1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationMechanical standardization of semiconductor devicesPart 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring met
2、hods for package dimensions of small outline J-lead packages (SOJ)BS EN 60191-6-20:2010National forewordThis British Standard is the UK implementation of EN 60191-6-20:2010. It isidentical to IEC 60191-6-20:2010.The UK participation in its preparation was entrusted to Technical CommitteeEPL/47, Semi
3、conductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2010ISBN 978 0 580 64566 2ICS 31.080.01Compliance
4、 with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of the StandardsPolicy and Strategy Committee on 31 December 2010.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 60191-6-20:2010EUROPEAN
5、STANDARD EN 60191-6-20 NORME EUROPENNE EUROPISCHE NORM October 2010 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2010 CENELEC - A
6、ll rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60191-6-20:2010 E ICS 31.080.01 English version Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semicon
7、ductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010) Normalisation mcanique des dispositifs semiconducteurs - Part 6-20: Rgles gnrales pour la prparation des dessins dencombrement des botiers pour dispositifs semiconducteurs p
8、our montage en surface - Mthodes de mesure pour les dimensions des botiers sortie en J (SOJ) de faible encombrement (CEI 60191-6-20:2010) Mechanische Normung von Halbleiterbauelementen - Teil 6-20: Allgemeine Regeln fr die Erstellung von Gehusezeichnungen von SMD-Halbleitergehusen - Messverfahren fr
9、 Gehusemae von kleinen Gehusen mit J-frmigen Anschlssen (SOJ) (IEC 60191-6-20:2010) This European Standard was approved by CENELEC on 2010-10-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status
10、of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A
11、version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croat
12、ia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 60191-6-20:2010
13、EN 60191-6-20:2010 - 2 - Foreword The text of document 47D/771/FDIS, future edition 1 of IEC 60191-6-20, prepared by SC 47D, Mechanical standardization for semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 601
14、91-6-20 on 2010-10-01. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights. The following dates were fixed: latest date by which the EN has to
15、 be implemented at national level by publication of an identical national standard or by endorsement (dop) 2011-07-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2013-10-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the Int
16、ernational Standard IEC 60191-6-20:2010 was approved by CENELEC as a European Standard without any modification. _ BS EN 60191-6-20:2010- 3 - EN 60191-6-20:2010 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following refere
17、nced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common mo
18、difications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60191-4 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages EN 60191-4 - IEC 60191-6 - Mech
19、anical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages EN 60191-6 - BS EN 60191-6-20:2010 4 60191-6-20 IEC:2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-20: General rules for t
20、he preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of small outline J-lead packages (SOJ) 1 Scope This part of IEC 60191 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline f
21、orm E in accordance with IEC 60191-4. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendment
22、s) applies. IEC 60191-4, Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages IEC 60191-6, Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline
23、 drawings of surface mounted semiconductor device packages 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60191-6 apply. 4 Measuring methods 4.1 Description of measuring methods The measuring methods described in this standard are for dimension valu
24、es guaranteed to users on the basis of the following items. a) In general, measuring the dimensions shall be made with the semiconductor packages mounted on a printed circuit board as the guarantee is made to user. b) In general, measurement may be made either by hand or automatically. c) Even if a
25、measuring method deviates from the original definition of dimensions, it is defined as an alternative measuring method as long as it is equivalent in view of accuracy and can be used easily. See 4.6.3b. d) The dimensions that cannot be measured unless the package is destroyed may be calculated from
26、other dimensions or replaced by representative values. BS EN 60191-6-20:201060191-6-20 IEC:2010 5 4.2 Reference characters and outline drawings An outline drawing is given in Figure 1. 1 A n/2+1HEn/2n ED B Terminal 1 index area IEC 2258/09ALeEA2A1 IEC 2259/09 Figure 1a Top view Figure 1b Side view M
27、e Seating plane S ySSxZD A-BIEC 2260/09 Figure 1c Side view bp L2L1b2 IEC 2261/09A3LpPt M PS A-BIEC 2262/09 cc1b1 bp IEC 2263/09 Figure 1d Lead shape Figure 1e Lead side view Figure 1f Lead section b3eEel1IEC 2264/09 Figure 1g Pattern of terminal position areas Figure 1 SOJ outline drawings BS EN 60
28、191-6-20:2010 6 60191-6-20 IEC:2010 4.3 Mounting height A 4.3.1 Description Let the height of a package from the seating plane to the top of the package be denoted as the mounting height A. See Figure 2. Figure 2 Mounting height 4.3.2 Measuring method The measuring method shall be as follows. a) Put
29、 the package on the surface plate to establish the seating plane. b) From the seating plane, measure the distance to a highest point. Let the distance be denoted as the mounting height A. 4.4 Stand-off A1 4.4.1 Description Let a distance from the seating plane to the lowest point of a package be den
30、oted as the stand-off A1. See Figure 3. Figure 3 Stand-off 4.4.2 Measuring method The measuring method shall be as follows. a) Put the package on the surface plate to establish the reference surface (seating plane). b) Measure the distance from the reference surface (surface plate) to the lowest poi
