1、BSI Standards Publication Device embedded substrate Part 2-4: Guidelines Test element groups (TEG) PD IEC/TS 62878-2-4:2015National foreword This Published Document is the UK implementation of IEC/TS 62878-2-4:2015. The UK participation in its preparation was entrusted to Technical Committee EPL/501
2、, Electronic Assembly Technology. A list of organizations represented on this committee can be obtained on request to its secretary. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Insti
3、tution 2015. Published by BSI Standards Limited 2015 ISBN 978 0 580 82121 9 ICS 31.180; 31.190 Compliance with a British Standard cannot confer immunity from legal obligations. This Published Document was published under the authority of the Standards Policy and Strategy Committee on 30 April 2015.
4、Amendments/corrigenda issued since publication Date Text affected PUBLISHED DOCUMENT PD IEC/TS 62878-2-4:2015 IEC TS 62878-2-4 Edition 1.0 2015-03 TECHNICAL SPECIFICATION SPECIFICATION TECHNIQUE Device embedded substrate Part 2-4: Guidelines Test element groups (TEG) Substrat avec appareil(s) intgr(
5、s) Partie 2-4: Directives Groupes dlments dessai (TEG) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 31.180; 31.190 ISBN 978-2-8322-2435-9 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique I
6、nternationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colour inside PD IEC/TS 62878-2-4:2015 2 IEC TS 62878-2-4:2015 IEC 2015 CONTENTS FOREWORD . 4 INTRODUCT
7、ION . 6 1 Scope 7 2 Normative references. 7 3 Terms, definitions and abbreviations 7 3.1 Terms and definitions 7 3.2 Abbreviations 7 4 Test conditions and sample preparation . 7 4.1 General . 7 4.2 Test conditions 7 4.2.1 Classification of tests and evaluation 7 4.2.2 Measuring environment 8 4.2.3 T
8、est methods . 8 4.3 Test specimens and number of specimens . 8 4.3.1 Specimen. 8 4.3.2 Number of specimens. 9 4.3.3 Test report . 9 5 TEG 9 5.1 Preparation of the TEG 9 5.2 Structures of TEG . 17 5.3 Test pattern guide . 18 5.3.1 Test items 18 5.3.2 Area array arrangement of TEG for an active device
9、 . 19 5.3.3 Peripheral arrangement of TEG 20 5.3.4 TEG size for active devices 23 5.3.5 TEG for passive devices. 24 5.3.6 Complex test pattern for the area arrangement, TEG-A . 24 5.3.7 Complex pattern for area arrangement of TEG-B 27 5.3.8 Complex test pattern for peripheral arrangement 29 5.3.9 Co
10、mplex test pattern for passive components . 30 5.3.10 Guide of measurement terminals of a complex test pattern for an active device 33 5.3.11 Terminal arrangement using complex patterns 34 Bibliography . 36 Figure 1 Area array arrangement TEG for conductor resistivity and via-to-via insulation 10 Fi
11、gure 2 Area array arrangement TEG for insulation measurement of resistance between conductors and insulation resistance between layers . 11 Figure 3 Chip arrangement in a shot . 12 Figure 4 Shot arrangement in a wafer . 13 Figure 5 Pitch chip specification of peripheral terminal of 60m TEG . 14 Figu
12、re 6 Peripheral arrangement of TEG for complex tests . 15 Figure 7 Chip arrangement in a shot . 16 Figure 8 Shot arrangement in a wafer . 16 Figure 9 Structure of test board and pad connection . 17 PD IEC/TS 62878-2-4:2015IEC TS 62878-2-4:2015 IEC 2015 3 Figure 10 Structure of a test board and via c
13、onnection 17 Figure 11 Area array arrangement 19 Figure 12 Peripheral arrangement of TEG 21 Figure 13 Example of pad arrangement of peripherals 22 Figure 14 TEG size of active device . 23 Figure 15 TEG for passive device . 24 Figure 16 Test pattern for conduction and insulation resistance between vi
14、as (seen from L6) 25 Figure 17 Complex test patterns for conduction and via-to-via insulation . 26 Figure 18 Test patterns for insulation between conductor and between layers in an area array arrangement 27 Figure 19 Complex test patterns for L1 to L6 for insulation between conductors and layers . 2
15、8 Figure 20 L1 to L6 complex test patterns for the peripheral arrangement . 29 Figure 21 Conduction test patterns for L1 to L6 of passive components . 30 Figure 22 Insulation test patterns between terminals for L1 to L6 of passive components 31 Figure 23 Interlayer insulation test patterns of L1 to
16、L6 of passive components . 32 Figure 24 Terminal arrangement (1) for measurement and evaluation using complex pattern for an active device . 33 Figure 25 Terminal arrangement (2) for measurement and evaluation using complex pattern for an active device . 34 Figure 26 Terminal arrangement for measure
17、ment and evaluation using complex pattern for passive device . 35 Figure 27 Terminal arrangement for measurement and evaluation using complex pattern for device embedded substrate 35 Table 1 Application and embedded device 8 Table 2 Measuring environment . 8 Table 3 Test items . 18 Table 4 Terminal
18、dimensions 20 Table 5 Detailed dimensions of the peripheral arrangement of TEG 21 Table 6 Detailed dimensions of the peripheral arrangement of pad connections . 22 Table 7 Dimension of passive device TEG 24 Table 8 Dimensions of the area array arrangement of TEG-A 25 Table 9 Dimensions of TEG-B for
19、the area array arrangement . 27 PD IEC/TS 62878-2-4:2015 4 IEC TS 62878-2-4:2015 IEC 2015 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ DEVICE EMBEDDED SUBSTRATE Part 2-4: Guidelines Test element groups (TEG) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization f
20、or standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publi
21、shes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may p
