1、BRITISH STANDARD BS EN 123400:1992 Incorporating Amendment No.1 BSCECC23400:1992 renumbered Harmonized system of quality assessment for electronic components Sectional specification: Flexible printed boards without through connections The European Standard EN123400:1992 has the status of a British S
2、tandardBSEN123400:1992 This British Standard, having been prepared under the directionof the Electronic Components Standards Policy Committee, was published underthe authority of the BoardofBSI and comes into effect on 31December1990 BSI11-1999 The following BSI references relate to the work on this
3、 standard: Committee reference ECL/19 Draft for comment89/23561DC ISBN 0 580 18256 8 Committees responsible for this British Standard The preparation of this British Standard was entrusted by the Electronic Components Standards Policy Committee (ECL/-) to Technical Committee ECL/19 upon which the fo
4、llowing bodies were represented: British Telecommunications plc ERA Technology Ltd. Electrical and Electronic Insulation Association (BEAMA Ltd.) Electronic Components Industry Federation Electronic Engineering Association GAMBICA (BEAMA Ltd.) Institute of Circuit Technology Institute of Metal Finis
5、hing Institution of Production Engineers Ministry of Defence National Supervising Inspectorate Printed Circuit Association Telecommunication Engineering and Manufacturing Association (TEMA) Amendments issued since publication Amd. No. Date of issue Comments 7367 November 1992 Adoption as a European
6、standard: renumbering as BS EN123400:1992 9253 September 1996 Indicated by a sideline in the marginBSEN123400:1992 BSI 11-1999 i Contents Page Committees responsible Inside front cover National foreword ii Foreword 2 Text of EN123400 5 Publications referred to Inside back coverBSEN123400:1992 ii BSI
7、 11-1999 National foreword This British Standard has been produced under the direction of the Electronics Components Standards Policy Committee. It is identical with CENELEC Electronic Components Committee (CECC)23400:1985 “Harmonized system of quality assessment for electronic components: Sectional
8、 specification: Flexible printed boards without through connections”. This standard is a harmonized specification within the CECC system and should be read in conjunction with BS CECC23000. In1992 the CENELEC Electronic Components Committee (CECC) accepted CECC23400:1985 as European Standard EN12340
9、0:1992. The British Standard which implements the Internal Regulations of the FEN e.V. is BS9000 “General requirements for a system for electronic components of assessed quality”Part2 “Specification for national implementation of the CECC” There is no British Standard equivalent to CECC00010:1980, w
10、hich comprises only a list of the tests in IEC326-2 and its supplement IEC326-2A. The Technical Committee has reviewed the provisions of IEC194:1975, IEC321:1970 and IEC326-3:1980, CECC00107 PartIII 1)and CECC00111 2) , to which reference is made in the text, and has decided that they are acceptable
11、 for use in conjunction with this standard. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligation
12、s. Summary of pages This document comprises a front cover, an inside front cover, pagesi andii, theENtitlepage, pages2 to24, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment ta
13、ble on the inside front cover. Cross-references International Standard Corresponding British Standard CECC23000:1985 BS CECC23000:1989 Harmonized system of quality assessment for electronic components: Generic specification: Printed boards (Identical) IEC68 BS2011 Basic environmental testing (Most P
14、arts are identical) IEC249 BS EN60249 Base materials for printed circuits (Most Parts are identical) BS6221: Printed wiring boards IEC326-2:1976 Part2: Methods of test (Technically equivalent) IEC326-7:1981 Part7: Method for specifying single and double sided flexible printed wiring boards with thro
15、ugh connections (Identical) 1) CECC00107PartIII has been replaced by CECC00114 (RP14) PartIII and the identical British Standard will be BS CECC00114-3 when published. 2) The identical British Standard to CECC00111 will be BS CECC00111 when published.EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM
16、 EN123400 May1992 +A2 August1995 ICS31.180 Descriptors: Flexible printed boards, without through connections, capability test, quality conformance inspection, test patterns English version Sectional Specification: Flexible printed boards without through connections (includes amendment A2:1995) Spcif
