1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationIntegrated circuits Measurement of electromagnetic immunityPart 8: Measurement of radiated immunity IC stripline methodBS EN 62132-8:2012National forewordThis British Standard is
2、 the UK implementation of EN 62132-8:2012. It isidentical to IEC 62132-8:2012.The UK participation in its preparation was entrusted to Technical CommitteeEPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not
3、purport to include all the necessary provisions of acontract. Users are responsible for its correct application. The British Standards Institution 2012Published by BSI Standards Limited 2012ISBN 978 0 580 64866 3ICS 31.200Compliance with a British Standard cannot confer immunity fromlegal obligation
4、s.This British Standard was published under the authority of the StandardsPolicy and Strategy Committee on 31 October 2012.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 62132-8:2012EUROPEAN STANDARD EN 62132-8 NORME EUROPENNE EUROPISCHE NORM September 2012 CENEL
5、EC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide
6、 for CENELEC members. Ref. No. EN 62132-8:2012 E ICS 31.200 English version Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method (IEC 62132-8:2012) Circuits intgrs - Mesure de limmunit lectromagntique - Partie 8: Mesure de lim
7、munit rayonne - Mthode de la ligne TEM plaques pour circuit intgr (CEI 62132-8:2012) Integrierte Schaltungen - Messung der elektromagnetischen Strfestigkeit - Teil 8: Messung der Strfestigkeit bei Einstrahlungen - IC-Streifenleiterverfahren (IEC 62132-8:2012) This European Standard was approved by C
8、ENELEC on 2012-08-10. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national stan
9、dards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own langua
10、ge and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France
11、, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 62132-8:2012EN 62132-8:2012 - 2 - Foreword The text of document 47A/882/
12、FDIS, future edition 1 of IEC 62132-8, prepared by SC 47A, “Integrated circuits“, of IEC TC 47, “Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 62132-8:2012. The following dates are fixed: latest date by which the document has to be implemented at
13、 national level by publication of an identical national standard or by endorsement (dop) 2013-05-10 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2015-08-10 This standard is to be used in conjunction with EN 62132-1. Attention is drawn to the po
14、ssibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 62132-8:2012 was approved by CENELEC as a European S
15、tandard without any modification. BS EN 62132-8:2012- 3 - EN 62132-8:2012 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispens
16、able for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
17、 EN/HD applies. Publication Year Title EN/HD Year IEC 60050 Series International Electrotechnical Vocabulary - - IEC 61000-4-20 2010 Electromagnetic compatibility (EMC) - Part 4-20: Testing and measurement techniques - Emission and immunity testing in transverse electromagnetic (TEM) waveguides EN 6
18、1000-4-20 2010 IEC 62132-1 2006 Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 1: General conditions and definitions EN 62132-1 + corr. November 2006 2006 BS EN 62132-8:2012 2 62132-8 IEC:2012 CONTENTS 1 Scope . 6 2 Normative references . 6 3 Terms and definit
19、ions . 6 4 General 7 5 Test conditions . 7 5.1 General . 7 5.2 Supply voltage. 8 5.3 Frequency range . 8 6 Test equipment . 8 6.1 General . 8 6.2 Cables . 8 6.3 Shielding . 8 6.4 RF disturbance generator 8 6.5 IC stripline . 8 6.6 50 termination 8 6.7 DUT monitor 8 7 Test setup 9 7.1 General . 9 7.2
20、 Test configuration 9 7.3 EMC test board (PCB) . 9 8 Test procedure . 9 8.1 General . 9 8.2 Operational check . 10 8.3 Immunity measurement . 10 8.3.1 General . 10 8.3.2 RF disturbance signal 10 8.3.3 Test frequency steps and ranges . 10 8.3.4 Test levels and dwell time . 10 8.3.5 DUT monitoring . 1
21、0 8.3.6 Detail procedure 11 9 Test report 11 10 RF immunity acceptance level 11 Annex A (normative) Field strength determination 12 Annex B (normative) IC stripline descriptions . 15 Annex C (informative) Closed stripline geometrical limitations . 18 Bibliography 22 Figure 1 IC stripline test setup
