1、ASD STANDARD NORME ASD ASD NORM prEN 4660-004 Edition P 1 July 2009 PUBLISHED BY THE AEROSPACE AND DEFENCE INDUSTRIES ASSOCIATION OF EUROPE - STANDARDIZATIONAvenue de Tervuren, 270 - B-1150 Brussels - Tel. + 32 2 775 8126 - Fax. + 32 2 775 8131 - www.asd-stan.orgICS: Descriptors: ENGLISH VERSION Aer
2、ospace series Modular and Open Avionics Architectures Part 004: Final draft of Proposed Standards for Packaging Srie arospatiale Architectures Avioniques Modulaires et Ouvertes Partie 004 : Dernire proposition des Standards pour Packaging Luft- und Raumfahrt Modulare und offene Avionikarchitekturen
3、Teil 004: Endgltiger Entwurf des Standards fr Packaging This “Aerospace Series“ Prestandard has been drawn up under the responsibility of ASD-STAN (The AeroSpace and Defence Industries Association of Europe - Standardization). It is published for the needs of the European Aerospace Industry. It has
4、been technically approved by the experts of the concerned Domain following member comments. Subsequent to the publication of this Prestandard, the technical content shall not be changed to an extent that interchangeability is affected, physically or functionally, without re-identification of the sta
5、ndard. After examination and review by users and formal agreement of ASD-STAN, it will be submitted as a draft European Standard (prEN) to CEN (European Committee for Standardization) for formal vote and transformation to full European Standard (EN). The CEN national members have then to implement t
6、he EN at national level by giving the EN the status of a national standard and by withdrawing any national standards conflicting with the EN. Edition approved for publication 31 July 2009 Comments should be sent within six months after the date of publication to ASD-STAN Engineering Procedures Domai
7、n Copyright 2009 by ASD-STAN Copyright ASD-STAN Provided by IHS under license with AECMA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-prEN 4660-004:2009 (E) 2 Contents Page Foreword4 0 Introduction5 0.1 Purpose.5 0.2 Document structure.6 1 Scope 6 2 Normative re
8、ferences 7 3 Terms, definitions and abbreviations8 3.1 Terms and definitions .8 3.2 Abbreviations.8 3.3 Precedence.9 3.4 Definition of terms .9 4 Generic module specification 11 4.1 Introduction. 11 4.2 Module description. 12 4.3 Module Physical Specification 12 4.4 Module Physical Interface - Conne
9、ctor 16 4.5 Module Physical Interface - Cooling. 20 4.6 Module Physical Interface Insertion Extraction Device. 23 5 Module Mechanical Tests 25 5.1 Master gauge test . 25 5.2 Module insertion and extraction . 25 6 Guidelines for a rack slot. 27 6.1 Introduction. 27 6.2 Interchangeability . 27 6.3 Rac
10、k Slot Design Requirements . 27 6.4 Connector interface 28 6.5 Conduction Cooled Interface. 29 6.6 Air Flow Cooled Interface 30 6.7 Relationship between Cooling, Connector and IED Rack Interfaces 32 7 Typical modular avionics environment 33 7.1 Ambient pressure (altitude). 34 7.2 Humidity. 34 7.3 Hi
11、gh and low temperatures 34 7.4 Thermal shocks. 35 7.5 Salt spray. 36 7.6 Vibrations 36 7.7 Accelerations 37 7.8 Mechanical shocks . 38 7.9 Contamination resistance 39 7.10 Flame resistance. 39 7.11 Fungus resistance 39 7.12 Rain 39 7.13 Acoustic noise 40 7.14 Electromagnetic environment . 40 7.15 Ex
12、plosive atmosphere 40 7.16 Nuclear, Biological and Chemical (NBC) Hazards. 40 7.17 Sand and dust . 42 7.18 Single Event Upset / Multiple Bit Upset 42 7.19 Module Tempest 42 Copyright ASD-STAN Provided by IHS under license with AECMA Not for ResaleNo reproduction or networking permitted without licen
13、se from IHS-,-,-prEN 4660-004:2009 (E) 3 Figures Page Figure 1 ASAAC Standard Documentation Hierarchy .5 Figure 2 Module definitions 10 Figure 3 CFM dimensions .13 Figure 4 Module Connector Interface Definition and Identification (connector inserts shown for example only) .16 Figure 5 Preferred Cont
14、act Identification (viewed from outside module, lowest numbered contact is towards Side C of the cassette) .17 Figure 6 Contact Identification MT Ferrule.18 Figure 7 Polarisation Key identification 19 Figure 8 Conduction Cooled Module Cooling Interface Definition20 Figure 9 Air cooled module Cooling
15、 interface definition22 Figure 10 IED Hook characteristics .24 Figure 11 IED Implementation example.25 Figure 12 Rack Connector Physical Interface.28 Figure 13 Conduction Cooled rack guide rail .29 Figure 14 Air Flow Through and Direct Air Flow cooled rack guide rail30 Figure 15 Air Flow Around cool
16、ed rack guide rail31 Tables Page Table 1 Allowed aluminium protective treatments.14 Table 2 Ambient pressure in relation to altitude 34 Table 3 Temperature environmental conditions - Conditioned bay .35 Table 4 Temperature environmental conditions - Unconditioned bay.35 Table 5 Temperature environme
