1、Designation: D 3808 01 (Reapproved 2007)Standard Test Method forQualitative Determination of Adhesion of Adhesives toSubstrates by Spot Adhesion1This standard is issued under the fixed designation D 3808; the number immediately following the designation indicates the year oforiginal adoption or, in
2、the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon (e) indicates an editorial change since the last revision or reapproval.1. Scope1.1 This test method covers a simple qualitative procedurefor quickly screening whether
3、 an adhesive will, under recom-mended application conditions, bond to a given substratewithout actually making bonded assemblies.1.2 The values stated in SI units are to be regarded as thestandard. The values in parentheses are for information only.1.3 This standard does not purport to address all o
4、f thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2D 907 Terminology of Ad
5、hesivesE 171 Specification for Atmospheres for Conditioning andTesting Flexible Barrier Materials3. Terminology3.1 DefinitionsMany of the terms used in this test methodare defined in Terminology D 907.3.1.1 spot adhesion, na qualitative method of determiningadhesion by attempting to pry a “spot” of
6、cured adhesive froma substrate.4. Summary of Test Method4.1 Spots of adhesive (size can vary, but generally about 6mm (14 in.) in diameter) are placed onto a substrate using theapplication procedure and curing conditions acceptable to bothuser and supplier of the adhesive.4.2 The substrate preparati
7、on and environmental exposureof the spot of adhesive after cure or setting can be varied asdesired.4.3 The determination of whether an adhesive bonds to thesubstrate is made by simply trying to pry the spot of adhesivefrom the substrate.4.4 The mode of failure is readily evident by examiningwhether
8、the bond separated adhesively or cohesively, either inthe adhesive or substrate.5. Significance and Use5.1 This is a quick, simple, and inexpensive test method forqualitatively determining, without the need to prepare bondedtest specimens, whether the adhesive under consideration willbond to a parti
9、cular substrate. If the results are acceptable, thenstandard quantitative adhesive test procedures can be used toobtain quantitative measurements of the adhesives perfor-mance.5.2 This test method can also be used to compare relativeadhesion of several adhesives to given substrates.5.3 It can be use
10、d to determine whether an adhesive willcontinue to adhere to the substrate under specified environmen-tal conditions.5.4 It can be used to evaluate adhesion of a particularadhesive to a variety of substrates.5.5 It can be used to obtain “subjective” comparative databetween several adhesives on a giv
11、en substrate by noting therelative ease of inducing failure between the adhesives tested.5.6 It should be most applicable to adhesives that cure or setwhen exposed to “air” (ambient, heated, etc.) and could beused for anaerobic adhesives if testing is carried out in anoxygen-free atmosphere.6. Appar
12、atus6.1 No special equipment is needed for application of theadhesive to the test substrate(s). When using hot-melt adhe-sives, for example, it would be desirable to have a hand-gunapplicator or equivalent apparatus to allow deposition of thehot-melt at a recommended application temperature. The use
13、 ofsuch equipment is not mandatory as a hot plate can be used tomelt a quantity of the hot melt to the application temperature ina deformable container such as an aluminum weighing dish.Upon reaching proper temperature, the hot melt can be pouredonto the substrate after forming a pouring spout in th
14、econtainer.1This test method is under the jurisdiction of ASTM Committee D14 onAdhesives and is the direct responsibility of Subcommittee D14.40 onAdhesives forPlastics.Current edition approved Oct. 1, 2007. Published October 2007. Originallyapproved in 1979. Last previous edition approved in 2001 a
15、s D 3808 01.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.1Copyright ASTM International, 100 Barr Harbor Dr
16、ive, PO Box C700, West Conshohocken, PA 19428-2959, United States.6.2 For some applications it is desirable to preheat thesubstrate. For this reason an oven or other heat source would beuseful.6.3 To test adhesion of the adhesive spot, a thin stainlesssteel spatula or similar probe is needed to pry
17、or lift the spotfrom the substrate.7. Test Specimen7.1 Any form or shape of the substrate is acceptable. It isadvisable to place several spots of the same adhesive onto thesubstrate.7.2 In most cases, it is most efficient to test severaladhesives on the same substrate sample.8. Conditioning8.1 Store
18、 the test specimens at the test conditions for 24 h,unless other test time is described. Note this when recordingdata. If other conditions are not specified, the storage and testconditions shall be 23 6 2C and 50 6 5 % relative humidity.Specification E 171 details these and other test conditions.9.
19、Failure9.1 Failure is a visible separation of the adhesive spot eitheradhesively from the substrate or cohesively in the adhesive orsubstrate.9.2 The ease of separation of the adhesive spot can be usedto compare the relative performance of the adhesives.10. Procedure10.1 Run the tests in the same en
20、vironment used to condi-tion the test specimens and test apparatus.10.2 Using a thin-bladed stainless steel spatula or probe, tryto separate the adhesive spot from the substrate.10.3 Note the type and ease of failure as described inSection 9.11. Report11.1 Report the following information:11.1.1 Met
21、hod of specimen preparation, that is, adhesiveused, method of cure, substrate preparation, preheating ofsubstrate, if hot-melt was used, application temperature, andany other relevant information.11.1.2 Conditioning exposure.11.1.3 Mode of failure, that is, adhesive to substrate orcohesive in adhesi
22、ve or substrate, or both; relative ease offailure and any visible change in substrate due to adhesiveattack, for example, discoloration, crazing, softening, etc.12. Precision and Bias12.1 No information is presented about either precision orbias of this test method, since the test result is nonquant
23、itative.13. Keywords13.1 hot melt adhesive; spot adhesion; structural adhesiveASTM International takes no position respecting the validity of any patent rights asserted in connection with any item mentionedin this standard. Users of this standard are expressly advised that determination of the valid
24、ity of any such patent rights, and the riskof infringement of such rights, are entirely their own responsibility.This standard is subject to revision at any time by the responsible technical committee and must be reviewed every five years andif not revised, either reapproved or withdrawn. Your comme
25、nts are invited either for revision of this standard or for additional standardsand should be addressed to ASTM International Headquarters. Your comments will receive careful consideration at a meeting of theresponsible technical committee, which you may attend. If you feel that your comments have n
26、ot received a fair hearing you shouldmake your views known to the ASTM Committee on Standards, at the address shown below.This standard is copyrighted by ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959,United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the aboveaddress or at 610-832-9585 (phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.astm.org).D 3808 01 (2007)2