22、. 9 Figure A.1 Definition of height (h) and width (w) of IC stripline . 12 Figure A.2 EM field distribution 13 Figure B.1 Cross section view of an example of an open IC stripline 15 Figure B.2 Cross section view of an example of a closed IC stripline . 16 BS EN 62132-8:201262132-8 IEC:2012 3 Figure
23、B.3 Example of IC stripline with housing . 17 Figure C.1 Calculated H-field reduction of closed version referenced to referring open version as a function of portion of active conductor width of closed version to open version . 20 Figure C.2 Location of currents and mirrored currents at grounded pla
24、nes used for calculation of fields . 21 Table 1 Frequency step size versus frequency range . 10 Table B.1 Maximum DUT dimensions for 6,7 mm IC stripline (Open version) . 16 Table B.2 Maximum DUT dimensions for 6,7 mm IC stripline (Closed version) . 16 Table C.1 Height of shielding, simulated at hbot
25、tom= 6,7mm to achieve practically 50 system . 19 BS EN 62132-8:2012 6 62132-8 IEC:2012 INTEGRATED CIRCUITS MEASUREMENT OF ELECTROMAGNETIC IMMUNITY Part 8: Measurement of radiated immunity IC stripline method 1 Scope This part of IEC 62132 specifies a method for measuring the immunity of an integrate
26、d circuit (IC) to radio frequency (RF) radiated electromagnetic disturbances over the frequency range of 150 kHz to 3 GHz. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references,
27、 only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60050 (all parts), International Electrotechnical Vocabulary (available at http:/www.electropedia.org) IEC 62132-1:2006, Integrated circuits Measurement of e
28、lectromagnetic immunity, 150 kHz to 1 GHz Part 1: General conditions and definitions IEC 61000-4-20, Electromagnetic compatibility (EMC) Part 4-20: Testing and measurement techniques Emission and immunity testing in transverse electromagnetic (TEM) waveguides 3 Terms and definitions For the purpose
29、of this document, the terms and definitions given in IEC 62132-1:2006, Clause 3, IEC 60050-131 and IEC 60050-161, and the following, apply. 3.1 transverse electromagnetic mode TEM waveguide mode in which the components of the electric and magnetic fields in the propagation direction are much less th
30、an the primary field components across any transverse cross-section Note 1 to entry: This note only applies to the French language. 3.2 TEM waveguide open or closed transmission line system, in which a wave is propagating in the transverse electromagnetic mode to produce a specified field for testin
31、g purposes 3.3 IC stripline TEM waveguide, consisting of an active conductor placed on a defined spacing over an enlarged ground plane, connected to a port structure on each end and an optional shielded enclosure BS EN 62132-8:201262132-8 IEC:2012 7 Note 1 to entry: This arrangement guides a wave pr
32、opagation in the transverse electromagnetic mode to produce a specific field for testing purposes between the active conductor and the enlarged ground plane. The ground plane of the standard EMC test board according to IEC 62132-1:2006, Annex B, should be used. An optional shielding enclosure may be
33、 used for fixing the IC stripline configuration and for shielding purposes. This leads to a closed version of the IC stripline in opposite to the open version without shielding enclosure. For further information see Annex A. 3.4 two-port TEM waveguide TEM waveguide with input/output measurement port
34、s at both ends 3.5 characteristic impedance magnitude of the ratio of the voltage between the active conductor and the corresponding ground plane to the current on either conductor for any constant phase wave-front Note 1 to entry: The characteristic impedance is independent of the voltage/current m
35、agnitudes and depends only on the cross sectional geometry of the transmission line. TEM waveguides are typically designed to have a 50 characteristic impedance. For further information and equation to stripline arrangements see Annex A. 3.6 primary field component primary component electric field c
36、omponent aligned with the intended test polarization Note 1 to entry: For example, in IC stripline, the active conductor is parallel to the horizontal floor, and the primary mode electric field vector is vertical at the transverse centre of the IC stripline. 4 General An IC to be evaluated for EMC p
