1、Designation: D4498 07 (Reapproved 2015)Standard Test Method forHeat-Fail Temperature in Shear of Hot Melt Adhesives1This standard is issued under the fixed designation D4498; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year
2、 of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope1.1 This test method is intended to determine the tempera-ture at which specimens bonded with hot melt adhesivedelamin
3、ate under static load in shear.1.2 The values stated in SI units are to be regarded as thestandard. The values given in parentheses are for informationonly.1.3 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of
4、 this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2D907 Terminology of AdhesivesE28 Test Methods for Softening Point of Resins Derivedfrom Pine Chemicals and Hydrocarb
5、ons, by Ring-and-Ball ApparatusE145 Specification for Gravity-Convection and Forced-Ventilation OvensE171 Practice for Conditioning and Testing Flexible BarrierPackagingE691 Practice for Conducting an Interlaboratory Study toDetermine the Precision of a Test Method3. Terminology3.1 DefinitionsMany o
6、f the terms found in this testmethod are defined in Terminology D907.3.2 Definitions of Terms Specific to This Standard:3.2.1 heat-fail temperature, nthe temperature at whichdelamination occurs under static loading in shear.4. Significance and Use4.1 Heat-fail temperature establishes a limiting temp
7、eratureabove which the adhesive is not to be exposed in service undershear load.5. Apparatus5.1 A device capable of producing adhesive films of uni-form thickness with 625.4 m (61 mil) tolerances.5.2 Standard SubstrateNIST Standard Reference Material1810 (Liner-Board)35.3 Heat Sealing DeviceSentinel
8、 heat sealer or equivalentcapable of maintaining selected sealing temperature within62.5C (65F).5.4 Forced-Ventilation Oven, manual or programmed. Ovenshall be capable of maintaining selected temperatures within61 % of the differential between oven and ambient tempera-tures in accordance with Specif
9、ication E145, with the program-mable oven capable of attaining smooth temperature increasesof 30C/h over a range of 25 to 150C.5.5 Thermometric Device, for monitoring oven tempera-tures.5.6 TFE-fluorocarbon Cloth, silicone release paper, 500 gweights and clamping devices for suspending weights andsp
10、ecimens in the oven.6. Sampling, Test Specimens, and Test Units6.1 The test sample is to be representative of the adhesivebeing tested.6.2 Prepare test specimen films of representative adhesive ata thickness of 76 6 25 m (3 6 1 mil). Inspect the cooled filmsand reject any containing voids or other i
11、mperfections. Cut thefilms into pieces measuring 25.4 by 25.4 mm 6 1.6 mm (1 by1 in. 6 0.0625 in.). Measure the thickness of the adhesive filmto the nearest 0.013 mm (0.0005 in.). Cut strips of standardsubstrate measuring 25.4 6 1.6 by 76 mm (1 6 0.0625 by 3in.) with 76-mm (3-in.) dimension in the m
12、achine direction.6.3 Prepare a lap joint measuring 25.4 by 25.4 mm (1 by 1in.) inside two strips of standard substrate. Place this assembly1This test method is under the jurisdiction of ASTM Committee D10 onPackaging and is the direct responsibility of Subcommittee D10.14 on Tape andLabels.Current e
13、dition approved Oct. 15, 2015. Published October 2015. Originallyapproved in 1985. Last previous edition approved in 2007 as D4498 07. DOI:10.1520/D4498-07R15.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of
14、ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.3Available from National Institute of Standards and Technology (NIST), 100Bureau Dr., Stop 1070, Gaithersburg, MD 20899-1070, http:/www.nist.gov.Copyright ASTM International, 100 Barr Harbor Drive, PO B
15、ox C700, West Conshohocken, PA 19428-2959. United States1between a folded sheet of silicone-coated release paper orTeflon cloth (Note 1). Insert the assembly between the platensof the heat sealer having only the upper platen heated. Makethe seal under the following conditions and seal at least 6spec
16、imens of each adhesive for test.6.3.1 TemperatureAs needed to activate hot-melt adhesive(Note 2).6.3.2 Pressure103.4 kPa (15 psi).6.3.3 Dwell Time1.5 s.NOTE 1Use of the coated release paper or TFE-fluorocarbon clothmay require a higher than expected sealing temperature because ofthermal insulating e
