标准规范-国际标准-IEC

IEC 61249-4-16-2009 Materials for printed boards and other interconnecting structures - Part 4-16 Sectional specification set for prepreg materials unclad (for the manufacture of m.pdf
IEC 61249-4-15-2009 Materials for printed boards and other interconnecting structures - Part 4-15 Sectional specification set for prepreg materials unclad (for the manufacture of m.pdf
IEC 61249-4-14-2009 Materials for printed boards and other interconnecting structures - Part 4-14 Sectional specification set for prepreg materials unclad (for the manufacture of m.pdf
IEC 61249-4-12-2005 Materials for printed boards and other interconnecting structures - Part 4-12 Sectional specification set for prepreg materials unclad - Non-halogenated multifu.pdf
IEC 61249-4-11-2005 Materials for printed boards and other interconnecting structures - Part 4-11 Sectional specification set for prepreg materials unclad - Non-halogenated epoxide.pdf
IEC 61249-4-1-2008 Materials for printed boards and other interconnecting structures - Part 4-1 Sectional specification set for prepreg materials unclad (for the manufacture of mul.pdf
IEC 61249-3-5-1999 Materials for printed boards and other interconnecting structures - Part 3-5 Sectional specification set for unreinforced base materials clad and unclad (intende.pdf
IEC 61249-3-4-1999 Materials for printed boards and other interconnecting structures - Part 3-4 Sectional specification set for unreinforced base materials clad and unclad (intende.pdf
IEC 61249-3-3-1999 Materials for printed boards and other interconnecting structures - Part 3-3 Sectional specification set for unreinforced base materials clad and unclad (intende.pdf
IEC 61249-2-9-2003 Materials for printed boards and other interconnecting structures - Part 2-9 Reinforced base materials clad and unclad Bismaleimide triazine modified epoxide or .pdf
IEC 61249-2-8-2003 Materials for printed boards and other interconnecting structures - Part 2-8 Reinforced base materials clad and unclad Modified brominated epoxide woven fibergla.pdf
IEC 61249-2-7-2002 Materials for printed boards and other interconnecting structures - Part 2-7 Reinforced base materials clad and unclad Epoxide woven E-glass laminated sheet of d.pdf
IEC 61249-2-6-2003 Materials for printed boards and other interconnection structures - Part 2-6 Reinforced base materials clad and unclad Brominated epoxide non-woven woven E-glass.pdf
IEC 61249-2-5-2003 Materials for printed boards and other interconnection structures - Part 2-5 Reinforced base materials clad and unclad Brominated epoxide cellulose paper reinfor.pdf
IEC 61249-2-44-2016 Materials for printed boards and other interconnecting structures - Part 2-44 Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven wove.pdf
IEC 61249-2-43-2016 Materials for printed boards and other interconnecting structures - Part 2-43 Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose pape.pdf
IEC 61249-2-42-2010 Materials for printed boards and other interconnecting structures - Part 2-42 Reinforced base materials clad and unclad - Brominated epoxide non-woven woven E-g.pdf
IEC 61249-2-41-2010 Materials for printed boards and other interconnecting structures - Part 2-41 Reinforced base materials clad and unclad - Brominated epoxide cellulose paper wov.pdf
IEC 61249-2-40-2012 Materials for printed boards and other interconnecting structures - Part 2-40 Reinforced base materials clad and unclad - High performance non- halogenated epox.pdf
IEC 61249-2-4-2001 Materials for printed boards and other interconnection structures - Part 2-4 Reinforced base materials clad and unclad Polyester non-woven woven fibreglass lamin.pdf
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