.3 Acronyms and abbreviations Definitions of all acronyms and abbreviations shall be spelled out at first usage; exceptions are 1) Abbreviations of units of measure defined in American
32、 National Standards Institute (ANSI) and Institute of Electrical and Electronics Engineers (IEEE) Standard No. 268, American National Standard for Metric Practice and ANSUIEEE Standard No. 260, IEEE Standard Letter Symbols for Units of Measure and 2) U.S. Postal Service official abbreviations for st
33、ate names. Preferred format is the spelled-out name followed by the acronym or abbreviation in parentheses as indicated above with the institute names. 2.4 Grammar and speiiing Primary purposes of a failure-analysis report are to convey information to the customer and simultaneously to imply compete
34、nce of the analyst and excelience of the analytical laboratory. To achieve this end, correct grammatical construction and spelling are essential. Widely available guides to proper grammatical usage include the The Chicago Manual of Style. the Government Printing Office Stvle Manual, and A Manual of
35、Stvle. 3 Content and arrangements 3.1 Purpose At minimum, a failure analysis report shall include 1) succinct statements of observations with enough support (e.g., photographs, analysis printouts, electrical-test data, etc.) to clearly and credibly identify and illustrate the failure mechanism and 2
36、) concisely stated conclusions; “bullet“ structure is the preferred format. Key elements of the report shall be in consistent locations so that readers can quickly determine the principal points of the analysis. The report may be expanded to accommodate special requirements. 3.2 Content Minimum elem
37、ents in a failure analysis report shall be the following in the specified order: a) Cover sheet (refer to 3.3) b) Summary page (refer to 3.4) c) Analysis (refer to 3.5) d) Supporting graphics and data (refer to 3.6) EIA JESD3B 95 m 3234600 0567LY 513 W JEDEC STANDARD No. 38 Page 5 Additional element
38、s and subelements that may be optionally incorporated in a failure analysis report include the following: a) Discussion (refer to 3.5.4) b) Recommendations (refer to 3.5.5) c) References (refer to 3.5.6) d) Annexes (refer to 3.7) 3.3 Cover sheet Each failure analysis report shall have a cover sheet
39、on which only the following information shall appear: a) Failure analysis laboratory name, location (street address, city, state, and zip code or equivalent outside of the United States), telephone number, and telefax number. NOTE - These items may be at the top or bottom of the cover sheet. b) A de
40、scriptive title EXAMPLE - “FAILURE ANALYSIS OF GENERIC SEMICONDUCTOR TYPE XDQ1234 MICROPROCESSOR“ or “YIELD ANALYSIS OF WAFER LOT X9876“ c) An identifier (e.g., a project, job, report serial number, or other unique code) d) Date e) Name of customer organization 3.4 Summary page The following items s
41、hall appear on the summary page in the specified order: a) Component identification including, as applicable, manufacturers name, type number, functional description, date code, package type, and other relevant information. EIA JESD3B 95 3234600 0567350 235 JEDEC STANDARD No. 38 Page 6 b) Summary (A
42、n abstract of the analysis, not to exceed one-half page in length, containing essences of the background information, conclusions, and, if applicable, recommendations. ) c) Name of the principal analyst NOTE - If desired, names of the approver and/or other analysts may be included also. 3.5 Analysis
43、 The Analysis Section shall contain subsections on background information, laboratory observations, and conclusion in that order. Optionally, the Analysis Section may also contain discussion, recommendations, and references subsections. 3.5.1 Background information Background data provided by the cu
44、stomer shall be summarized; included, for examplq, should be brief descriptions of the complaint that led to failure analysis, specific failure mode reported by the customer, and other relevant information (e.g., electrical data, environmental, and operational conditions existing prior to and at the
45、 the time of failure, constancy or intermittency of the failure, coincident failures, etc.) 3.5.2 Laboratory observations Specific laboratory observations that led directly to identification of the failure site and failure mechanism shall be described briefly, preferably in “bullet“ format; although
46、 it is not necessary to describe observations that did not contribute directly to the conclusion, it may be desirable to do so for completeness or to emphasize a specific point. Typical subheadings that may be used, as applicable, in the Laboratory Observations Subsection include the following: a) P
47、reliminary analysis: Covers, for example, external visual inspection, x- radiography, hermeticity tests, particle-impact-noise detection, acoustic microscopy in any of its various embodiments, electrical verification test, stabilization bake, etc. b) Decapsulation and internal visual inspection: Men
48、tions decapsulation method and briefly describes internal appearance of decapsulated device, observed damage sites, etc. EIA JESD38 95 3234600 0567L5L LL JEDEC STANDARD No. 38 Page 7 c) Failure isolation: May include, for example, liquid-crystal hot-spot detection, scanning-electron microscopy, volt
49、age contrast, electron-beam induced current, optical-beam induced current, light-emission microscopy, depiocessing , microprobing , microsectioning, comparative analysis, simulation, etc. 3.5.3 Conclusions In the Conclusions Subsection, the failure site, if applicable, shall be identified. Additionally, relevant failure mechanisms shall be described briefly and related to reported failure modes or device operational discrepancies. Other significant factors that relate the failure to external stresses or causes should be included. Speculation should be avoided, but if u