17、ication intermdiaire: Cartes imprimes souples sans connexions transversales (inclut lamendement A2:1995) Rahmenspezifikation: Flexible Leiterplatten ohne Durchverbindungen (enthlt nderung A2:1995) This European Standard was approved by the CENELEC Electronic Components Committee (CECC) on,1995-07-04
18、. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtaine
19、d on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central
20、 Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. C
21、ENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1995 Copyright reserved to CENELEC members Ref. No. EN123400:1992/A2:1995EEN123400:
22、1992 BSI 11-1999 2 Foreword to amendment A2 This amendment was prepared by CLC/TC CECC/WG23. The text of the draft was submitted to the Unique Acceptance Procedure and was approved by CENELEC as amendment A2 to EN123400:1992 on1995-07-04. The following dates were fixed: Foreword The CENELEC Electron
23、ic Components Committee (CECC) is composed of those member countries of the European Committee for Electrotechnical Standardization (CENELEC) who wish to take part in a harmonized system for electronic components of assessed quality. The object of the System is to facilitate international trade by t
24、he harmonization of the specifications and quality assessment procedures for electronic components, and by the grant of an internationally recognized Mark, or Certificate, of Conformity. The components produced under the System are thereby accepted by all member countries without further testing. Th
25、is specification has been formally approved by theCECC, and has been prepared for those countries taking part in the System who wish to issue national harmonized SECTIONAL SPECIFICATIONS for FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS. It should be read in conjunction with the current regula
26、tions for the CECC System. At the date of printing of this specification the member countries of the CECC are Austria, Belgium, Denmark, Finland, France, Germany, Ireland, Italy, the Netherlands, Norway, Portugal,Spain, Sweden, Switzerland and theUnitedKingdom. Preface This sectional specification w
27、as prepared by CECC Working Group23: Printed Circuits. It is based on publications of the International Electrotechnical Commission (IEC). The text of this specification was circulated to the CECC for voting in the document indicated below and was ratified by the President of the CECC for printing a
28、s a CECC Specification. Secretariat note: Due to the urgent industrial need for this specification, the president of the CECC has ruled that it be published without the full editorial procedure being applied. Users of the specification are asked to report to the CECC general secretariat any errors t
29、hey find so that amending action can be initiated. latest date by which theamendment has to beimplemented at nationallevel by publication of an identical national standard or by endorsement (dop)1996-07-01 latest date by which thenational standards conflicting with the amendment have to be withdrawn
30、 (dow)1996-07-01 Document Date of Voting Report on the Voting CECC (Secretariat) 1626 January1985 CECC (Secretariat) 1728EN123400:1992 BSI 11-1999 3 Contents Page Foreword 2 1 Introduction 5 1.1 Scope and object 5 1.2 Related documents 5 2 General 5 3 Test specimens 6 3.1 Capability approval 6 3.2 Q
31、uality conformance inspection 6 4 Relevant specification 6 5 Characteristics of printed boards 6 6 Capability test programme 14 7 Quality conformance inspection 15 8 Test patterns test boards 18 8.1 Application of test patterns and test boards 19 8.2 Composite test pattern (CTP) 19 8.3 Multiple arra
32、ngements of the composite test patterns 20 Figure 1 Length of defect 18 Figure 2a Composite test pattern for flexibleprinted boards without through connections. Details, see Figure 2b 21 Figure 2b Detailed dimensions of specimens shown in Figure 2a 22 Figure 3 Examples related to access holes 23 Fig
33、ure 4 Examples of delamination 24 Table I Basic characteristics 7 Table II Additional characteristics 13 Table III 14 Table IV 164 blankEN123400:1992 BSI 11-1999 5 1 Introduction IEC326-7 is the IEC-Standard for flexible printed boards without through connections. The following document comprises th
34、is IEC-Standard and in accordance with the generic specification CECC23000 the information additionally necessary for printed boards intended to be handled within the CENELEC system for Electronic Components of Assessed Quality. 1.1 Scope and Object This document is a Sectional Specification (SS) re
35、lating to flexible printed boards without through connections irrespective of their method of manufacture, when they are ready for mounting of the components. It defines the characteristics to be assessed and the test methods to be used for capability approval testing and for quality conformance ins