31、nt of the package. Let the distance be denoted as the stand-off A1. S SIEC 2023/10 S SIEC 2024/10 BS EN 60191-6-20:201060191-6-20 IEC:2010 7 4.5 Body thickness A2 4.5.1 Description The body thickness is defined as a distance between two parallel planes. It is tangent to the highest and lowest points
32、 of the body. Let the distance be denoted as the body thickness A2. See Figure 4. Figure 4 Body thickness A2 4.5.2 Measuring method The measuring method shall be as follows. a) Put the package between vertically parallel surface plates. Never touch the leads. b) Measure the total thickness including
33、 the surface plates with a micrometer and subtract the thickness of surface plates from the total thickness so as to obtain the thickness of package. 4.5.3 Quick measuring method Measure the thickness of the package with a slide calipers along each diagonal line. Let the maximum value be denoted as
34、the body thickness A2. 4.6 Lead widths bp and b1, lead thickness c and c1 4.6.1 Description a) The outmost width bp in the range of gage height A3 from seating plane. The outmost width before surface plating shall be defined as b1. See Figures 5 and 6. b) The outmost width shall be defined as b2 exc
35、ept the range of L2 and number remaining. See Figure 6. c) The outmost thickness c in the range of gage height A3 from the seating plane. The outmost thickness before surface plating shall be defined as c1. The lead width and lead thickness, as shown in Figure 6, include burrs, crushing, and sagging
36、. Figure 5 Lead width and thickness IEC 2025/10 bp IEC 2026/10 BS EN 60191-6-20:2010 8 60191-6-20 IEC:2010 Figure 6 Measuring points of lead width and thickness 4.6.2 Measuring method The measuring method shall be as follows. a) Put the package on the surface plate to establish the reference surface
37、 (seating plane). b) Measure the lead width and thickness in Figure 5. 4.6.3 Remarks Remarks are as follows. a) b1 and c1 may be measured before lead forming. In this case, measure b1 and c1 at the specified area in Figure 5 after lead forming. b) The lead thickness may be measured at 4 points on th
38、e four corners of the package as representative values. 4.7 Soldered portion length Lp 4.7.1 Description The distance between point a and point b which are crossing points of outer surface of lead and gage plane A3. See Figure 7. Figure 7 Soldered portion length Lp L2bp IEC 2027/10 IEC 2028/10 BS EN
39、 60191-6-20:201060191-6-20 IEC:2010 9 4.7.2 Measuring method The measuring method shall be as follows. a) Put the package on the surface plate. b) Make the datum parallel with the measuring reference. c) Observe the lead toward the package side (in the seating plane direction). Measure positions of
40、points a and b as the soldered position length. 4.7.3 Remarks As this measuring method can be done from the side, the values of the leads observable from the side are allowed as representative values. 4.8 The allowable value t of the center of the soldered portion length Lp 4.8.1 Description The cen
41、ter of the soldered portion length Lp shall be located within the range t centering on the position that is at a theoretically correct distance of e1/2 from the body center. See Figure 8. Figure 8 The allowable value t of Lp center 4.8.2 Measuring method The measuring method shall be as follows. a)
42、Put the package on the surface plane to establish the reference surface (seating plane). b) Find the theoretically precise distance e1/2 from the body center. Then, check if the center of the soldered portion length Lp is within the tolerance t (range) specified as the center. 4.8.3 Remarks As this
43、measuring method can only be done from the side, the values of the leads observable from the side are allowed as representative values. ttIEC 2029/10 BS EN 60191-6-20:2010 10 60191-6-20 IEC:2010 4.9 Positional tolerance of terminal x 4.9.1 Description Let S, A denote datum as shown in the above figu
44、res. Obtain differences from the theoretical positions. Acceptable differences are defined as the tolerance at center positions of terminal. See Figure 9. Figure 9 Positional tolerance of terminal 4.9.2 Measuring method The measuring method shall be as follows. a) Put the package on the surface plat
45、e. b) Make the datum parallel with the measuring reference. c) Obtain positions of the center of leads at the bottom point. d) Obtain the differences from the theoretical center of the leads. e) Check the differences within the tolerance of lead center position. Delta x of theoretical position and a
46、ctual position is obtained from the equation below: X 2/)(maxxbb + See Figure 10. n/2+1 E HED IEC 2030/10 BS EN 60191-6-20:201060191-6-20 IEC:2010 11 Figure 10 Positional tolerance of terminals 4.10 Coplanarity y 4.10.1 Description The vertical distance from the seating plane to the lowest point of
47、each lead shall be referred to as coplanarity of the lowest surfaces of the leads. The distance up to the lowest point of the lead furthest from the seating plane shall be defined as y. 4.10.2 Measuring method The measuring method shall be as follows. a) Put the package on the surface plate. b) Obse
48、rve the lowest surfaces of all the leads from the front side of the leads to measure the vertical distances from the surface plate to the lowest surfaces. c) The maximum value of the distances shall be defined as the coplanarity y . d) Coplanarity may change because of the package warpage. In the ca
49、se of the package warpage, the larger y data shall be adopted. To avoid the seesaws case, the virtual plane method can be the measuring method. NOTE Description of virtual plane Of the geometrical planes that pass the lowest points of given 3 leads, the plane on which the lowest points of all the leads exist on the package body side should be referred to as the virtual plane. In this case, however, the center of th
