IEC 61915-1-2007 Low-voltage switchgear and controlgear - Device profiles for networked industrial devices - Part 1 General rules for the development of device .pdf

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1、 IEC 61915-1Edition 1.0 2007-11INTERNATIONAL STANDARD NORME INTERNATIONALELow-voltage switchgear and controlgear Device profiles for networked industrial devices Part 1: General rules for the development of device profiles Appareillage basse tension Profils dappareil pour les appareils industriels m

2、is en rseau Partie 1: Rgles gnrales pour le dveloppement de profils dappareil IEC61915-1:2007 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by a

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4、ation, please contact the address below or your local IEC member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique o

5、u mcanique, y compris la photocopie et les microfilms, sans laccord crit de la CEI ou du Comit national de la CEI du pays du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou

6、contactez le Comit national de la CEI de votre pays de rsidence. IEC Central Office 3, rue de Varemb CH-1211 Geneva 20 Switzerland Email: inmailiec.ch Web: www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes Inte

7、rnational Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. Catalogue

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15、ent plus de 20 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans les langues additionnelles. Egalement appel Vocabulaire Electrotechnique International en ligne. Service Clients: www.iec.ch/webstore/custserv/custserv_entry-f.htm Si vous dsirez nous donner des co

16、mmentaires sur cette publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 61915-1Edition 1.0 2007-11INTERNATIONAL STANDARD NORME INTERNATIONALELow-voltage switchgear and controlgear Device pro

17、files for networked industrial devices Part 1: General rules for the development of device profiles Appareillage basse tension Profils dappareil pour les appareils industriels mis en rseau Partie 1: Rgles gnrales pour le dveloppement de profils dappareil INTERNATIONAL ELECTROTECHNICAL COMMISSION COM

18、MISSION ELECTROTECHNIQUE INTERNATIONALE XDICS 29.130.20 PRICE CODECODE PRIXISBN 2-8318-9394-1 2 61915-1 IEC:2007 CONTENTS FOREWORD.6 INTRODUCTION.8 1 Scope.9 2 Normative references .9 3 Definitions, abbreviations and symbols.10 3.1 Terms and definitions 10 3.2 Abbreviations and symbols12 4 Device pr

19、ofiles .12 4.1 General .12 4.2 Root device profile 13 4.3 Manufacturers device profile.13 4.3.1 General .13 4.3.2 Manufacturers device profile created using a root device profile .14 4.3.3 Manufacturers device profile created without using a root device profile14 4.4 Profile relationships.15 5 Creat

20、ing a root device profile using the device profile template 15 5.1 General .15 5.2 Root device profile header.16 5.2.1 General .16 5.2.2 Root device profile ID 16 5.2.3 Root device profile version 16 5.2.4 Root device profile release date 17 5.2.5 Device description .17 5.3 Parameters (root device p

21、rofile) 17 5.3.1 General .17 5.3.2 Parameter name (mandatory) 17 5.3.3 Data type (mandatory) .17 5.3.4 Units (mandatory)18 5.3.5 Offset and multiplier (mandatory).18 5.3.6 Range (mandatory)19 5.3.7 Access (mandatory).19 5.3.8 Required (mandatory)19 5.3.9 Parameter description (optional)20 5.3.10 Rec

22、ommended parameters for device identification .20 5.4 Complex data types (root device profile)21 5.4.1 General .21 5.4.2 Array data type21 5.4.3 Structured data type 22 5.4.4 Enumerated data type .24 5.5 Parameter assemblies (root device profile)25 5.5.1 General .25 5.5.2 Parameter assembly name (ma

23、ndatory).26 5.5.3 Access (mandatory).26 5.5.4 Required (mandatory)26 61915-1 IEC:2007 3 5.5.5 Parameter assembly data (mandatory) 26 5.6 Parameter groups (root device profile) 27 5.6.1 General .27 5.6.2 Group name (mandatory).28 5.6.3 Group type (mandatory).28 5.6.4 Number of members (mandatory) 28

24、5.6.5 Required (mandatory)28 5.6.6 Description (optional) 28 5.6.7 Additional information (optional) 28 5.6.8 Member names (mandatory) 28 5.7 Functional elements (root device profile) .28 5.7.1 General .28 5.7.2 Functional structure diagram (optional)30 5.7.3 Functional element list (optional) .31 5

25、.8 State model (root device profile)31 5.8.1 General .31 5.8.2 State model name .31 5.8.3 State chart diagrams .32 5.8.4 State transition tables33 5.9 Services (root device profile).36 5.9.1 General .36 5.9.2 Service name (mandatory).36 5.9.3 Request parameter group (optional) 36 5.9.4 Response para

26、meter group (optional)36 5.9.5 Required (mandatory)36 5.9.6 Description (optional) 36 5.9.7 Additional information (optional) 36 6 Creating a manufacturers device profile using a root device profile37 6.1 General .37 6.2 Manufacturers device profile header.37 6.2.1 General .37 6.2.2 Manufacturers de