37、erformance is referred to as a device under test (DUT). The DUT should be mounted on an EMC test board according to IEC 62132-1. The EMC test board is provided with the appropriate measurement or monitoring points at which the DUT response parameters can be measured. It controls the geometry and ori
38、entation of the DUT relative to the active conductor and eliminates in the case of a closed version of the IC stripline any connecting leads within the housing (these are on the backside of the board, which is outside the housing). For the IC stripline, one of the 50 ports is terminated with a 50 lo
39、ad. The other 50 port is connected to the output of an RF disturbance generator. The injected RF disturbance signal exposes the DUT to an electromagnetic field determined by the injected power, the typical impedance and the distance between the ground plane of the EMC test board and the active condu
40、ctor of the IC stripline. The relationship is given in Annex A. Rotating the EMC test board in the four possible orientations in the aperture to accept EMC test board of the IC stripline will affect the sensitivity of the DUT. Dependent upon the DUT, the response parameters of the DUT may vary (e.g.
41、 a change of current consumption, deterioration in function performance, waveform jitter). The intent of this test method is to provide a quantitative measure of the RF immunity of DUTs for comparison or other purposes. For further information see Annex A. 5 Test conditions 5.1 General The test cond
42、itions shall meet the requirements as described in IEC 62132-1:2006, Clause 4. In addition, the following test conditions shall apply. BS EN 62132-8:2012 8 62132-8 IEC:2012 5.2 Supply voltage The supply voltage shall be as specified by the IC manufacturer. If the users of this procedure agree to oth
43、er values, they shall be documented in the test report. 5.3 Frequency range The effective frequency range of this radiated immunity procedure is 150 kHz to 3 GHz. 6 Test equipment 6.1 General The test equipment shall meet the requirements described in IEC 62132-1:2006, Clause 5. In addition, the fol
44、lowing test equipment requirements shall apply. 6.2 Cables Double shielded or semi-rigid coaxial cable may be required depending on the local ambient conditions. 6.3 Shielding Testing in a shielded room is only necessary for the open IC stripline version. The closed version of the IC stripline is sh
45、ielded by its housing. 6.4 RF disturbance generator An RF disturbance generator with sufficient power handling capabilities shall be used. The RF disturbance generator may comprise an RF signal source with a modulation function, an RF power amplifier. The voltage standing wave ratio (VSWR) at the ou
46、tput of the RF disturbance generator shall be less than 1,5 over the frequency range being measured. The gain (or attenuation) of the RF disturbance generating equipment, without the IC stripline, shall be known with an accuracy 0,5 dB. 6.5 IC stripline The IC stripline (open or closed version) used
47、 for this test procedure shall be fitted with an aperture to mate with the EMC test board. The IC stripline shall not exhibit higher order modes over the frequency range being measured. For this procedure, the IC stripline frequency range is 150 kHz to 3 GHz. The VSWR over the frequency range of the
48、 empty IC stripline being measured shall be less than 1,25. For further information as to field strength determination, IC stripline designs and the limitation of geometrical dimensions of closed version, see Annexes A, B and C. 6.6 50 termination A 50 termination with a VSWR less than 1,1 and suffi
49、cient power handling capabilities over the frequency range of measurement is recommended for the IC stripline 50 port not connected to the RF disturbance generator. 6.7 DUT monitor The performance of the DUT shall be monitored for indications of performance degradation. The monitoring equipment shall not be adversely affected by the injected RF disturbance signal. BS EN 62132-8:201262132-8 IEC:2012 9 7 Test setup 7.1 General A test setup shall meet th
