1、 IEC 61188-7 Edition 2.0 2017-04 INTERNATIONAL STANDARD Printed boards and printed board assemblies Design and use Part 7: Electronic component zero orientation for CAD library construction IEC 61188-7:2017-04(en) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2017 IEC, Geneva, Swit
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11、art 7: Electronic component zero orientation for CAD library construction INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.180 ISBN 978-2-8322-4165-3 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distrib
12、utor. colour inside 2 IEC 61188-7:2017 IEC 2017 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope 6 2 Normative references 6 3 Terms and definitions 6 4 Basic rules 6 4.1 Common rules. 6 4.2 General basic rules . 6 4.3 Level A basic rule . 7 4.4 Level B basic rule . 7 4.5 File description definition 7
13、4.6 Component orientations 8 5 Origin point of land pattern 18 5.1 General . 18 5.2 Surface mount components . 18 5.3 Through-hole leaded components . 19 6 Land pattern to footprint comparison . 19 7 Components with one terminal . 20 7.1 Surface mount components . 20 7.2 Through-hole leaded componen
14、ts . 20 Figure 1 Example of level A orientation concepts . 8 Figure 2 Connector and switch library symbol examples 19 Figure 3 Through-hole components with terminal point of origin orientation . 19 Figure 4 Circular or square one-terminal component 20 Figure 5 Rectangular or oval one-terminal compon
15、ent . 20 Figure 6 Surface mount components with one lead offset . 20 Table 1 Discrete component land pattern conventions . 9 Table 2 Diode and transistor land pattern conventions . 10 Table 3 Transistor and IC land pattern conventions . 11 Table 4 Integrated circuit packages land pattern conventions
16、 12 Table 5 Integrated circuit packages land pattern conventions 14 Table 6 BGA land pattern conventions . 15 Table 7 Resistor array and connector land pattern conventions 16 Table 8 Level A land pattern convention summary . 17 Table 9 Level B land pattern convention summary . 18 IEC 61188-7:2017 IE
17、C 2017 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES DESIGN AND USE Part 7: Electronic component zero orientation for CAD library construction FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization c
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26、es for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to th
27、e Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held
28、 responsible for identifying any or all such patent rights. International Standard IEC 61188-7 has been prepared by IEC technical committee 91: Electronics assembly technology. This second edition cancels and replaces the first edition published in 2009. This edition constitutes a technical revision
29、. This edition includes the following significant technical changes with respect to the previous edition: a) Figure 1 has been corrected; b) the term “rectangle” has generally been replaced by “polygon”; c) level B has been indicated as preferred level for new libraries. 4 IEC 61188-7:2017 IEC 2017
30、The text of this International Standard is based on the following documents: CDV Report on voting 91/1382/CDV 91/1428/RVC Full information on the voting for the approval of this International Standard can be found in the report on voting indicated in the above table. This document has been drafted i
31、n accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 61188 series, under the general title Printed boards and printed board assemblies Design and use, can be found on the IEC website. The committee has decided that the contents of this document will remain unchanged until
32、 the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific document. At this date, the document will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. IM
33、PORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. IEC 61188-7:2017 IEC 2017 5 INTRODUCTION One of
34、the factors of establishing a CAD library component description and land pattern standard is to adopt a fixed zero component orientation so that all CAD images are built with the same rotation for the purpose of assembly machine automation. The land pattern standards clearly define all the propertie
35、s necessary for standardization and acceptability of a one world CAD library. The main objective in defining a one world CAD library is to achieve the highest level of electronic product development automation. This encompasses all the processes involved from engineering to PCB layout to fabrication
36、, assembly and test. The data format standards need this type of consistency in order to meet the efficiency that electronic data transfer can bring to the industry. Many large firms have spent millions of dollars creating and implementing their own unique standards for their own electronic product
37、development automation. These standards are proprietary to each firm and are not openly shared with the rest of the industry. This has resulted in massive duplication of effort, costing the industry millions of man hours in waste and creating industry chaos and global non-standardization. The main p
38、urpose of creating the land pattern standards is to achieve reliable solder joint formation platforms; the reason for developing the data transfer structure is to improve the efficiency with which engineering intelligence is converted into manufacturing reality. Even if the neutral CAD format can dr
39、ive all the manufacturing machines, it would be meaningless unless the component description standard for CAD land patterns were implemented with some consistency. Zero component orientation has a key role in machine automation. The obvious choice for global standardization for EE hardware engineeri
40、ng, PCB design layout, manufacturing, assembly and testing processes is to incorporate the standard land pattern conventions. Any other option continues the confusion and additional manual hours of intervention in order to achieve the goals of automation. In addition, the ease of having one system e
41、xport a file so that another system can accomplish the work can require unnecessary manipulation of the neutral format in order to meet the object of clear, unambiguous software code. The design of any assembly will continue to permit arrangement and orientation of components at any orientation cons
42、istent with design standards. Starting from a commonly understood data capture concept will benefit the entire supply chain. This standard defines angle and origin point of land patterns for land pattern designing. 6 IEC 61188-7:2017 IEC 2017 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES DESIGN AND US
43、E Part 7: Electronic component zero orientation for CAD library construction 1 Scope This part of IEC 61188 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries. This facilitates and encourages a common data capture and transfe
44、r methodology amongst and between global trading partners. 2 Normative references The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated reference
45、s, the latest edition of the referenced document (including any amendments) applies. IEC 61188-5 (all parts), Printed boards and printed board assemblies Design and use Part 5-x: Attachment (land/joint) considerations 3 Terms and definitions No terms and definitions are listed in this document. ISO
46、and IEC maintain terminological databases for use in standardization at the following addresses: IEC Electropedia: available at http:/www.electropedia.org/ ISO Online browsing platform: available at http:/www.iso.org/obp 4 Basic rules 4.1 Common rules Common rules are divided into two groups: level
47、A and level B. The main difference between the rules is the original orientation within the CAD system library. This orientation may be any version that the designer finds useful including his own version; however, when the information is transferred to an assembler, the orientation shall be properl
48、y defined without ambiguity or shall be corrected in order that any variation between the different systems are properly matched. This conversion of the CAD data to manufacturing information may include the datum of the board, fabrication panel or assembly array panel and shall have the proper orien
49、tation of all components on the board no matter what library was used as the original input. 4.2 General basic rules The following basic rules apply. Components and land patterns are drawn in top view. The component point of origin is shown by “+“ or “x“. IEC 61188-7:2017 IEC 2017 7 The origin point of land patterns may be different from the origin point of the placement. A polygon that contains the component body and land patterns (in top view) should be