27、vice profile ID (mandatory).37 6.2.3 Manufacturers device profile description (optional) .37 6.2.4 Manufacturers device profile version (mandatory).38 6.2.5 Manufacturers device profile release date (mandatory) .38 6.2.6 Manufacturer ID (mandatory).38 6.2.7 Model compatibility (optional) 38 6.2.8 So

28、ftware compatibility (optional)38 6.2.9 Hardware compatibility (optional).38 6.2.10 Profile type (mandatory) 38 6.2.11 Profile availability (mandatory) 39 6.2.12 Additional information (optional) 39 6.3 Implementation of root device profile parameters 39 6.4 Parameters (manufacturer-specific).39 6.5

29、 Implementation of root device profile complex data types 40 6.6 Complex data types (manufacturer-specific) 40 6.7 Implementation of root device profile parameter assemblies40 6.8 Parameter assemblies (manufacturer-specific) 41 6.9 Implementation of root device profile parameter groups.41 4 61915-1

30、IEC:2007 6.10 Parameter groups (manufacturer-specific).42 6.11 Implementation of root device profile functional elements42 6.12 Functional elements (manufacturer-specific) .43 6.13 State model (manufacturer-specific) 43 6.14 Implementation of root device profile services .43 6.15 Services (manufactu

31、rer-specific) .44 7 Creating a manufacturers device profile without using a root device profile44 7.1 General .44 7.2 Manufacturers device profile header.45 7.2.1 General .45 7.2.2 Manufacturers device profile ID (mandatory).45 7.2.3 Manufacturers device profile description (optional) .45 7.2.4 Manu

32、facturers device profile version (mandatory).45 7.2.5 Manufacturers device profile release date (mandatory) .45 7.2.6 Manufacturer ID (mandatory).45 7.2.7 Model compatibility (optional) 45 7.2.8 Software compatibility (optional)45 7.2.9 Hardware compatibility (optional).45 7.2.10 Profile type (optio

33、nal) 45 7.2.11 Profile availability (optional).45 7.2.12 Additional information (optional) 45 7.3 Root device profile header.46 7.3.1 Root device profile ID 46 7.3.2 Root device profile version 46 7.3.3 Root device profile release date 46 7.3.4 Device description (optional) .46 7.4 Parameters (root

34、device profile) 46 7.5 Parameters (manufacturer-specific).46 7.6 Complex data types (root device profile)46 7.7 Complex data types (manufacturer-specific) 46 7.8 Parameter assemblies (root device profile)46 7.9 Parameter assemblies (manufacturer-specific) 46 7.10 Parameter groups (root device profil

35、e) 46 7.11 Parameter groups (manufacturer-specific).46 7.12 Functional elements (root device profile) .46 7.13 Functional elements (manufacturer-specific) .46 7.14 State model (root device profile)47 7.15 State model (manufacturer-specific) 47 7.16 Services (root device profile).47 7.17 Services (ma

36、nufacturer-specific) .47 Annex A (normative) Device profile template48 Annex B (informative) Device profile examples 55 Annex C (informative) Profile creation guidelines .78 Annex D (informative) Profile exchange language79 Annex E (informative) Categories of parameters 91 Bibliography93 61915-1 IEC

37、:2007 5 Figure 1 Relationship between IEC 61915-1 and device profiles 15 Figure 2 Array data type example 21 Figure 3 Structured data type example.22 Figure 4 Enumerated data type examples 24 Figure 5 Example description format (1).27 Figure 6 Example description format (2).27 Figure 7 Example descr

38、iption format (3).27 Figure 8 Example device structure .29 Figure 9 Combination motor starter example30 Figure 10 Example of a state chart diagram for a photoelectric switch .32 Figure 11 Example of a state chart diagram for a motor starter 33 Figure 12 State transition table for the photoelectric s

39、witch example34 Figure 13 State transition table for the motor starter example 35 Figure A.1 Device profile template .54 Figure B.1 Example of a root device profile Photoelectric switch.59 Figure B.2 Example of a root device profile Motor starter 69 Figure B.3 Example of a generic device profile cre

40、ated using a root device profile.73 Figure B.4 Example of a specific device profile created without using a root device profile .77 Figure C.1 Simple proximity switch parameter assembly 78 Figure C.2 Diagnostic proximity switch parameter assembly 78 Figure D.1 Overview of an ISO 15745 device profile

41、 80 Figure D.2 Device profile schema structure90 Table 1 Valid simple data types .18 Table A.1 Contents of the “Required” field in a device profile .48 Table D.1 Mapping for a root device profile (ProfileHeader) .80 Table D.2 Example mapping for a root device profile (ProfileBody) 81 Table D.3 Corre

42、spondence with ISO 15745 for a manufacturers device profile81 Table D.4 Example mapping for a manufacturers device profile (ProfileBody) .82 6 61915-1 IEC:2007 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR DEVICE PROFILES FOR NETWORKED INDUSTRIAL DEVICES Part 1:

43、General rules for the development of device profiles FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operati

44、on on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “I

45、EC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this prepara

46、tion. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consens

47、us of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are

48、 made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications tra

49、nsparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to

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