标准规范-国际标准-IEC

IEC 61196-1-1-2007 Coaxial communication cables - Part 1-1 Capability approval for coaxial communication cables《同轴通信电缆.第1-1部分 同轴通信电缆的能力鉴定》.pdf
IEC 61195 Edition 2.1-2012 Double-capped fluorescent lamps - Safety specifications《双头荧光灯.安全性规格》.pdf
IEC 61194-1992 Characteristic parameters of stand-alone photovoltaic (PV) systems《独立光伏系统的特性参数》.pdf
IEC 61193-3-2013 Quality assessment systems - Part 3 Selection and use of sampling plans for printed boards and laminate end-products and in-process auditing《质量评定体系.第3部分 印刷电路板和层板制成品和过程产品检验用抽样方案的选.pdf
IEC 61193-2-2007 Quality assessment systems - Part 2 Selection and use of sampling plans for inspection of electronic components and packages《质量评估系统.第2部分 电子元件和包装件检验用抽样检验方法的选择和使用》.pdf
IEC 61193-1-2001 Quality assessment systems - Part 1 Registration and analysis of defects on printed board assemblies《质量评定系统 第1部分：印制版组装件缺陷的登记和分析》.pdf
IEC 61192-5-2007 Workmanship requirements for soldered electronic assemblies - Part 5 Rework modification and repair of soldered electronic assemblies《焊接电子组件的工艺要求.第5部分 焊接电子组件的再加工、改进和检修》.pdf
IEC 61192-4-2002 Workmanship requirements for soldered electronic assemblies - Part 4 Terminal assemblies《钎焊电子组件的工艺要求.第4部分 终端组件》.pdf
IEC 61192-3-2002 Workmanship requirements for soldered electronic assemblies - Part 3 Through-hole mount assemblies《钎焊电子组件的工艺要求.第3部分 通孔安装组件》.pdf
IEC 61192-2-2003 Workmanship requirements for soldered electronic assemblies - Part 2 Surface-mounted assemblies《钎焊电子组件的工艺要求.第2部分 表面安装组件》.pdf
IEC 61192-1-2003 Workmanship requirements for soldered electronic assemblies - Part 1 General《钎焊电子组件的工艺要求.第1部分 总则》.pdf
IEC 61191-6-2010 Printed board assemblies - Part 6 Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method《印刷电路板组件.第6部分 球栅阵列和网格阵列的焊接接头内空隙及测量方法用评定标准》.pdf
IEC 61191-4-2017 Printed board assemblies - Part 4 Sectional specification - Requirements for terminal soldered assemblies《印刷电路板组件 第4部分 分规范 端点焊接组件的要求》.pdf
IEC 61191-3-2017 Printed board assemblies - Part 3 Sectional specification - Requirements for through-hole mount soldered assemblies《印刷电路板组件 第3部分 分规范 通孔安装焊接组件的要求》.pdf
IEC 61191-2-2017 Printed board assemblies - Part 2 Sectional specification - Requirements for surface mount soldered assemblies《印刷电路板组件 第2部分 分规范 表面安装焊接组件的要求》.pdf
IEC 61189-5-4-2015 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 5-3 General test methods for materials and assemb.pdf
IEC 61189-5-3-2015 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 5-3 General test methods for materials and assemb.pdf
IEC 61189-5-2006 Test methods for electrical materials interconnection structures and assemblies - Part 5 Test methods for printed board assemblies《电气材料、互连结构和组件的试验方法.第5部分 印制电路板组件的试验方法》.pdf
IEC 61189-5-2-2015 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 5-2 General test methods materials and assemblies.pdf
IEC 61189-5-1-2016 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 5-1 General test methods for materials and assemb.pdf
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