1、 INTERNATIONAL STANDARD IEC60747-1Second edition2006-02Semiconductor devices Part 1: General Reference number IEC 60747-1:2006(E) Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,
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8、iec.ch Tel: +41 22 919 02 11 Fax: +41 22 919 03 00 Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-INTERNATIONAL STANDARD IEC60747-1Second edition2006-02Semiconductor devices
9、Part 1: General IEC 2006 Copyright - all rights reserved No part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Commission,
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11、onal Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- 2 60747-1 IEC:2006(E) CONTENTS FOREWORD.4 1 Scope.6 2 Normative references .6 3 Terms and definitions .6 3.1 Device structure 6 3.2 Elements and
12、circuits 7 3.3 Thermal characteristics .8 3.4 Noise 9 3.5 Conversion loss.9 3.6 Stability of characteristics10 4 Letter symbols10 4.1 General .10 4.2 Letter symbols for currents, voltages and powers 11 4.3 Letter symbols for signal ratios expressed in dB13 4.4 Letter symbols for other electrical pro
13、perties .14 4.5 Letter symbols for other properties 15 4.6 Presentation of limit values .17 5 Essential ratings and characteristics.18 5.1 General .18 5.2 Relationship between conditions of use, ratings and characteristics 18 5.3 Standard format for the presentation of published data19 5.4 Type iden
14、tification .19 5.5 Terminal and polarity identification 19 5.6 Electrical ratings and characteristics .20 5.7 Cooling conditions.20 5.8 Recommended temperatures.21 5.9 Recommended voltages and currents21 5.10 Mechanical ratings (limiting values).21 5.11 Mechanical characteristics 22 5.12 Multiple de
15、vices having a common encapsulation22 6 Measuring methods 23 6.1 General .23 6.2 Alternative methods of measurement.23 6.3 Measurement accuracy .24 6.4 Protection of devices and measuring equipment24 6.5 Thermal conditions for measuring methods .24 6.6 Accuracy of measuring circuits 25 7 Acceptance
16、and reliability of discrete devices.27 7.1 General .27 7.2 Electrical endurance tests .27 8 Electrostatic-sensitive devices31 8.1 Label and symbol 31 8.2 Test methods for semiconductor devices sensitive to voltage pulses of short duration.32 Copyright International Electrotechnical Commission Provid
17、ed by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-60747-1 IEC:2006(E) 3 9 Product discontinuance notification 32 9.1 Definitions .32 9.2 General aspects for discontinuation.33 9.3 Information for the discontinuance notification.33 9.4
18、Notification 33 9.5 Retention 34 Annex A (informative) Presentation of IEC 60747 and IEC 60748 35 Annex B (informative) Clause cross-references from the previous edition of IEC 60747-139 Bibliography Figure 1 Example of the application of the rules to a periodic current.11 Figure 2 Derating curve .2
19、8 Figure 3 Symbol to be used for the electrostatic sensitive devices that require special handling31 Table 1 Presentation of limit values with the two conventions 18 Table 2 Failure rate operating conditions .29 Copyright International Electrotechnical Commission Provided by IHS under license with I
20、ECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- 4 60747-1 IEC:2006(E) INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES Part 1: General FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardizatio
21、n comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes Internationa
22、l Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in thi
23、s preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two
24、organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the
25、form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpr
26、etation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or
27、 regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of thi
28、s publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or ind
29、irect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for t
30、he correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60747-1 has been pre
31、pared by IEC technical committee 47: Semiconductor devices. This second edition of IEC 60747-1 cancels and replaces the first edition (1983) and its amendments 1 (1991), 2 (1993) and 3 (1996). The main changes with respect to the previous edition are listed below. a) The terminology which is now giv
32、en in the IEV (or which was in conflict with the IEV) has been omitted. b) There has been a general revision of guidance on essential ratings and characteristics. c) The distinction between general and reference methods of measurement has been removed. d) A clause on product discontinuation notice h
33、as been added. Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-60747-1 IEC:2006(E) 5 The text of this standard is based on the following documents: FDIS Report on voting 47/18
34、41/FDIS 47/1848/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. The list of all parts of IEC 60747 series, under the general ti
35、tle Semiconductor devices, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this dat
36、e, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking p
37、ermitted without license from IHS-,-,- 6 60747-1 IEC:2006(E) SEMICONDUCTOR DEVICES Part 1: General 1 Scope This part of IEC 60747 gives the general requirements applicable to the discrete semiconductor devices and integrated circuits covered by the other parts of IEC 60747 and IEC 60748 (see Annex A
38、). 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60027 (all parts),
39、Letter symbols to be used in electrical technology IEC 60050-521, International Electrotechnical Vocabulary (IEV) Part 521: Semiconductor devices and integrated circuits IEC 60050-702, International Electrotechnical Vocabulary (IEV) Part 702: Oscillations, signals and related devices IEC 60068 (all
40、parts), Environmental testing IEC 60191-2, Mechanical standardization of semiconductor devices Part 2: Dimensions IEC 60747 (all parts), Semiconductor devices IEC 60748 (all parts), Semiconductor devices Integrated circuits IEC 60749-26, Semiconductor devices Mechanical and climatic test methods Par
41、t 26: Electrostatic discharge (ESD) sensitivity testing Human body model (HBM) IEC 61340 (all parts), Electrostatics QC 001002 (all parts), IEC Quality Assessment Systems for Electronic Components (IECQ) Rules of procedure ISO 9000, Quality management systems Fundamentals and vocabulary 3 Terms and
42、definitions For the purposes of this document, the terms and definitions given in IEC 60050-521 and IEC 60050-702, as well as the following, apply. 3.1 Device structure 3.1.1 pad area on a chip (die) to which a connection to the chip (die) can be made Copyright International Electrotechnical Commiss
43、ion Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-60747-1 IEC:2006(E) 7 3.1.2 bonding wire wire that is bonded to a chip (die) bonding pad in order to connect the chip (die) to any other point within the device package 3.1.3
44、base (of a package) part of the package on which a chip (die) can be mounted 3.1.4 cap, can, lid, plug part of a cavity package that completes its enclosure NOTE The particular term used depends on the package design. 3.1.5 anode terminal (of a semiconductor diode, excluding current-regulator diodes
45、) terminal connected to the P-type region of the PN junction or, when more than one PN junction is connected in series with the same polarity, to the extreme P-type region NOTE For voltage-reference diodes; if temperature-compensating diodes are included, these are ignored in the determination of th
46、e anode terminal. 3.1.6 cathode terminal (of a semiconductor diode, excluding current-regulator diodes) terminal connected to the N-type region of the PN junction or, when more than one PN junction is connected in series with the same polarity, to the extreme N-type region NOTE For voltage-reference
47、 diodes; if temperature-compensating diodes are included, these are ignored in the determination of the cathode terminal. 3.1.7 anode terminal (of a current-regulator diode) terminal to which current flows from the external circuit when the diode is biased to operate as a current regulator 3.1.8 cat
48、hode terminal (of a current-regulator diode) terminal from which current flows into the external circuit when the diode is biased to operate as a current regulator 3.2 Elements and circuits 3.2.1 passive circuit element circuit element primarily contributing resistance, capacitance, inductance, ohmic inter-connection, wave-guiding, or a combination of these, to a circuit function NOTE For example, resistors, capacitors, inductors, passive filters, interconnections. 3.2.2 active circuit element circuit element that con
