1、 NOT MEASUEMENT SENSITIVE MIL-STD-865D (USAF) 01 March 2007 SUPERSEDING MIL-STD-865C 1 November 1988 DEPARTMENT OF DEFENSE STANDARD PRACTICE SELECTIVE, BRUSH PLATING, ELECTRO-DESPOSITION This document is inactive for new design. AMSC: N/A AREA: MFP Provided by IHSNot for ResaleNo reproduction or net
2、working permitted without license from IHS-,-,-MIL-STD-865D FOREWORD 1. This military standard is approved for use by 309MXSG/MXRL, Department of the Air Force, and is available for use by all departments and agencies of the Department of Defense. 2. This standard provides guidance on the process of
3、 electro-disposition (brush plating) for the Air Force repair, acquisition, and manufacture of parts and/or spare parts on the landing gear of all military aircraft. 3. Beneficial comments, recommendations, additions, deletions, and any pertinent data, which may be of use in improving this document,
4、 should be addressed to 309MXSG/MXRIL, Hill AFB, UT 84056-2609 or 309MXSG/MXRLhill.af.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at http:/assist.daps.dla.mil. ii Provided by IHSNot for ResaleNo reproduct
5、ion or networking permitted without license from IHS-,-,-MIL-STD-865D CONTENTS PARAGRAPHS PAGEFOREWORD ii 1. SCOPE 1 1.1 Scope 2. APPLICABLE DOCUMENTS 1 2.1 General 2.2 Government Document 1 2.2.1 Specifications, standards, handbooks and commercialitem descriptions 1 2.2.2 Other Government Documents
6、 1 2.3 Order of Precedence 3. DEFINITIONS 2. 3.1 High strength steel 4. GENERAL REQUIREMENTS 2 4.1 General 4.1.1 Selective plating uses 2 4.1.2 Printed circuit repairs 4.1.3 Repair areas 3 4.1.4 Cleanliness 4.1.5 Scale, oxide, and grease 3 4.1.6 Selective plating characteristics 4.1.7 Activating 3 4
7、.1.8 Film removal 4.2 Solutions 3 4.2.1 Types of solutions 4.2.2. Characteristics of selective plating solutions 4 4.2.2.1 Solution usage 4 4.2.2.2 Immersion deposits and pre-plates 4.2.2.3 Chrome plating solutions 4 4.2.2.4 Build-up 4.3 Anodes 5 4.3.1 Anodes materials and shapes 4.3.2 Anodes select
8、ion 5 4.3.2.1 Anodes selection for preparatory steps 5 4.3.2.2 Anodes selection for plating steps 5 4.3.3 Tool coverings 6 4.4 Equipment 6 iii Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-865D CONTENTS PARAGRAPHS PAGE4.4.1 Power unit 6 4.4
9、.2 Plating tool handles 7 4.4.3 Dishes, beakers, and flasks 4.4.4 Accessory equipment 7 4.4.4.1 Blasting equipment and abrasive 4.4.4.2 Motorized turning head 7 4.4.4.3 Rotary power anode 8 4.4.4.4 Additional equipment 4.4.4.5 Safety requirement 8 5. DETAILED REQUIREMENTS 8 5.1 Calculation of requir
10、ed ampere-hours 8 5.2 General plating procedure 9 5.3 Alternate activation method 9 5.4 Plating dissimilar metals and changing base 10 5.5 Surface preparation 5.5.1 Plating on aluminum and aluminum alloys 10 5.5.2 Plating on copper and copper base alloys 5.5.3 Plating on 300 series and 400 series. 1
11、 5.5.4 Plating on iron and carbon steels 2 5.5.5 Plating on ultra high strength steels 1 5.5.6 Inspection 3 6. NOTES 14 6.1 Intended use 6.2 Subject term (key word) listing 14 6.3 Changes from previous issue 14 CONCLUDING MATERIAL 14 APPENDIX A 1 Table A-I 2 Table A-II 4 Table A-III 5 Table A-IV 7 T
12、able A-V 8 ivProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-865D 1. SCOPE 1.1 Scope. This standard covers the process and materials for selective electro-desposition of various metals and alloys on ferrous alloys, aluminum alloys, copper all
13、oys, nickel alloys and corrosion-resistant steel, etc. 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in this standard. This section does not include documents cited in other sections of this standard or recommended for additional information or as examples.