17、ffects.NOTE 2The operator should test at least two bonds after cooling toroom temperature to ensure that adequate adhesion has been obtained.Adjust sealing temperature to obtain that adhesion.6.4 Measure the thickness of the two pieces of substrate,calculate, and record the adhesive thickness, which
18、 is to bebetween 25.4 and 76.2 m (1 and 3 mils). Condition thebonded specimens for 24 h according to Specification E171before testing.7. Procedure7.1 Randomly select and suspend three bonded replicates inthe oven. Attach the weight to the bottom tab of substrate sothat the total load is 500 6 5 g (1
19、.1 6 0.01 lb). Although theweight designated is recommended, other weights can be used.If so, report.7.2 Set the initial oven temperature at approximately 25 to40C (45 to 70F) below the softening point of the adhesive, aspreviously determined in accordance with Test Method E28.Increase the oven temp
20、erature sequentially; for manual con-trols 5C (10F) at 10-min intervals, for programmed controls30C (60F)/h. Continue to increase the oven temperature untilall specimens fail.7.3 Record the temperature at which each specimen fails.Average the results for replicate specimens and report to thenearest
21、degree as the heat-fail temperature. Also report threeindividual results.8. Report8.1 Complete identification of the adhesive tested, includingtype, source, manufacturers code, lot number, and form inwhich received.8.2 Complete identity of substrates used if different from thestandard substrate.8.3
22、Activation temperature used to make lap joint speci-mens.8.4 Weight used if other than 500 6 5 g (1.1 6 0.01 lb) testweight.8.5 A tabulation of test results, including the measuredthickness of adhesive for each test specimen as determined inaccordance with 6.2.9. Precision and Bias9.1 PrecisionTable
23、 1 and Table 2 show data from roundrobin testing from an early study. An interlaboratory studyusing Practice E691 will be conducted to generate data torevise Section 9 to bring it into conformance with the Precisionand Bias section in the ASTM Form and Style Manual.9.2 BiasNo statement is made about
24、 the bias of this testmethod since the result merely records a temperature at whichfailure of bond under shear load is observed.10. Keywords10.1 heat fail temperature; hot-melt adhesive; shearTABLE 1 Heat-Fail Temperature Round Robin Data, FAdhesiveTypeLaboratory1PA2M3M4P5M6M7M8M9M10M10PEVA 145 160
25、138 149 . . . 145 . . . 140 135 149 132Polyester 265 270 268 270 275 277 259/265 . . . 260 253 262Polyamide 261 275 254 259 265 264 250 250 243 253 262Polypropylene 188 170 124 176 . . . 153 170 152 . . . 158 176Polyethylene 195 200 184 191 195 192 180 181 163 196 192AP is an abbreviation for progra
26、mmed oven. M is an abbreviation for manual control oven.TABLE 2 Summary of Results (10 Laboratories)AdhesiveTypeAv. Heat-failTemperature, FStandardDeviation, FEVA 142 9.3Polyester 263 11.7Polyamide 256 11.5Polypropylene 160 19.5Polyethylene 187 11.2D4498 07 (2015)2ASTM International takes no positio
27、n respecting the validity of any patent rights asserted in connection with any item mentionedin this standard. Users of this standard are expressly advised that determination of the validity of any such patent rights, and the riskof infringement of such rights, are entirely their own responsibility.
28、This standard is subject to revision at any time by the responsible technical committee and must be reviewed every five years andif not revised, either reapproved or withdrawn. Your comments are invited either for revision of this standard or for additional standardsand should be addressed to ASTM I
29、nternational Headquarters. Your comments will receive careful consideration at a meeting of theresponsible technical committee, which you may attend. If you feel that your comments have not received a fair hearing you shouldmake your views known to the ASTM Committee on Standards, at the address sho
30、wn below.This standard is copyrighted by ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959,United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the aboveaddress or at 610-832-9585 (phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.astm.org). Permission rights to photocopy the standard may also be secured from the Copyright Clearance Center, 222Rosewood Drive, Danvers, MA 01923, Tel: (978) 646-2600; http:/ 07 (2015)3
