1、 KSKSKSKSKSKSKSK KSKSKS KSKSK KSKS KSK KS KS C IEC PAS 62240 KS C IEC PAS 62240:2008 2008 11 28 http:/www.kats.go.krKS C IEC PAS 62240:2008 : ( ) ( ) FITI ( ) : (http:/www.standard.go.kr) ： ： 2003 8 27 ： 2008 11 28 2008-0810 ： ： ( 025097294) (http:/www.kats.go.kr). 10 5 , . KS C IEC PAS 62240:2008 i
2、 ii 0 1 1 1 2 2 2.1 2 2.2 2 3 .2 4 4 5 .5 5.1 , .5 5.2 6 5.3 .9 5.4 10 5.5 .10 A( ) 13 A.1 13 A.2 .14 A.3 .14 A.4 .20 A.5 21 A.6 .23 B( ) .24 B.1 .24 B.2 24 B.3 24 B.4 .28 B.5 .31 C( ) 33 C.1 .33 C.2 33 D( ) .39 D.1 .39 D.2 .39 KS C IEC PAS 62240:2008 ii (KS) (IS) 2001 1.0 IEC PAS 62240, Use of semi
3、conductor devices outside manufacturers specified temperature range , . . , , . , , . KS C IEC PAS 62240:2008 Use of semiconductor devices outside manufacturers specified temperature range 0 , . . , . . 55 125 40 125 40 85 0 70 , . , . . 1 . . . , . , , . KS C IEC PAS 62240:2008 2 . . . , . . , . 2
4、2.1 . 2.2 KS C IEC PAS 62239, IEC 60134： 1961, Rating systems for electronic tubes and valves and analogous semiconductor devices 3 . . . . , . . 3.1 (absolute maximum rating) , . , . (IEC 60134： 1961 4., ). 3.2 (ambient temperature) KS C IEC PAS 62240:2008 3 3.3 (case temperature) 3.4 (circuit elem
5、ent functional mode analysis) 3.5 (device capability assessment) , . . 3.6 (device quality assurance over the wider temerature range) 3.7 ECMP (electronic component management plan) 3.8 (semiconductor device) . , , , . 3.9 (electronic equipment) , , , , 3.10 (junction temperature) 3.11 (manufacturer
6、 specified parameter limits) ( ) , 3.12 (manufacturer specified parameter range) . KS C IEC PAS 62240:2008 4 3.13 (parameter conformance assessment) 3.14 (parameter characterization) 3.15 (parameter recharacterization) , . 3.16 (rating) 3.17 (recommended operating condition) 3.18 (stress balancing)
7、, 3.19 (target temperature range) 3.20 (thermal uprating) ( ) 3.21 (uprating) 3.22 (wider temperature range) . , . 4 KS C IEC PAS 62240:2008 5 . a) . b) , . 5 , 1 (5.1) (5.2) (5.3), (5.4) . 1 . 5.1 , , , , , , , . 5.1.1 , . , . 5.1.2 (ECMP) ECMP . , ECMP . KS C IEC PAS 62239 ECMP . . . , , . , , , .
8、 5.1.3 KS C IEC PAS 62240:2008 6 . , . . , . 92 , 85 2 70 85 , 85 . 5.2 5.2.1 . , . 5.2.2 ( ) . . KS C IEC PAS 62240:2008 7 . . , (考慮 ) / , , . . (functionality risks)： , , . . (producibility risks)： ( ) . ( , , ). , . . 5.2.2.1 , . . , A . , 5.3.1 . 5.2.2.2 , . , B . 5.2.2.3 , C KS C IEC PAS 62240:
9、2008 8 . C . 100 % . 5.2.2.4 . , D . 1 , , . 2 , 5.2.2.3 5.2.2.4 1 . . , . . a) / . b) . , . c) . d) , , . . 5.2.3 ( ). , . . , . . a) 5.1.2 . , . . b) 3. 20 KS C IEC PAS 62240:2008 9 . . , TJ . . TJ , . . . 5.3 , ECMP . 5.3.1 (5.2.2.1) , . , . 5.3.2 (5.2.2.3) (5.2.2.4) , 5.2.2 (5.3.2), (5.3.3) . 1 . , . , . , , C . 5.3.3 5.2.2.4 5.2.2.3 , 5.2.2 5.3.2 , 5.3.3 . 1 . 5.3.3 , D . , . , . KS C IEC PAS 62240:2008 10 5.3.4 ( ) 5.2 . 5.3.5 . , . . ,