14、While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited Sections 3,4, and 5 of this standard, whether or not they are listed. 2.2 Government Documents.2.2.1 Specifications, standards, han
15、dbooks, and commercial item descriptions. The following specifications, standards, handbooks and commercial item descriptions form a part of this document to the extent specific herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTM
16、ENT OF DEFENSE SPECIFICATIONS MIL-S-5002 Surface Treatment and Inorganic Coating for Metal Surfaces of Weapon Systems (Inactive for New Design) DEPARTMENT OF DEFENSE STANDARDS MIL-STD-1504 Abrasive Blasting (Inactive) (Copies of these documents are available from the Standardization Document Order D
17、esk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094 or http:/assist.daps.dla.mil.online/start/ ) 2.2.2 Other Government documents, drawings, and publications. The following other Government documents, drawings, and publications form a part of this document to the extent specified herei
18、n. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. COMMERCIAL ITEM DESCRIPTIONS A-A-59460 Plating Units, Selective (Brush), Portable (Copies of these documents are available online at http:/assist.daps.dla.mil.online/start/ or from the Stand
19、ardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of Precedence. In event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. 1 Provided by IHSNot for ResaleNo reproduction
20、 or networking permitted without license from IHS-,-,-MIL-STD-865D Nothing in this document, however, supersedes laws and regulations unless a specific exemption has been obtained. 3. DEFINITIONS 3.1 High Strength Steel. For the purpose of this standard, high strength steel is defined as steel heat
21、treated to 180,000 pounds per square inch (psi) and above. 4. GENERAL REQUIREMENTS 4.1 General. The selective plating process (sometimes called “brush” plating) is the method of depositing metal from concentrated electrolyte solutions or selected areas without immersion tanks. In this process, metal
22、 is deposited from an electrolyte held in an absorbent material attached to an inert anode. Plating contact is made by brushing or swabbing the part (cathode) to be plated with electrolyte-bearing anode. 4.1.1 Selective plating uses. a. To prevent or minimize disassembly costs. b. To minimize machin
23、ing costs (plate to size). c. To minimize masking costs. d. To develop field reliability. e. To plate small areas of extremely large parts. f. To supplement conventional plating g. To plate high strength steels. h. To plate onto difficult to plate metals, i.e., Aluminum, Molybdenum, Titanium, etc, e
24、ither as a bonding agent or for subsequent finishing. i. To restore worn, corroded, or over-machined parts back to size. 4.1.2 Printed circuit repairs. Because of the growing demand and limited availability of electronic components, there has been a significant increase in the need for an approved r
25、epair process for salvage of damaged or defective printed circuit boards. Techniques have been developed utilizing selective plating for repair of these boards. These techniques are available through the manufacturer of the selective plating solutions. The specific types of repairs that can be accom
26、plished are: a. Repair of defective plating. b. Repair of damaged contacts (fingers) due to peeling. c. Repair of lifted, damaged, or missing pads and traces. 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-865D d. Adding new circuitry or r
27、e-routing traces on existing circuit boards. e. Repair breaks in continuity. f. Repairs o damaged plating in through holes. 4.1.3 Repair areas. The use of this process will be governed by the expediency and economics of the individual case. The areas to be repaired will normally be limited to reason
28、able small areas, but in some cases it will be practical to plate large areas. 4.1.4 Cleanliness. All solutions shall be clean and free from contamination. Extra care should be taken to insure that the solutions are not contaminated by used anodes, other plating solutions, and/or grease and oil from
29、 surrounding area. 4.1.5 Scale, oxide, and grease. Selective plating solutions are not designed to remove large amount of scale, oxide, oil or grease. Use mechanical or chemical methods to remove large amounts of scale or oxide. Use solvents to remove large amounts of oil or grease. 4.1.6 Selective
30、plating characteristics. Selective plating solutions are 5 to 50 times as concentrated as tank solutions. The current densities used range from 500 to10,000 amps/FT2. The voltage listed on the solution containers have been pre-calculated to give proper current densities. Too high a current density b
31、urns the plating and too low a current density produces stressed deposits and low efficiencies. Agitation is provided to anodes to cathode motion. Too slow a motion causes burning and too fast a motion results in burned plates, course grain structure and unsound deposits. The minimum operating tempe
