1、 IEC 60191-6-16 Edition 1.0 2007-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA Normalisation mcanique des dispositifs semiconducteurs Partie 6-16: Glossaire
2、 des supports de test et de dverminage pour les BGA, LGA, FBGA et FLGA IEC 60191-6-16:2007 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any
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16、estions contactez-nous: csciec.ch. IEC 60191-6-16 Edition 1.0 2007-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA Normalisation mcanique des dispositifs semi
17、conducteurs Partie 6-16: Glossaire des supports de test et de dverminage pour les BGA, LGA, FBGA et FLGA INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE L ICS 31.080.01 PRICE CODE CODE PRIX ISBN 978-2-83220-233-3 Registered trademark of the International Electrot
18、echnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 60191-6-16 IEC:2007 INTERNATIONAL
19、 ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all
20、 national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Tec
21、hnical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory wo
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26、cation shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication.
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28、osts (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct appl
29、ication of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60191-6-16 has been prepared by sub
30、committee 47D: Mechanical standardization of semiconductor devices, of IEC technical committee 47: Semiconductor devices. This bilingual version (2012-07) corresponds to the monolingual English version, published in 2007-04. The text of this standard is based on the following documents: FDIS Report
31、on voting 47D/679/FDIS 47D/683/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The French version of this standard has not been voted upon. This publication has been drafted in accordance with the ISO/IEC Directi
32、ve, Part 2. 60191-6-16 IEC:2007 3 A list of all the parts of the IEC 60191 series, under the general title Mechanical standardization of semiconductor devices, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance
33、 result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 4 60191-6-16 IEC:2007 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
34、 Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA 1 Scope This part of IEC 60191 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-i
35、n sockets for BGA, LGA, FBGA and FLGA. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendmen
36、ts) applies. IEC 60191-1:1966, Mechanical standardization of semiconductor devices Part 1: Preparation of outline drawings of semiconductor devices IEC 60191-2:1966, Mechanical standardization of semiconductor devices Part 2: Dimensions IEC 60191-3:1999, Mechanical standardization of semiconductor d
37、evices Part 3: General rules for the preparation of outline drawings of integrated circuits IEC 60191-4:1999, Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor devices 3 Terms and definitions For the purposes
38、 of this document, the following terms and definitions apply. NOTE 1 Long terms are indicated in two lines. NOTE 2 A symbol indicates the dimensional symbol in drawing. NOTE 3 A dash (-) in the columns of “Drawing part” and “Symbol” indicates no correspondence to symbols or drawing parts. 60191-6-16
39、 IEC:2007 5 3.1 General Table 1 General No. Term Definition Symbol Drawing part 101 IC socket connector to electrically connect and mechanically hold IC package - - 102 production socket socket used in the production of PCB assemblies for electrical equipment to facilitate package replacement - - 10
40、3 test and burn-in socket socket mainly used for electrical characteristics test, burn-in and reliability test of package with its production process. Designed for reliable contact, durable actuation and high environmental operating temperature - - 104 clamshell type socket socket having a style tha
41、t surrounds the package with hinged base and lid - Figure 1 105 open-top type socket socket having a style to load/unload package from the top opening of socket by pressing down the cover mechanism - Figure 2 3.2 Clamshell type Table 2 Clamshell type No. Term Definition Symbol Drawing part 201 base
42、base part to hold contacts and other socket parts and to be assembled on PCB - Figure 1(1) 202 lid part making a pair with base whose function is to hold the package - Figure 1(2) 203 latch latch to fix the cover with base at closed position - Figure 1(3) 204 hinge hinge to join base and lid - Figur
43、e 1(4) 205 alignment plate supporting part to align terminals with through holes on PCB for ease of socket terminal insertion - Figure 1(5) 206 alignment pin pin mounted on socket to define relative position of socket with PCB - Figure 1(6) 207 contact electrically connecting part of socket consisti
44、ng of contact point with package lead and terminal portion to be soldered on PCB - Figure 1(7) 208 contact point section of the contact making connection with package - Figure 1,(8) 209 terminal electrical connector protruding from socket base in order to solder on PCB. Part of the contact - Figure
45、1(9) 210 platform part to hold package - Figure 1(10) 211 pusher part to hold package and to maintain stable contact of package leads with socket contacts - Figure 1(11) 212 package guide guide for package established in socket to align package leads with socket contact - Figure 1(12) 213 mounting f
46、lange flange to mount socket on PCB - Figure 1(13) 214 socket width socket width excluding mounting flange W Figure 1 215 maximum socket width maximum socket width including mounting flange W 1Figure 1 216 socket length socket length excluding protrusion of the latch at its closed position L Figure
47、1 217 maximum socket length maximum socket length including protrusion of the latch at its closed position L 1Figure 1 218 latch moving distance distance of the latch movement beyond socket length L 3Figure 1 6 60191-6-16 IEC:2007 Table 2 Clamshell type (continued) No. Term Definition Symbol Drawing
48、 part 219 socket height distance from socket mounting plane to the lid top surface at its closed position A Figure 1 220 maximum socket height distance from socket mounting plane to the lid top surface including protruded section with its closed position A 4Figure 1 221 maximum height with opened li
49、d maximum socket height from its mounting plane with the lid at fully open position including protrusions A 5Figure 1 222 lid open angle angle of the lid at fully open position Figure 1 223 base width width of socket base W 2Figure 1 224 base length length of socket base L 2Figure 1 225 seating plane height height from socket mounting surface to the platform top surface A 2Figure 1 226 terminal length length from socket mounting pla