36、pection (lot-by-lot and periodic inspection). 1.2 Related documents IEC68, Basic environmental testing procedures. IEC194, Terms and definitions for printed circuits. IEC249, Metal-clad base materials for printed circuits. IEC321, Guidance for the design and use of components intended for mounting o
37、n printed boards. IEC326-2, Printed boardstest methods. IEC326-3, Design and use of printed boards. IEC326-7, Specification for flexible printed boards without through connections. CECC00010:1980, Printed boardstest methods. CECC23000, Generic Specification Printed boards of assessed quality. 2 Gene
38、ral This Sectional Specification (SS) applies to flexible printed boards without through connections and is intended as a basis for the preparation of Capability Detail Specification (Cap DS) applying to specific materials, e.g.according to IEC249-2, and to be used for capability approval procedures
39、. It may be necessary to have a Cap DS for each type of material. A Cap DS may be prepared by an international or a national body or by a manufacturer (see also CECC00111). Customer Detail Specification (CDS) for the custom built printed boards, according to5 of CECC23000. The CDS will normally be w
40、ritten by the customer and allocated a number within his own system. Further details are also given in CECC23000 and in CECC00107 Part III. Table I contains the basic characteristics that will normally be important for flexible printed boards without through connections and makes reference to the ap
41、propriate tests to verify these characteristics. Table II contains the additional characteristics that may be important for certain flexible printed boards without through connections and/or certain applications and makes reference to the appropriate tests to verify these characteristics. Where nece
42、ssary, the relevant specification may quote characteristics and tests from this Table II. Where additional details for a test have to be specified in the relevant specification, this is indicated by an asterisk in the relevant column. These details shall then be specified in accordance with CECC0001
43、0 (IEC326-2). Table III contains the capability test programme. A specified composite test pattern (CTP) is used as capability qualifying component. Table IV contains the information for the quality conformance inspection. The tables are not intended to prescribe a test sequence, the tests may be ca
44、rried out in any sequence, unless otherwise specified.EN123400:1992 6 BSI 11-1999 3 Test specimens 3.1 Capability Approval 3.1.1 Basic Capability The test shall be carried out on the composite test pattern given in8. 3.1.2 Additional Capability 3.5.3 of CECC23000 shall apply. For multiple arrangemen
45、ts see also8. 3.1.3 Maintenance of Capability Approval 3.8 of CECC23000 shall apply. 3.2 Quality conformance inspection Unless otherwise specified production boards and/or specially designed test patterns may be used for carrying out tests for the lot-by-lot and the periodic inspection. Where specia
46、lly designed test patterns shall be used they may be included in the panel. They may be based on the appropriate pattern of the composite test pattern clause8. Consultation between manufacturer and customer will usually be necessary. 4 Relevant specification The term “Relevant Specification” means a
47、 product specification for an actual printed board, i.e.a CDS as well as a Cap DS applied to a specific material and technique, as applicable. The relevant specification shall contain all information necessary to define the printed board clearly and completely. The recommendations given in IEC326-3
48、shall preferably be followed. Care should be taken to avoid unnecessary prescriptions. Permissible deviations shall be stated where necessary, nominal values without tolerances or simple maxima or minima shall be given where sufficient. Where tolerances are necessary for certain areas or parts of th
49、e printed board only, they shall be applied and restricted to those areas or parts. If there are several possibilities of presentation, of tolerance classes etc., the selections given in IEC326-3 shall preferably be applied. In case of discrepancy between the CDS and any other pertinent specification (e.g.BS, GS, or SS) the CDS shall prevail. 5 Characteristics of printed boards Basic characteristics of flexible printed boards without through connections are given in Table I. Additional characteristics of flexible printed boards without thro
