1、BSI Standards Publication Integrated circuits Measurement of electromagnetic emissions Part 3: Measurement of radiated emissions Surface scan method PD IEC/TS 61967-3:2014National foreword This Published Document is the UK implementation of IEC/TS 61967-3:2014. It supersedes DD IEC/TS 61967-3:2005 w
2、hich is withdrawn. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors. A list of organizations represented on this committee can be obtained on request to its secretary. This publication does not purport to include all the necessary provisions of a co
3、ntract. Users are responsible for its correct application. The British Standards Institution 2014. Published by BSI Standards Limited 2014 ISBN 978 0 580 78113 1 ICS 31.200 Compliance with a British Standard cannot confer immunity from legal obligations. This Published Document was published under t
4、he authority of the Standards Policy and Strategy Committee on 30 September 2014. Amendments/corrigenda issued since publication Date Text affected PUBLISHED DOCUMENT PD IEC/TS 61967-3:2014 IEC TS 61967-3 Edition 2.0 2014-08 TECHNICAL SPECIFICATION SPECIFICATION TECHNIQUE Integrated circuits Measure
5、ment of electromagnetic emissions Part 3: Measurement of radiated emissions Surface scan method Circuits intgrs Mesure des missions lectromagntiques Partie 3: Mesure des missions rayonnes Mthode de balayage en surface INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONA
6、LE W ICS 31.200 PRICE CODE CODE PRIX ISBN 978-2-8322-1809-9 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vo
7、us assurer que vous avez obtenu cette publication via un distributeur agr. colour inside PD IEC/TS 61967-3:2014CONTENTS FOREWORD. 5 INTRODUCTION . 7 1 Scope 8 2 Normative references 8 3 Terms, definitions and abbreviations 8 3.1 Terms and definitions 8 3.2 Abbreviations 9 4 General . 9 5 Test condit
8、ions 10 5.1 General . 10 5.2 Supply voltage 10 5.3 Frequency range . 10 6 Test equipment 10 6.1 General . 10 6.2 Shielding . 10 6.3 RF measuring instrument 10 6.4 Preamplifier 10 6.5 Cables 11 6.6 Near-field probe 11 6.6.1 General . 11 6.6.2 Magnetic (H) field probe . 11 6.6.3 Electric (E) field pro
9、be 11 6.6.4 Combined electric and magnetic (E/H) field probe . 11 6.6.5 Probe-positioning and data acquisition system 11 7 Test setup . 12 7.1 General . 12 7.2 Test configuration . 12 7.3 Test circuit board 14 7.4 Probe-positioning system software setup . 14 7.5 DUT software 14 8 Test procedure 14 8
10、.1 General . 14 8.2 Ambient conditions 14 8.3 Operational check . 14 8.4 Test technique 15 9 Test report 16 9.1 General . 16 9.2 Measurement conditions 16 9.3 Probe design and calibration . 16 9.4 Measurement data 16 9.5 Post-processing 17 9.6 Data exchange 17 Annex A (normative) Calibration of near
11、-field probes 18 A.1 General . 18 A.2 Test equipment . 20 A.2.1 General . 20 PD IEC/TS 61967-3:2014 IEC TS 61967-3:2014 IEC 2014 A.2.2 PCB with microstrip line . 20 A.3 Calibration setup . 21 A.4 Calibration procedure 22 Annex B (informative) Discrete electric and magnetic field probes 25 B.1 Genera
12、l . 25 B.2 Probe electrical description . 25 B.3 Probe physical description . 26 B.3.1 General . 26 B.3.2 Electric field probe . 26 B.3.3 Magnetic field probe . 26 Annex C (informative) Combined electric and magnetic field probe example 28 C.1 General . 28 C.2 Probe electrical description . 28 C.3 P
13、robe physical description . 29 C.4 Measurement and data acquisition system . 29 Annex D (informative) Coordinate systems . 31 D.1 General . 31 D.2 Cartesian coordinate system . 31 D.3 Cylindrical coordinate system 32 D.4 Spherical coordinate system 33 D.5 Coordinate system conversion . 33 Bibliograp
14、hy . 34 Figure 1 Example of probe-positioning system 12 Figure 2 One-input RF measurement setup 13 Figure 3 Two-input RF measurement setup with reference probe 13 Figure 4 Two-input RF measurement setup with reference signal 13 Figure 5 Examples of data overlaid on an image of the DUT (Contour chart
15、) . 16 Figure A.1 Typical probe factor against frequency 20 Figure A.2 Microstrip line for calibration (transverse cross-section) . 21 Figure A.3 Microstrip line for calibration (longitudinal cross-section) 21 Figure A.4 Probe calibration setup 22 Figure A.5 Scan direction across Microstrip line 22
16、Figure A.6 Typical plot of measured signal level and simulated field strength (H X ) 24 Figure A.7 Typical plot of measured signal level and simulated field strength (Hz) . 24 Figure B.1 Electric and magnetic field probe schematics . 25 Figure B.2 Example of electric field probe construction (E Z )
17、. 26 Figure B.3 Example of magnetic field probe construction (H Xor H Y ) . 27 Figure C 1 Electromagnetic field probe schematic . 28 Figure C.2 Electromagnetic field probe construction . 29 Figure C.3 Measurement and data acquisition system overview 30 Figure C.4 Measurement and data acquisition sys
18、tem detail . 30 Figure D.1 Right-hand Cartesian coordinate system (preferred) 31 Figure D.2 Left-hand Cartesian coordinate system 32 Figure D.3 Cylindrical coordinate system 32 Figure D.4 Spherical coordinate system . 33 PD IEC/TS 61967-3:2014 IEC TS 61967-3:2014 IEC 2014 Table A.1 Probe factor line
19、ar units . 19 Table A.2 Probe factor logarithmic units . 19 Table A.3 Dimensions for 50 microstrip . 21 Table D.1 Coordinate system conversion 33 PD IEC/TS 61967-3:2014 IEC TS 61967-3:2014 IEC 2014 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ INTEGRATED CIRCUITS MEASUREMENT OF ELECTROMAGNETIC EMISSIO
20、NS Part 3: Measurement of radiated emissions Surface scan method FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote internationa
21、l co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter refer
22、red to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in
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26、lications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity
27、. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication.