17、ntal conditions - Storage35 Table 6 Thermal shocks 36 Table 7 Sinusoidal vibrations .36 Table 8 Rotational accelerations37 Table 9 Transversal accelerations .38 Table 10 Functional Shocks .38 Copyright ASD-STAN Provided by IHS under license with AECMA Not for ResaleNo reproduction or networking perm
18、itted without license from IHS-,-,-prEN 4660-004:2009 (E) 4 Table 11 Summary of environment and bonding environmental Conditions. 40 Table 12 Initial Nuclear radiation conditions 41 Table 13 Nuclear hardening conditions 41 Foreword This standard was reviewed by the Domain Technical Coordinator of AS
19、D-STANs Engineering Procedures Domain. After inquiries and votes carried out in accordance with the rules of ASD-STAN defined in ASD-STANs General Process Manual, this standard has received approval for Publication. Copyright ASD-STAN Provided by IHS under license with AECMA Not for ResaleNo reprodu
20、ction or networking permitted without license from IHS-,-,-prEN 4660-004:2009 (E) 5 0 Introduction 0.1 Purpose This document is produced under contract ASAAC Phase II Contract n97/86.028. The purpose of the ASAAC Programme is to define and validate a set of open architecture standards, concepts and
21、guidelines for Advanced Avionics Architectures (A3) in order to meet the three main ASAAC drivers. The standards, concepts and guidelines produced by the Programme are to be applicable to both new aircraft and update programmes from 2005. The three main goals for the ASAAC Programme are: 1. Reduced
22、life cycle costs. 2. Improved mission performance. 3. Improved operational performance. The ASAAC standards are organised as a set of documents including: A set of agreed standards that describe, using a top down approach, the Architecture overview to all interfaces required to implement the core wi
23、thin avionics system. The guidelines for system implementation through application of the standards. The document hierarchy is given hereafter: (in this figure the document is highlighted) Guidelines for System Issues System Management Fault Management Initialisation / Shutdown Configuration / Recon
24、figuration Time Management Security Safety Standard for Architecture Standard for Common Functional ModulesStandard for Communications and Network Standard for Packaging Standard for Software Figure 1 ASAAC Standard Documentation Hierarchy Copyright ASD-STAN Provided by IHS under license with AECMA
25、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-prEN 4660-004:2009 (E) 6 0.2 Document structure The document contains the following sections: Section 1, Scope. Section 2, Normative references. Section 3, Terms, definitions and abbreviation. Section 4, Generic modul
26、e specification. Section 5, Module Mechanical Tests. Section 6, Guidelines for a rack slot. Section 7, Typical modular avionics environment. 1 Scope The purpose of this standard is to establish uniform requirements for Packaging for the Common Functional Modules (CFM) within an Integrated Modular Av
27、ionic (IMA) system, as defined per ASAAC. It comprises the module physical properties and the Module Physical Interface (MPI) definitions together with guidelines for IMA rack and the operational environment. The characteristics addressed by the Packaging Standard are: Interchangeability: For a give
28、n cooling method all modules conforming to the packaging standard will function correctly when inserted into any rack slot conforming to the standard for the cooling method. All modules conforming to the Module Physical Interface (MPI) definitions for connector, IED and cooling interface will functi
29、on correctly when inserted into any rack slot conforming to the same MPI definition. Maintainability: All modules are easily removable at first line. No special tools required at first line. No manual adjustment is necessary when installing modules. No tool is required for installation or removal of
30、 the modules. Mechanical keying is provided that prevents insertion of a module into a rack slot that may cause an unsafe condition. The Module Physical Interface definition, contained within this standard, does not include the properties of the signalling used in the optical interface (e.g. wavelen
31、gth). These are covered in EN 4660-003. Copyright ASD-STAN Provided by IHS under license with AECMA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-prEN 4660-004:2009 (E) 7 2 Normative references This European Standard incorporates by dated or undated reference, pr
32、ovisions from other publications. These normative references are cited at the appropriate places in the text and the publications are listed hereafter. For dated references, subsequent amendments to or revisions of any of these publications apply to this European Standard only when incorporated in i
