1、 IEC 61188-5-3 Edition 1.0 2007-10 INTERNATIONAL STANDARD NORME INTERNATIONALE Printed boards and printed board assemblies Design and use Part 5-3: Attachment (land/joint) considerations Components with gull-wing leads on two sides Cartes imprimes et cartes imprimes quipes Conception et utilisation
2、Partie 5-3: Considrations sur les liaisons pistes-soudures Composants sorties en aile de mouette sur deux cts IEC 61188-5-3:2007 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reprodu
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17、oards and printed board assemblies Design and use Part 5-3: Attachment (land/joint) considerations Components with gull-wing leads on two sides Cartes imprimes et cartes imprimes quipes Conception et utilisation Partie 5-3: Considrations sur les liaisons pistes-soudures Composants sorties en aile de
18、 mouette sur deux cts INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE U ICS 31.180 PRICE CODE CODE PRIX ISBN 2-8318-1060-5 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale 2 61188-
19、5-3 IEC:2007 CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references .7 3 General information7 3.1 General component description .7 3.2 Marking .7 3.3 Carrier packaging format.7 3.4 Process considerations .7 4 TSOP (Type 1) .8 4.1 Field of application 8 4.2 Component description8 4.3 Com
20、ponent dimensions .8 4.4 Solder joint fillet design .9 4.5 Land pattern dimensions .11 5 TSOP (Type 2) .13 5.1 Field of application 13 5.2 Component description13 5.3 Component dimensions .13 5.4 Solder joint fillet design .14 5.5 Land pattern dimensions .16 6 SOP .18 6.1 Field of application 18 6.2
21、 Component description18 6.3 Component dimensions .18 6.4 Solder joint fillet design .19 6.5 Land pattern dimensions .21 7 SSOP .23 7.1 Field of application 23 7.2 Component description23 7.3 Component dimensions .24 7.4 Solder joint fillet design .24 7.5 Land pattern dimensions .26 Bibliography29 F
22、igure 1 TSOP (Type 1) construction.8 Figure 2 TSOP (Type 1) Component dimensions.9 Figure 3 Solder joint fillet design (see IEC 61188-5-1, Tables 2 and 3) 11 Figure 4 TSOP (Type 1) Land pattern dimensions.13 Figure 5 TSOP (Type 2) construction.13 Figure 6 TSOP (Type 2) Component dimensions.14 Figure
23、 7 Solder joint fillet design (see IEC 61188-5-1, Tables 2 and 3) 16 Figure 8 TSOP (Type 2) Land pattern dimensions.18 Figure 9 SOPIC construction18 Figure 10 SOP component dimensions 19 61188-5-3 IEC:2007 3 Figure 11 Solder joint fillet design (see IEC 61188-5-1, Table 2)21 Figure 12 SOP Land patte
24、rn dimensions23 Figure 13 SSOP construction.23 Figure 14 Component dimensions24 Figure 15 Solder joint fillet design (see IEC 61188-5-1, Table 2)26 Figure 16 Land pattern dimensions 28 4 61188-5-3 IEC:2007 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES DESIGN
25、 AND USE Part 5-3: Attachment (land/joint) considerations Components with gull-wing leads on two sides FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The ob
26、ject of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specificat
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34、, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility t
35、hat some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61188-5-3 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of th
36、is standard is based on the following documents: FDIS Report on voting 91/702/FDIS 91/734/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This bilingual version, published in 2009-09, corresponds to the English v
37、ersion. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 61188-5-3 IEC:2007 5 IEC 61188-5-3 is to be read in conjunction with IEC 61188-5-1. The French version of this standard has not been voted upon. A list of all parts of the IEC 61188 series, under the general
38、 title Printed boards and printed board assemblies Design and use, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related
39、to the specific publication. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. 6 61188-5-3 IEC:2007 INTRODUCTION This part of IEC 61188 covers land patterns for components with gull-wing leads on two sides. Each clause contains information in ac
40、cordance with the following format: The proposed land pattern dimensions in this standard are based upon the fundamental tolerance calculation combined with the given land protrusions and courtyard excesses (see IEC 61188-5-1, Generic requirements). The courtyard includes all issues of the normal ma
41、nufacturing necessities. The unaltered land pattern dimensions of this part are generally applicable for the solder paste application plus reflow soldering process. For application of the wave soldering process, the land pattern dimensions normally have to be modified. Orientation parallel to the wa
42、ve direction is preferable and special, suitably dimensioned solder thieves should be added. This standard offers a threefold land pattern dimensioning (levels 1, 2, and 3) on the basis of a threefold set of land protrusions and courtyard excesses: maximum (max.); median (mdn) and minimum (min.). Ea
43、ch land pattern has been assigned an identification number to indicate the characteristics of the specific robustness of the land patterns. Users also have the opportunity to organize the information so that it is most useful for their particular design. If a user has good reason to use a concept di
44、fferent from that of IEC 61188-5-1 or if the user prefers unusual land protrusions, this standard should be used for checking the resulting solder fillet size. It is the responsibility of the user to verify the SMD land patterns used for achieving an undisturbed mounting process including testing an
45、d an ensured reliability for the product stress conditions in use. Component dimensions listed in this standard are those available on the market and regarded as for reference only. 61188-5-3 IEC:2007 7 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES DESIGN AND USE Part 5-3: Attachment (land/joint) cons
46、iderations Components with gull-wing leads on two sides 1 Scope This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropri
47、ate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, p
48、roviding information on the component, the component dimensions, the solder joint design, and the land pattern dimensions. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undat
49、ed references, the latest edition of the referenced document (including any amendments) applies. IEC 61188-5-1:2002, Printed boards and printed board assemblies Design and use Part 5- 1: Attachment (land/joint) considerations Generic requirements 3 General information 3.1 General component description The acronyms TSOP (thin small outline pack