22、articipate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreemen
23、t between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publ
24、ications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or
25、for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresp
26、onding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for an
27、y services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and I
28、EC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Atte
29、ntion is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. I
30、EC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical committees is to prepare International Standards. In exceptional circumstances, a technical committee may propose the publication of a Technical Specification when the required support cann
31、ot be obtained for the publication of an International Standard, despite repeated efforts, or the subject is still under technical development or where, for any other reason, there is the future but no immediate possibility of an agreement on an International Standard. Technical Specifications are s
32、ubject to review within three years of publication to decide whether they can be transformed into International Standards. IEC TS 62878-2-4, which is a Technical Specification, has been prepared by IEC technical committee 91: Electronics assembly technology PD IEC/TS 62878-2-4:2015IEC TS 62878-2-4:2
33、015 IEC 2015 5 The text of this Technical Specification is based on the following documents: Enquiry draft Report on voting 91/1144/DTS 91/1165A/RVC Full information on the voting for the approval of this Technical Specification can be found in the report on voting indicated in the above table. This
34、 publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 62878 series, published under the general title Device embedded substrate, can be found on the IEC website. The committee has decided that the contents of this publication will remain unch
35、anged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be transformed into an International standard, reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT Th
36、e colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. PD IEC/TS 62878-2-4:2015 6 IEC TS 62878-2-4:2015 IEC 2015
37、INTRODUCTION This part of IEC 62878 provides guidance with respect to device embedded substrate, fabricated by embedding discrete active and passive electronic devices into one or multiple inner layers of a substrate with electric connections by means of vias, conductor plating, conductive paste, an
38、d printing. Within the IEC 62878 series, IEC 62878-1-1 specifies the test methods, IEC TS 62878-2-1 gives a general description of the technology, IEC TS 62878-2-3 provides guidance on design, and IEC TS 62878-2-4 specifies the test element groups. The device embedded substrate may be used as a subs
39、trate to mount SMDs to form electronic circuits, as conductor and insulator layers may be formed after embedding electronic devices. The purpose of the IEC 62878 series is to achieve a common understanding with respect to structures, test methods, design and fabrication processes and the use of the
40、device embedded substrate in industry. PD IEC/TS 62878-2-4:2015IEC TS 62878-2-4:2015 IEC 2015 7 DEVICE EMBEDDED SUBSTRATE Part 2-4: Guidelines Test element groups (TEG) 1 Scope This part of IEC 62878 describes the test element group devices useful when measuring basic properties of device embedded s
41、ubstrates. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components. The IEC 62878
42、series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For da
43、ted references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 62878-1-1, Device embedded substrate Part 1-1: Generic specifi
44、cation Test methods 13 Terms, definitions and abbreviations 3.1 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60194 apply. 3.2 Abbreviations AABUS as agreed between user and supplier AV audiovisual L/S line and space SMD surface mount device 4 Test c
45、onditions and sample preparation 4.1 General Clause 4 describes the test conditions for device embedded boards to be used in electronics equipment and reliability, and Clause 5 describes the test element group (hereafter referred to as TEG) to be used as dummy test chips, as well as test patterns us
46、ed in TEGs. 4.2 Test conditions 4.2.1 Classification of tests and evaluation Subclause 4.2.1 describes the classification of test levels in various applications. The environment in which products are used is divided into _ 1To be published. PD IEC/TS 62878-2-4:2015 8 IEC TS 62878-2-4:2015 IEC 2015 c
47、onsumer applications (portable and non-portable), and industrial and automotive applications (AV/information, car operation control, and engine control). Evaluation tests are divided into tests for package, module board and mother board. In this part of IEC 62878, “mother board” indicates the main b
48、oard to which packages or modules are assembled. Three ranks are specified for evaluation levels for embedded devices (passive and active), board materials, assembly methods, and specification and characteristics of embedding devices. Evaluation levels are to be agreed between user and supplier (her
49、eafter referred to as AABUS). Table 1 shows the above mentioned classification of user environment for each application. Table 1 Application and embedded device Products Package Module Mother board Applications Consumer (portable and non-portable) Industrial Automotive (audiovisual information, car operation control and engine control) Device Passive Active