33、t by amendment or revision. For undated references the latest edition of the publication referred to applies (including amendments). EN 2101, Aerospace series Chromic acid anodizing of aluminium and wrought aluminium alloys. EN 2284, Aerospace series Sulphuric acid anodizing of aluminium and wrought
34、 aluminium alloys. EN 2437, Aerospace series Chromate conversion coatings (yellow) for aluminium and aluminium alloys. EN 4660-001, Aerospace series Modular and open Avionics Architectures Part 001: Final Draft of Proposed Standards for Architecture. 1)EN 4660-002, Aerospace series Modular and open
35、Avionics Architectures Part 002: Final Draft of Proposed Standards for Common Functional Modules. 1)EN 4660-003, Aerospace series Modular and open Avionics Architectures Part 003: Final Draft of Proposed Standards for Communications/Network. 1)EN 4660-005, Aerospace series Modular and open Avionics
36、Architectures Part 005: Final Draft of Proposed Standards for Software. 1)ASAAC2-GUI-32450-001-CPG Issue 01, Final Draft of Guidelines for System Issues 2) Volume 1 System Management. Volume 2 Fault Management. Volume 3 Initialisation and Shutdown. Volume 4 Configuration / Reconfiguration. Volume 5
37、Time Management. Volume 6 Security. Volume 7 Safety. ARINC 600, Air transport avionics Equipment interfaces. Def Stan 03-18, Chromate Conversion Coatings (Chromate Filming Treatments) Grades: Standard and Brushing for Aluminium and Aluminium Alloys. Def Stan 03-24, Chromic Acid Anodizing of Aluminiu
38、m and Aluminium Alloys. Def Stan 03-25, Sulphuric Acid Anodizing of Aluminium and Aluminium Alloys. 1) Published as ASD Prestandard at the date of publication of this standard. 2) In preparation at the date of publication of this standard. Copyright ASD-STAN Provided by IHS under license with AECMA
39、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-prEN 4660-004:2009 (E) 8 BS 5599, Specification for hard anodic oxidation coatings on aluminium and its alloys for engineering purposes. 3)MIL-C-26074E, Coatings, Electroless Nickel Requirements. MIL-A-8625E, Anodic C
40、oatings for Aluminium and Aluminium Alloys. MIL-C-81706, Chemical Conversion Materials for Coating Aluminium and Aluminium Alloys. MIL-C-5541, Chemical Conversion Coatings on Aluminium and Aluminium Alloys. 3 Terms, definitions and abbreviations 3.1 Terms and definitions Use of “shall”, “should” and
41、 “may” within the standards observe the following rules: The word SHALL in the text express a mandatory requirement of the standard. The word SHOULD in the text expresses a recommendation or advice on implementing such a requirement of the standard. It is expected that such recommendations or advice
42、 will be followed unless good reasons are stated for not doing so. The word MAY in the text expresses a permissible practice or action. It does not express a requirement of the standard. 3.2 Abbreviations AFA Air Flow Around AFT Air Flow Through ARINC Aeronautical Radio Inc ASAAC Allied Standard Avi
43、onics Architecture Council CC Conduction Cooled CFM Common Functional Module DAF Direct Air Flow EMC ElectroMagnetic Compatibility IED Insertion Extraction Device IMA Integrated Modular Avionics MBU Multiple Bit Upset 3) Replaces Def Stan 03-26. Copyright ASD-STAN Provided by IHS under license with
44、AECMA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-prEN 4660-004:2009 (E) 9 MPI Module Physical Interface MT Mechanical Transfer NBC Nuclear, Biological and Chemical PSD Power Spectral Density SEU Single Event Upset 3.3 Precedence Figures in this document have p
45、recedence over text. 3.4 Definition of terms 3.4.1 General terms Backplane A structure containing optical and electrical communication paths and electrical power supply wiring between modules. This shall be a removable structure or integrated into the rack. Cassette Mechanical frame enclosing the el
46、ectrical components of the module. Connector A device to provide all of the electrical and optical connections between the cassette and the backplane. The connector fixed to the module cassette plugs into the corresponding connector of the backplane. It comprises a shell, inserts contacts and ferrul
47、es. Contact A single signal connection, either an electrical pin/socket or a single fibre. In the case of fibre optic contacts this does not necessarily imply the mating parts are in mechanical contact. Cooling Interface Surface which contributes to the removal of heat from the module. Ferrule A hou
48、sing and alignment device for one or more optical fibres. Insert A section of a connector containing a number of ferrules or contacts. Insertion Extraction Device (IED) A device to aid the insertion and extraction of the module from the rack and give mechanical advantage over the mating forces associated with the connector. It also provides the retention system for the module within the rack such that the module connector remains mated under all conditions specified. Module The module is a grouping of e