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29、osts (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct appl
30、ication of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical committees is to prepare Intern
31、ational Standards. In exceptional circumstances, a technical committee may propose the publication of a technical specification when the required support cannot be obtained for the publication of an International Standard, despite repeated efforts, or the subject is still under technical development
32、 or where, for any other reason, there is the future but no immediate possibility of an agreement on an International Standard. Technical specifications are subject to review within three years of publication to decide whether they can be transformed into International Standards. IEC 61967-3, which
33、is a technical specification, has been prepared by subcommittee 47A: Integrated circuits, of IEC technical committee 47: Semiconductor devices. PD IEC/TS 61967-3:2014 IEC TS 61967-3:2014 IEC 2014 This second edition cancels and replaces the first edition published in 2005. This edition constitutes a
34、 technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) Removal of: 9.4 Data analysis; Annex D Analysing the data from near-field surface scanning. b) Addition of: Introduction 9.4 Measurement data 9.5 Post-processing 9.6 Data e
35、xchange Annex D Coordinate systems c) Expansion of: 8.4 Test technique Annex A Calibration of near-field probes The text of this technical specification is based on the following documents: Enquiry draft Report on voting 47A/925/DTS 47A/937/RVC Full information on the voting for the approval of this
36、 technical specification can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 61967 series, published under the general title Integrated circuits Measurement of electroma
37、gnetic emissions, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication
38、 will be transformed into an International standard, reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its con
39、tents. Users should therefore print this document using a colour printer. PD IEC/TS 61967-3:2014 IEC TS 61967-3:2014 IEC 2014 INTRODUCTION Techniques for scanning near-fields radiated by integrated circuits and their surrounding environment can identify the areas of radiation, which may cause interf
40、erence to nearby devices. The ability to associate magnetic or electric field strengths with a particular location on a device can provide valuable information for improvement of an IC both in terms of functionality and EMC performance. Near-field scan techniques have considerably evolved over recen
41、t years. The improved sensitivity, bandwidth and spatial resolution of the probes offer analysis of integrated circuits operating into the gigahertz range. The ability to measure radiation both in the frequency and time domain allows not only analysis of fields generated by an IC, but also fields ge
42、nerated by externally applied disturbances propagating through the device. Post-processing can considerably enhance the resolution of a near-field scan measurement and the measured data can be shown in various ways, per users choice. PD IEC/TS 61967-3:2014 IEC TS 61967-3:2014 IEC 2014 INTEGRATED CIR
43、CUITS MEASUREMENT OF ELECTROMAGNETIC EMISSIONS Part 3: Measurement of radiated emissions Surface scan method 1 Scope This part of IEC 61967 provides a test procedure which defines an evaluation method for the near electric, magnetic or electromagnetic field components at or near the surface of an in
44、tegrated circuit (IC). This diagnostic procedure is intended for IC architectural analysis such as floor planning and power distribution optimization. This test procedure is applicable to measurements on an IC mounted on any circuit board that is accessible to the scanning probe. In some cases it is
45、 useful to scan not only the IC but also its environment. For comparison of surface scan emissions between different ICs, the standardized test board defined in IEC 61967-1 should be used. This measurement method provides a mapping of the electric or magnetic near-field emissions over the IC. The re
46、solution of the measurement is determined by the capability of the measurement probe and the precision of the probe-positioning system. This method is intended for use up to 6 GHz. Extending the upper limit of frequency is possible with existing probe technology but is beyond the scope of this speci
47、fication. Measurements may be carried out in the frequency domain or in the time domain. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. F
48、or undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60050(all parts), International Electrotechnical Vocabulary (available at ) IEC 61967-1, Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 1: General conditi
49、ons and definitions 3 Terms, definitions and abbreviations 3.1 Terms and definitions For the purpose of this document, the terms and definitions given in IEC 61967-1, IEC 60050-131 and IEC 60050-161, as well as the following apply. 3.1.1 altitude distance between the tip of the near-field probe and the reference plane of the scan (e.g. the PCB, the upper surface of the package) Note 1 to entry: The term “altitude” re