32、rature should be 70 degrees. Consult the technical data sheet or technical representative for maximum operating temperature of plating solutions. WARNINGChemical breakdown of solutions may occur if advised maximum temperature is exceeded. 4.1.7 Activating. Materials that normally have passive surfac
33、e (stainless steel, chromium, nickel, and aluminum) require an activating operation. The activating operation removes the passive surface. 4.1.8 Film removal. Etching operations sometimes results in the formations of an insoluble surface film, for example: carbon on carbon steel. These layers for in
34、terfere with adhesions; therefore, it is important that these films are removed in the preparation procedure prior to plating. 4.2 Solutions.4.2.1 Types of solutions. The solutions used in selective plating include solutions for cleaning, etching and activating the surface to be plated, plating solu
35、tions for depositing pure or alloy metals, stripping solutions and special purpose solutions such as anodizing, chromate treatment, etc. Solutions of any manufacturers may be 3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-865D used provide
36、s they meet the applicable plating requirements and are qualified by procedure tests. However, plating and preparatory solutions of different manufacturers should not inter-mixed or substituted into a plating procedure. 4.2.2 Characteristics of selective plating solutions. The solution manufacturers
37、 have pre-cared and made available comprehensive literature on their solutions. This information should be reviewed when selecting a solution and the instructions followed when using the solution. The solution containers are labeled as to range of voltage for various anodes and solution factor. This
38、 information should be used during plating operations. The selective plating solution characteristics listed in the Appendix are presented as a guide for solution selection and use. 4.2.2.1 Solution usage.a. Alkaline and neutral solutions are preferred on porous base metals, white metals, high stren
39、gth steel and for improved throwing power. b. Acid solutions are generally used for rapid build-up and as a laminating structure material in conjunction with alkaline type solutions. 4.2.2.2 Immersion deposits and pre-plates. Immersion deposits will formed by certain solutions on certain base materi
40、als when pre-wetting a surface with no current flowing. Immersion deposits have poor adhesion to the base materials. Pre-plates are often used to prevent immersion deposits from forming thereby improving adhesion. Common pre-plates are nickel, gold and palladium. When plating with solutions that for
41、m immersion deposits, care must be taken to avoid any solution contact with the part prior to plating. Solution literature generally is a good guideline on what solutions form immersion deposits. 4.2.2.3 Chrome plating solution. Chrome deposited from selective plating solutions is not recommended as
42、 a wear resistant coating. The hardness of selective brush plated chromium deposits is about 600 Brinell as compares to 1000 Brinell for hard chrome deposits from a tank. In addition the limited thickness and difficulty of producing sound deposits from selective chrome plating solutions result in th
43、e use of other metals such as nickel or cobalt in applications, which chromium would normally be used. 4.2.2.4 Build-up. Brush plating solutions are limited in the thickness that can be deposited since the deposit surface at some point becomes excessively rough. The thickness at which deposits becom
44、e rough varies from 0.001 to .0030 inches but as a general rule the average is 0.005 inches. At this point for higher build-up, the deposit must be smoothed by machining, grinding, or sanding. The deposit must then be cleaned, etched and reactive before additional material can be applied. This can b
45、e easily and reliably done on more noble metals such as copper acid deposits, silver, gold, etc. The harder materials such as cobalt and nickel tend to form passive films and must be activated; an operation that requires speed and operator skill, this presents some element of risk. There several tec
46、hniques to circumvent this element of risk, they are: a. Select metals and/or specific solutions with less of a tendency to become rough with thickness. The manufacturers of selective plating solutions have developed several solutions specifically for heavy build-up. By supplying these solutions 4 P
47、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-865D as a constant flow rate and the use of abrasive type covers such as “Scotch Brite” it is possible to deposit layers of metals such as nickel in excess of 0.030 inch without layering or sandwiching. The solution manufacturers list a normal maximum thickness build-up for each solution in their literature. b. Use a lamination technique whereby layers of a harder more difficult to activate mate
