IEC 60112 CORR1-2003 Method for the determination of the proof and the comparative tracking indices of solid insulating materials《固体绝缘材料的比较起痕指数和耐起痕指数的测定方法》.pdf

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IEC 60112 CORR1-2003 Method for the determination of the proof and the comparative tracking indices of solid insulating materials《固体绝缘材料的比较起痕指数和耐起痕指数的测定方法》.pdf_第1页
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1、CEI 60112(Quatrime edition - 2003)IEC 60112(Fourth edition - 2003)Juin 2003 - 1 - June 2003Mthode de dtermination des indicesde rsistance et de tenue au cheminementdes matriaux isolants solidesMethod for the determination of the proofand the comparative tracking indices ofsolid insulating materialsC

2、ORRIGENDUM 1Page 2SOMMAIREAu lieu de: Lire:Figure B.1 Figure 1Figure B.2 Figure 2Figure B.3 Figure 3Figure B.4 Figure 47.1 ElectrodesPage 14Premire alina, quatrime ligneAu lieu de : Figure B.1Lire : Figure 1Deuxime alina, troisime ligneAu lieu de : Figure B.2Lire : Figure 2Page 16Deuxime alina, prem

3、ire ligneAu lieu de : Figure B.3Lire : Figure 3Troisime alina, quatrime ligneAu lieu de : Figure B.3Lire : Figure 3Page 3CONTENTSInstead of: Read:Figure B.1 Figure 1Figure B.2 Figure 2Figure B.3 Figure 3Figure B.4 Figure 47.1 ElectrodesPage 15First paragraph, fourth lineInstead of: Figure B.1Read: F

4、igure 1Second paragraph, third lineInstead of: Figure B.2Read: Figure 2Page 17Second paragraph, first lineInstead of: Figure B.3Read : Figure 3Third paragraph, fourth lineInstead of: Figure B.3Read: Figure 3Copyright International Electrotechnical Commission Provided by IHS under license with IECNot

5、 for ResaleNo reproduction or networking permitted without license from IHS-,-,-CEI 60112(Quatrime edition - 2003)IEC 60112(Fourth edition - 2003)Juin 2003 - 2 - June 20037.2 Circuit dessaiPage 16Premier alina, cinquime ligneAu lieu de : Figure B.4Lire : Figure 4Deuxime alina, troisime ligneAu lieu

6、de : Figure B.4Lire : Figure 4Page 34Dplacer les Figures B.1 B.4 lire :Figures 1, 2, 3 et 4, avant lAnnexe A.(Note : Les figures sont normatives et ne font paspartie de lAnnexe B)FiguresAu lieu de : Figure B.1Lire : Figure 1Au lieu de : Figure B.2Lire : Figure 2Page 36FiguresAu lieu de : Figure B.3L

7、ire : Figure 3Au lieu de : Figure B.4Lire : Figure 47.2 Test circuitPage 17First paragraph, fifth lineInstead of: Figure B.4Read: Figure 4Second paragraph, third lineInstead of: Figure B.4Read: Figure 4Page 35Move Figures B.1 - B.4 read: Figures 1, 2,3 et 4, before Annex A.(Note: The figures are nor

8、mative and do not belongto Annex B)FiguresInstead of: Figure B.1Read: Figure 1Instead of: Figure B.2Read: Figure 2Page 37FiguresInstead of: Figure B.3Read: Figure 3Instead of: Figure B.4Read: Figure 4Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-

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